Component with protective surface for processing chamber
A component for use inside a semiconductor chamber with a laser textured surface facing a vacuum region inside the semiconductor chamber is provided.
1 . A component for use inside a semiconductor chamber, comprising:
a laser textured surface facing a vacuum region inside the semiconductor chamber; and
a protective layer disposed on the laser textured surface, wherein the laser textured surface increases adhesion of the protective layer, wherein the laser textured surface has a laser texture pattern defining plateaus surrounded by laser line forming an adhesion propagation angle in a range between 45° and 120°, wherein the laser textured surface and plateaus are the same material formed in the same manner as a single part.
2 . The component, as recited in claim 1 , wherein the laser textured surface has a depth of damage of less than 0.5 micrometers.
3 . The component, as recited in claim 1 , wherein the plateaus have a length in a range of about 10 nm to 600 μm.
4 . The component, as recited in claim 3 , wherein the laser lines comprise a plurality of cross-hatched parallel lines spaced apart by a distance of between about 10 nm to 600 μm.
5 . The component, as recited in claim 1 , wherein at least 90% of the laser textured surface has an adhesion crack length of less than 500 μm.
6 . The component, as recited in claim 1 , wherein the plateaus have a length in a range of about 100 μm to 500 μm.
7 . The component, as recited in claim 1 , wherein the protective layer has a thickness greater than a depth of the laser lines.
8 . The component, as recited in claim 1 , wherein the protective layer completely fills the laser lines.