IP Library › Granted Patent US 12672227

Granted Patent B2

US 12672227 · App. 18/658,450 · Granted Jun 30, 2026

Wiring circuit board and method of producing the wiring circuit board

Inventors: Tomoaki Tanaka (Osaka, JP); Hayato Takakura (Osaka, JP); Ryosuke Sasaoka (Osaka, JP)

Assignee: NITTO DENKO CORPORATION

H05K1/0219 H05K3/18 H05K1/028 H05K2203/0723

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Quick Facts

Patent No.: US 12672227
App. No.: 18/658,450
Granted: Jun 30, 2026
Kind: B2

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Abstract

A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire. The wire is made of a first conductive layer, and the shield pattern is made of a second conductive layer.

Claims (53)

1 . A wiring circuit board comprising:

an insulating layer;

a wiring pattern disposed at one side of the insulating layer in a thickness direction of the insulating layer and including a terminal and a wire connected with the terminal; and

a shield pattern disposed at the one side of the insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire,

wherein the wire is made of a first conductive layer,

wherein the shield pattern is made of a second conductive layer, and

wherein the shield pattern has a thickness different from a thickness of the wire.

2 . The wiring circuit board according to claim 1 , wherein the terminal includes:

a first layer disposed at the one side of the insulating layer in the thickness direction and made of the first conductive layer; and

a second layer disposed at one side of the first layer in the thickness direction and made of the second conductive layer.

3 . The wiring circuit board according to claim 1 , wherein the terminal includes:

a first layer disposed at the one side of the insulating layer in the thickness direction and made of the second conductive layer; and

a second layer disposed at one side of the first layer in the thickness direction and made of the first conductive layer.

4 . The wiring circuit board according to claim 1 , wherein the second conductive layer is thicker than the first conductive layer.

5 . The wiring circuit board according to claim 1 , wherein the first conductive layer is thicker than the second conductive layer.

6 . The wiring circuit board according to claim 1 ,

wherein the wiring circuit board includes:

a frame portion on which the terminal is disposed; and

a flexible portion which is connected with the frame portion and more flexible than the frame portion, and on which the wire is disposed,

wherein the shield pattern is disposed on the frame portion and is not disposed on the flexible portion.

7 . The wiring circuit board according to claim 1 , further comprising:

a metal supporting layer disposed at the other side of the insulating layer in the thickness direction.

8 . The wiring circuit board according to claim 7 , wherein the shield pattern is electrically connected with the metal supporting layer.

9 . A method of producing the wiring circuit board according to claim 1 , the method comprising:

a wire formation step of forming the wire at the one side of the insulating layer in the thickness direction; and

a shield pattern formation step of forming the shield pattern at the one side of the insulating layer in the thickness direction.

10 . A wiring circuit board comprising:

an insulating layer;

a wiring pattern disposed at one side of the insulating layer in a thickness direction of the insulating layer and including a terminal and a wire connected with the terminal; and

a shield pattern disposed at the one side of the insulating layer in the thickness direction, spaced apart from and adjacent to a part of the wire, and having an opening,

wherein the opening is provided within the shield pattern.

11 . The wiring circuit board according to claim 10 ,

wherein the wire is made of a first conductive layer, and

wherein the shield pattern is made of a second conductive layer.

12 . The wiring circuit board according to claim 11 , wherein the terminal includes:

a first layer disposed at the one side of the insulating layer in the thickness direction and made of the first conductive layer; and

a second layer disposed at one side of the first layer in the thickness direction and made of the second conductive layer.

13 . The wiring circuit board according to claim 11 , wherein the terminal includes:

a first layer disposed at the one side of the insulating layer in the thickness direction and made of the second conductive layer; and

a second layer disposed at one side of the first layer in the thickness direction and made of the first conductive layer.

14 . The wiring circuit board according to claim 11 , wherein the second conductive layer is thicker than the first conductive layer.

15 . The wiring circuit board according to claim 11 , wherein the first conductive layer is thicker than the second conductive layer.

16 . The wiring circuit board according to claim 10 ,