Component carrier with protruding portions and manufacturing method

1 . A component carrier, being a coreless component carrier, comprising:

a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure;

a plurality of vias that vertically interconnect the electrically conductive layer structures in the stack,

wherein the vias comprise an electrically conductive material,

wherein the vias are tapering vias,

wherein the vias taper in the same direction;

a plurality of protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surface of the stack; and

an electrically conductive cover material exclusively covering an upper main surface of at least one of the plurality of protruding portions protruding from and beyond the outermost electrically conductive layer structure of the stack.

2 . The component carrier according to claim 1 ,

wherein the plurality of protruding portions extends in a vertical direction (z) with respect to the stack.

3 . The component carrier according to claim 1 ,

wherein at least one protruding portion from the plurality of protruding portions comprises at least one of straight sidewalls or does not taper.

4 . The component carrier according to claim 1 ,

wherein at least one protruding portion from the plurality of protruding portions comprises one cross-sectional shape of the group which consists of: circular, rectangular, polygonal, triangular, conical, frustoconical.

5 . The component carrier according to claim 1 ,

wherein the plurality of vias tapers towards the plurality of protruding portions.

6 . The component carrier according to claim 1 ,

wherein at least one of the electrically conductive layer structures comprises a vertically extending portion with straight sidewalls, wherein the vertically extending portion is at least partially embedded in the stack.

7 . The component carrier according to claim 1 ,

wherein at least one of the electrically conductive layer structures is configured as a discontinuous layer.

8 . The component carrier according to claim 1 ,

wherein at least one protruding portion from the protruding portions comprises metal bumps.

9 . The component carrier according to claim 1 ,

wherein the plurality of electrically conductive layer structures is embedded in the at least one electrically insulating layer structure.

10 . The component carrier according to claim 1 ,

wherein the at least one electrically insulating layer structure partially embeds the plurality of protruding portions.

11 . The component carrier according to claim 1 , further comprising:

a further electrically insulating layer structure that partially embeds the plurality of protruding portions.

12 . A method of manufacturing a coreless component carrier, the method comprising:

forming a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure;

forming a plurality of vias that vertically interconnect the electrically conductive layer structures in the stack, and filling the plurality of vias with an electrically conductive material, such that the vias are tapering vias, and taper in the same direction;

forming a plurality of protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surface of the stack; and

forming an electrically conductive cover material exclusively covering an upper main surface of at least one of the plurality of protruding portions protruding from and beyond the outermost electrically conductive layer structure of the stack.

13 . The method according to claim 12 , wherein forming the plurality of protruding portions comprises:

at least partially exposing the plurality of protruding portions.

14 . The method according to claim 13 , wherein exposing comprises:

removing electrically insulating material of at least one of the at least one electrically insulating layer structure or the further electrically insulating layer structure.

15 . The method according to claim 14 , wherein removing comprises:

at least partially removing the electrically insulating material by plasma etching.

16 . The method according to claim 14 ,

wherein the electrically insulating material comprises a film.

17 . The method according to claim 13 , wherein exposing comprises:

removing electrically conductive material of the outermost electrically conductive layer structure.

18 . The method according to claim 17 , wherein removing comprises:

at least partially removing the electrically conductive material by wet etching.

19 . The method according to claim 12 , wherein forming the plurality of protruding portions comprises:

forming a hole in an electrically insulating material structure; and

filling the hole with electrically conductive material.

20 . The method according to claim 12 , further comprising at least one of the following features:

wherein forming the plurality of protruding portions comprises:

forming a metal bump on the outermost electrically conductive layer structure;

wherein forming the plurality of protruding portions is free of grinding;

wherein forming the plurality of vias comprises:

forming tapering holes by laser drilling;

wherein the plurality of protruding portions is formed before the plurality of vias;

at least partially forming the stack on a temporary carrier, and

removing the temporary carrier before forming the plurality of protruding portions;

wherein forming the stack comprises lamination.

21 . A method of manufacturing a coreless component carrier, the method comprising:

forming a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure;

forming a plurality of vias that vertically interconnect the electrically conductive layer structures in the stack, and filling the plurality of vias with an electrically conductive material, so that the vias are tapering vias, and taper in the same direction; and

forming a plurality of protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surface of the stack by at least partially exposing;

the method further comprising at least one of the following features:

wherein exposing comprises removing electrically conductive material of the outermost electrically conductive layer structure;

wherein exposing comprises at least partially removing the electrically conductive material by wet etching.