Antenna module

1 . An antenna module, comprising:

a radiation pattern that functions as an antenna;

a base layer disposed on one side of the radiation pattern and implemented by stacking a plurality of low-temperature co-fired ceramic (LTCC) substrates to have a connection pattern, including a power feeding via electrode vertically penetrating the plurality of LTCC substrates, electrically connected to the radiation pattern;

a grounding via electrode that vertically penetrates at least two of the plurality of LTCC substrates, is spaced apart from the power feeding via electrode in the horizontal direction to be electrically insulated from the power feeding via electrode, and is formed to surround all surfaces of at least a portion of the power feeding via electrode in a concentric structure;

an RF chipset electrically connected to the radiation pattern through the connection pattern to generate an RF signal to be transmitted to the radiation pattern or to process an RF signal received from the antenna;

a thermal interface material (TIM) disposed at one side of the RF chipset to transfer heat generated from the RF chipset;

a heat sink disposed at one side of the TIM to spread heat transferred from the TIM; and

a fan disposed at one side of the heat sink to cool the heat sink by introducing outside air.

2 . The antenna module of claim 1 , wherein the grounding via electrode is disposed to be spaced apart from the radiation pattern in a lower direction of a location of the radiation pattern, and is not provided at an uppermost LTCC substrate of the base layer.

3 . The antenna module of claim 1 , wherein the grounding via electrode is disposed to be spaced apart from the RF chipset in an upper direction of a location of the RF chipset, and is not provided at a bottommost LTCC substrate of the base layer.

4 . The antenna module of claim 1 , wherein:

the power feeding via electrode comprises first and second power feeding via electrodes each passing through a plurality of different LTCC substrates among the base layer,

the first and second power feeding via electrodes are spaced apart from each other, and

the connection pattern further comprises a redistribution layer electrically connecting the first and second power feeding via electrodes.

5 . The antenna module of claim 4 , wherein the grounding via electrode is disposed to be spaced apart from the redistribution layer in an upper and lower direction of a location of the redistribution layer, and is not provided in LTCC substrates in contact with upper and lower portions of a LTCC substrate having the redistribution layer.

6 . The antenna module of claim 4 , wherein:

the grounding via electrode comprises a first grounding via electrode and a second grounding via electrode,

the first grounding via electrode is disposed to be spaced apart from the redistribution layer in an upper direction of the redistribution layer,

at least a portion of the first grounding via electrode is provided in a LTCC substrate having the redistribution layer and a LTCC substrate in contact with an upper portion of the LTCC substrate having the redistribution layer, and

the second grounding via electrode is disposed to be spaced apart from the redistribution layer in a lower direction of the redistribution layer, and

at least a portion of the second grounding via electrode is provided in a LTCC substrates in contact with a lower portions of the LTCC substrate having the redistribution layer.

7 . The antenna module of claim 1 , further comprising a grounding member provided in at least one of LTCC substrates having a grounding via electrode, and electrically connecting the grounding via electrode to a ground.

8 . The antenna module of claim 1 , wherein the radiation pattern emits millimeter wave (mmWave) radio waves.