Heterogeneous antenna in fan-out package
A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.
1 . A package comprising:
a device die;
an antenna substrate over the device die and comprising:
a dielectric core;
a first dielectric layer over the dielectric core; and
a second dielectric layer underlying the dielectric core, wherein edges of the dielectric core, the first dielectric layer, and the second dielectric layer are vertically aligned;
an antenna electrically coupling to the device die, the antenna comprising:
a first portion in the antenna substrate; and
a second portion in a region lower than the device die; and
an encapsulant encapsulating the device die therein, wherein the encapsulant contacts the antenna substrate.
2 . The package of claim 1 further comprising a solder region contacting the first portion of the antenna.
3 . The package of claim 1 , wherein the encapsulant contacts the antenna substrate to form a vertical interface.
4 . The package of claim 1 , wherein the edges of the dielectric core, the first dielectric layer, and the second dielectric layer are vertically aligned to an additional edge of the encapsulant.
5 . The package of claim 1 , wherein the antenna substrate further comprises:
a first electrically-conductive feature penetrating through the dielectric core, wherein the first electrically-conductive feature is electrically floating.
6 . The package of claim 5 , wherein the antenna substrate further comprises:
a second electrically-conductive feature overlying and contacting the first electrically-conductive feature; and
a third electrically-conductive feature underlying and contacting the first electrically-conductive feature.
7 . The package of claim 1 , wherein the first portion of the antenna comprises:
a top part in the first dielectric layer, wherein the top part is electrically conductive.
8 . The package of claim 7 , wherein the first portion of the antenna further comprises:
a bottom part in the second dielectric layer, wherein the bottom part is electrically conductive.
9 . The package of claim 1 , wherein the device die comprises a Radio-Frequency Integrated Circuit (RFIC) die, and wherein the RFIC die is electrically coupled to the antenna.
10 . The package of claim 1 , wherein the encapsulant comprises:
a first part between the first portion and the second portion of the antenna; and
a second part higher than a bottom surface of the antenna substrate, wherein the first part and the second part of the encapsulant are formed of a same material, and the first part is continuously joined to the second part.
11 . A package comprising:
a molding compound comprising a first edge;
a device die in the molding compound;
a redistribution structure underlying and electrically coupling to the device die, wherein the redistribution structure comprises:
a plurality of dielectric layers comprising second edges vertically aligned to the first edge; and
a plurality of redistribution lines comprising some portions in the plurality of dielectric layers, wherein the redistribution structure comprises a first part of an antenna; and
an antenna substrate over a part of the molding compound, wherein a third edge of the antenna substrate is vertically misaligned from the first edge and the second edges, and wherein the antenna substrate comprises a second part of the antenna.
12 . The package of claim 11 , wherein the antenna substrate comprises:
a dielectric core, wherein the second part of the antenna is in contact with one of a top surface and a bottom surface of the dielectric core.
13 . The package of claim 12 , wherein the antenna substrate further comprises:
a first dielectric mask layer over the dielectric core; and
a second dielectric mask layer underlying the dielectric core, wherein edges of the first dielectric mask layer, the second dielectric mask layer, and the dielectric core are vertically aligned, and form the third edge of the antenna substrate.
14 . The package of claim 13 , wherein the edges of the first dielectric mask layer, the second dielectric mask layer, and the dielectric core are in contact with the molding compound to form a vertical interface.
15 . The package of claim 11 , wherein the redistribution structure comprises:
a feed line of the antenna; and
a reflector of the antenna.
16 . The package of claim 11 further comprising a thermal dissipation path in the antenna substrate, wherein the thermal dissipation path is electrically conductive, and is electrically floating.
17 . A package comprising:
a molding compound;
a device die in the molding compound;
an antenna substrate over a first portion of the molding compound, the antenna substrate comprising:
a dielectric plate;
a first metal layer over the dielectric plate; and
a second metal layer under the dielectric plate;
an antenna comprising:
a first part in one of the first metal layer and the second metal layer; and
a second part underlying the molding compound; and
a solder region electrically coupling to the antenna substrate and the device die, wherein the solder region comprises a part in the molding compound.
18 . The package of claim 17 , wherein the molding compound further comprises a second portion forming a vertical interface with the antenna substrate.
19 . The package of claim 17 further comprising a dielectric layer underlying the device die, wherein the second part of the antenna is in the dielectric layer, and wherein the dielectric layer comprises a first edge flush with a second edge of the molding compound.
20 . The package of claim 17 , wherein the antenna substrate extends laterally beyond the device die.