IP Library Granted Patent US 12669539
Granted Patent B2
US 12669539 · App. 18/603,951 · Granted Jun 30, 2026

Defect detection module

Inventors: Yue-Der Lin (Taichung City, TW); Yin-Sheng Chen (Taichung City, TW)
Assignee: Feng Chia University
G01R31/312G01R31/2841
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Quick Facts
Patent No.
US 12669539
App. No.
18/603,951
Granted
Jun 30, 2026
Kind
B2
Abstract

A defect detection module comprises a signal emitting module, a transmitting electrode, a receiving electrode, and a signal processing module. The signal emitting module of the present invention emits a first signal. The first signal passes through the transmitting electrode, a medium and the receiving electrode to generate a second signal. The transmitting electrode, the medium and the receiving electrode forms a capacitance value corresponding to the medium which may be solid or comprising air. The signal processing module processes the second signal to obtain a detection result.

Claims (15)

1 . A defect detection module comprising a signal emitting module, a transmitting electrode, a receiving electrode, and a signal processing module; wherein;

the signal emitting module generates a first signal;

the receiving electrode spaced apart from the transmitting electrode;

a substrate comprising glass, silicon, or a combination thereof, the substrate having a through hole, a partially through hole or a non-through hole formed therein;

a medium disposed within the through hole or the non-through hole and between the transmitting electrode and the receiving electrode, the medium including air, the substrate material, or a combination thereof;

wherein the first signal is capacitively coupled from the transmitting electrode, through the medium, to the receiving electrode to generate a second signal; wherein:

the transmitting electrode, the medium and the receiving electrode have an equivalent capacitance; and

the signal processing module which processes and optimizes the second signal to obtain a detection result by discriminating a defect within the medium based on differences in dielectric properties of the medium; and the defect is detected without physical contact between the transmitting electrode, the receiving electrode, and the medium.

2 . The defect detection module according to claim 1 , wherein the signal processing module comprises a high-pass filter through which the second signal passes through the high-pass filter.

3 . The defect detection module according to claim 1 , wherein the signal emitting module generates the first signal as a square wave signal, and the signal processing module includes a filtering.

4 . The defect detection module according to claim 1 , wherein a signal processing circuit is used to isolate a capacitive electrodes of the transmitting electrode.

5 . The defect detection module according to claim 2 , wherein a signal processing circuit is used to isolate a capacitive electrodes of the transmitting electrode.

6 . The defect detection module according to claim 1 , wherein further comprising a computer operatively coupled to the signal processing module for recognizing, classifying, or summarizing the detection result.

7 . The defect detection module according to claim 1 , wherein the transmitting electrode and the receiving electrode are capacitive electrodes.

8 . The defect detection module according to claim 1 , wherein the defect detection module is configured in multiple arrays for detecting the medium; or the defect detection module scans the medium stepwise in an X-Y axis direction.