Smart card
Provided is a smart card that can improve the adhesive strength of the IC chip module even under low pressure, and can prevent deformation of the card by increasing the flowability of the conductive adhesive. The smart card includes a card body 2 with an antenna coil 3 built in, and an IC chip module 4 provided with an antenna connection terminal 5 for conductive connection with the antenna coil 3 , the IC chip module 4 being housed in an accommodating recess 6 in the card body 2 , wherein the antenna coil 3 and the antenna connection terminal 5 are conductively connected via a conductive adhesive 9 in which conductive particles 8 are blended with binder resin 7 , and the antenna connection terminal 5 has an opening 10 with a width larger than the average particle diameter of the conductive particles 8.
1 . A smart card, comprising:
a card body with an antenna coil built in; and
an IC chip module comprising an antenna connection terminal for conductive connection with the antenna coil, the IC chip module being housed in an accommodating recess in the card body, wherein
the antenna coil and the antenna connection terminal are conductively connected via a conductive adhesive in which conductive particles are blended with binder resin, and
the antenna connection terminal has an opening with a width larger than the average particle diameter of the conductive particles.
2 . The smart card according to claim 1 , wherein the opening is a slit and/or a hole.
3 . The smart card according to claim 1 , wherein a longitudinal direction of the opening is different from a wiring direction of the antenna coil.
4 . The smart card according to claim 1 , wherein a pattern of the opening is a symmetrical pattern in plan view of the antenna connection terminal.
5 . The smart card according to claim 1 , wherein the width of the opening is 100 μm or more and 300 μm or less.
6 . The smart card according to claim 1 , wherein an overlapping area Y shared by the antenna connection terminal and the antenna coil, and a particle area ratio X, which is the area ratio of the total area of the conductive particles within the area of the conductive adhesive, satisfy the following relationship:
Y
(
μm
2
)
≥
-
16
,
000
X
+
580
,
000
,
and
X
(
%
)
=
(
total
particle
area
(
mm
2
)
/
conductive
adhesive
area
(
mm
2
)
)
×
100.
7 . The smart card according to claim 6 that also satisfies the following condition:
X
(
%
)
≥
3.
.
8 . A method for manufacturing a smart card, comprising:
a step of preparing a card body with an antenna coil built in, and an IC chip module provided with an antenna connection terminal for conductive connection with the antenna coil, the IC chip module to be housed in an accommodating recess in the card body;
a step of housing the IC chip module in the accommodating recess via a conductive adhesive in which conductive particles are blended with binder resin; and
a step of heating and pressing the IC chip module to fix the IC chip module in the accommodating recess and conductively connect the antenna coil and the antenna connection terminal, wherein
the antenna connection terminal has an opening with a width larger than the average particle diameter of the conductive particles.
9 . A method for manufacturing a smart card according to claim 8 , wherein the conductive adhesive film is a film which is laminated to the IC chip module, and then the IC chip module is housed in the accommodating recess.