Substrate analysis system, substrate analysis method, and recording medium

1 . A substrate analysis system, comprising:

an imaging unit configured to image a substrate surface;

a defect region estimation unit configured to estimate a defect region, where a defect exists on the substrate surface, based on an imaging result of the imaging unit;

a gray value acquisition unit configured to, after the defect region is estimated by the defect region estimation unit, acquire multiple gray values within the defect region when light is radiated to the substrate surface; and

a defect type determination unit configured to identify a type of the defect within the defect region based on the acquired gray values.

2 . The substrate analysis system of claim 1 ,

wherein the gray value acquisition unit acquires the multiple gray values respectively corresponding to multiple wavelengths of the light in the defect region, and

the defect type determination unit determines the defect type based on the gray values respectively corresponding to the multiple wavelengths.

3 . The substrate analysis system of claim 2 ,

wherein the defect type determination unit determines the defect type based on a change tendency between the multiple gray values respectively corresponding to the multiple wavelengths.

4 . The substrate analysis system of claim 1 ,

wherein when multiple regions in which distributions of the multiple gray values are different from each other exist in the single defect region, the defect type determination unit determines the defect type for each of the multiple regions.

5 . The substrate analysis system of claim 1 , further comprising:

a factor estimation unit configured to estimate a defect-causing factor in a previous process based on the defect type determined by the defect type determination unit.

6 . A substrate analysis method, comprising:

imaging a substrate surface;

estimating a defect region, where a defect exists on the substrate surface, based on an imaging result in the imaging of the substrate surface;

after the defect region is estimated, acquiring multiple gray values within the defect region when light is radiated to the substrate surface; and

identifying a type of the defect within the defect region based on the acquired multiple gray values.

7 . The substrate analysis method of claim 6 ,

wherein the multiple gray values respectively corresponding to multiple wavelengths of the light in the defect region are acquired in the acquiring of the multiple gray values, and

the defect type is determined based on the multiple gray values respectively corresponding to the multiple wavelengths in the determining of the defect type.

8 . The substrate analysis method of claim 7 ,

wherein the defect type is determined based on a change tendency between the multiple gray values respectively corresponding to the multiple wavelengths in the determining of the defect type.

9 . The substrate analysis method of claim 6 ,

wherein when multiple regions in which distributions of the multiple gray values are different from each other exist in the single defect region, the defect type is determined for each of the multiple regions in the determining of the defect type.

10 . The substrate analysis method of claim 6 , further comprising:

estimating a defect-causing factor in a previous process based on the defect type determined in the determining of the defect type.

11 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause an apparatus to perform a substrate analysis method as claimed in claim 6 .