Photonic integrated circuit packaging architectures
Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active surface and an opposing backside, and wherein the PIC is embedded in the insulating material with the active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer and the second layer includes the insulating material, wherein the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; and an optical component optically coupled to the active surface of the PIC and extending through the insulating material in the second layer.
1 . A photonic assembly, comprising:
a composite die having a plurality of layers;
a photonic integrated circuit (PIC) in a first layer of the plurality of layers including a first insulating material, wherein the PIC has an active surface and an opposing backside, and wherein the PIC is embedded in the first insulating material with the active surface facing up;
a conductive pillar in the first layer;
an integrated circuit (IC) in a second layer of the plurality of layers, wherein the second layer is on the first layer and the second layer includes a second insulating material, wherein the IC is embedded in the second insulating material in the second layer, wherein the second insulating material is different than the first insulating material, and wherein the IC is conductively coupled to the active surface of the PIC and the conductive pillar; and
an optical component, embedded in the second insulating material in the second layer, optically coupled to the active surface of the PIC, and extending through the second insulating material in the second layer.
2 . The photonic assembly of claim 1 , wherein the optical component is a glass block, a waveguide, a fiber array block, or a pass-through structure.
3 . The photonic assembly of claim 1 , wherein the optical component is a first optical component, and the photonic assembly further comprising:
a second optical component optically coupled to the first optical component.
4 . The photonic assembly of claim 3 , wherein the first optical component is a glass block and the second optical component is a glass block, a fiber array block, a waveguide, a laser written waveguide, a lens array, a pass-through structure, or a composite optical component.
5 . The photonic assembly of claim 3 , further comprising:
a third optical component optically coupled to the second optical component.
6 . The photonic assembly of claim 5 , wherein the third optical component is an optical lens.
7 . The photonic assembly of claim 1 , further comprising:
a bridge die in the first layer conductively coupled to the IC.
8 . The photonic assembly of claim 7 , further comprising:
a processor circuit in the second layer conductively coupled to the bridge die.
9 . A photonic assembly, comprising:
a composite die having a plurality of layers;
an integrated circuit (IC) in a first layer of the plurality of layers including an insulating material, wherein the IC is embedded in the insulating material;
a photonic integrated circuit (PIC), having an active surface, in a second layer of the plurality of layers, wherein the second layer is on the first layer, the second layer includes the insulating material, and the PIC is embedded in the insulating material with the active surface facing the first layer and coupled to the IC by an interconnect;
an optical component, embedded in the insulating material in the second layer, optically coupled to the active surface of the PIC, and extending through the insulating material in the first layer; and
wherein the insulating material includes a first insulating material in the first layer and a second insulating material, in the second layer, different than the first insulating material.
10 . The photonic assembly of claim 9 , wherein the optical component is a glass block, a waveguide, a fiber array block, or a pass-through structure.
11 . The photonic assembly of claim 9 , wherein the IC includes a first surface and an opposing second surface and the second layer is at the second surface of the IC, and the photonic assembly further comprising:
a package substrate coupled to the first surface of the IC, wherein the package substrate includes an aperture and the optical component is aligned with the aperture.
12 . The photonic assembly of claim 11 , further comprising:
a heat transfer structure embedded in the package substrate.
13 . The photonic assembly of claim 9 , wherein the PIC includes a backside surface opposite the active surface, and the photonic assembly further comprising:
a heat transfer structure at the backside surface of the PIC.
14 . The photonic assembly of claim 9 , wherein the optical component is a first optical component, and the photonic assembly further comprising:
a second optical component optically coupled to the first optical component.
15 . The photonic assembly of claim 14 , wherein the first optical component is a glass block and the second optical component is a glass block, a waveguide, a fiber array block, or a pass-through structure.
16 . The photonic assembly of claim 14 , further comprising:
a third optical component optically coupled to the second optical component.
17 . The photonic assembly of claim 16 , wherein the third optical component is an optical lens.