Microstructured field effect device
A microstructured device is disclosed utilizing Coulomb field modification of surface energy and electroadhesion to localize a device surface or to levitate a device surface with respect to a target surface. The surface energy modification can be permanent or reversible depending on whether the charge is externally delivered to the device or derived on the device galvanically. The microstructure aspect of the device induces various hydrophilic/hydrophobic interactions with the target surface. The Coulomb field can be used to enhance or decrease the hydrophilic/hydrophobic interactions. In combination, the disclosed electro-microstructured device provides for localizing implants in a mammalian body, and additionally means for controlling cell interaction with the implant.
1 . An electro-microstructured device comprising:
a substrate having a hierarchical microstructure disposed thereon, the substrate having a thickness;
the hierarchical microstructure having a first microfeature, wherein the first microfeature includes a surface wherein a plurality of second microfeatures are disposed about the surface of the first microfeature; and
at least one electrode capable of generating an electroadhesive state via Wenzel-Cassie wetting domains of the hierarchical microstructure, wherein the at least one electrode is connected to a charge source and configured to operate at a charge from +0.5V to −0.5V, the at least one electrode having a first portion at least partially embedded within the thickness of the substrate and a second portion at least partially embedded within an interior of the first microstructure.
2 . The electro-microstructured device of claim 1 , wherein the first microfeature comprises conical pillars, the surface of the first microfeatures further comprising ridges.
3 . The electro-microstructured device of claim 1 , wherein the second portion of the at least one electrode is embedded within a portion of the interior of the first microfeature and a portion of the plurality of second microfeatures.
4 . The electro-microstructured device of claim 3 , wherein the second portion of the at least one electrode is arranged in a spiral configuration.
5 . The electro-microstructured device of claim 4 , wherein the spiral configuration is uniform or tapers outward as the diameter of the conical pillar increases.
6 . The electro-microstructured device of claim 1 , wherein a local charge of the at least one electrode produces an electric field on a micrometer scale.
7 . The electro-microstructured device of claim 1 , wherein the at least one electrode comprises a first electrode and second electrode, the first and second electrodes each embedded within the thickness of the substrate, the first electrode configured to generate a positive charge, and the second electrode configured to generate a negative charge, and wherein the first and second electrodes are adjacent to each other.
8 . The electro-microstructured device of claim 1 , wherein the first microfeature has a height of 100 microns or less and a diameter of 20 microns or less.
9 . The electro-microstructured device of claim 1 wherein the plurality of second microfeatures have a height of 5 microns or less and a diameter of 2 microns or less.
10 . The electro-microstructured device of claim 1 , wherein the substrate further comprises at least a portion that is hydrophobic, and wherein the at least one electrode is arranged with the hierarchical microstructure to alter the substrate portion that is hydrophobic to a portion that is hydrophilic when the at least one electrode is charged.
11 . The electro-microstructured device of claim 1 , wherein the substrate further comprises at least a portion that is hydrophilic, and wherein the at least one electrode is arranged with the hierarchical microstructure to alter the substrate portion that is hydrophilic to a portion that is hydrophobic when the at least one electrode is charged.
12 . The electro-microstructured device of claim 1 , wherein the substrate is a dielectric.
13 . The electro-microstructured device of claim 7 , wherein the space between the adjacent first and second electrodes includes an electric insulator.
14 . An electro-microstructured device comprising:
a substrate having a thickness, and including a hierarchical microstructure disposed thereon, wherein the hierarchical microstructure includes a layer of metallic particulates disposed thereon;
the hierarchical microstructure having a first microfeature, the first microfeature comprising conical pillars;
the first microfeature having a surface wherein a plurality of second microfeatures are disposed about the surface of the first microfeature; and
at least one electrode, the at least one electrode at least partially embedded within the thickness of the substrate, and wherein charging the at least one electrode generates an electroadhesive state via Wenzel-Cassie wetting domains, wherein the at least one electrode is connected to a charge source and configured to operate at a charge from +0.5V to −0.5V.
15 . The electro-microstructured device of claim 14 , wherein the conical pillars further comprise ridges.
16 . The electro-microstructured device of claim 14 , wherein the first microfeature has a height of 100 microns or less and a diameter of 20 microns or less.
17 . The electro-microstructured device of claim 14 , wherein the plurality of second microfeatures have a height of 5 microns or less and a diameter of 2 microns or less.
18 . The electro-microstructured device of claim 14 , wherein the metallic particulates have a diameter ranging between 0.1 to 1.0 microns.
19 . The electro-microstructured device of claim 14 wherein the hierarchical microstructure further includes two distinct microstructure regions, a first region wherein the metallic particulates comprise zinc, and a second region wherein the metallic particulates comprise silver.
20 . The electro-microstructured device of claim 14 , wherein the hierarchical microstructure further includes two distinct microstructure regions, a first region wherein the metallic particulates comprise zinc, and a second region wherein the metallic particulates comprise gold.