Flexible printed circuit board, COF module, and electronic device comprising the same
A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.
1 . A flexible printed circuit board comprising:
a substrate;
a plurality of circuit pattern disposed on the substrate; and
a plurality of dummy patterns disposed on the substrate,
wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns,
wherein the first circuit patterns are connected with a chip and a circuit board,
wherein the second circuit patterns are connected with the chip and a display panel,
wherein the third circuit patterns are connected with the circuit board and the display panel,
wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion,
wherein the dummy patterns are disposed between two adjacent third wiring portions,
a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and
wherein the third wiring portion includes a first wiring region and a second wiring region that are integrally formed,
a line width of the second wiring region is greater than a line width of the first wiring region, and
the second wiring region is connected to a plurality of first wiring regions,
wherein a minimum distance between the second wiring region and the fourth wiring portion is greater than a distance between adjacent second wiring regions.
2 . The flexible printed circuit board of claim 1 , wherein the minimum distance between the second wiring region and the fourth wiring portion is greater than a distance between adjacent the fourth wiring portions.
3 . The flexible printed circuit board of claim 1 , wherein the minimum distance between the second wiring region and the fourth wiring portion is greater than a distance between the first wiring region and the fourth wiring portion.
4 . The flexible printed circuit board of claim 1 , wherein the minimum distance between the second wiring region and the fourth wiring portion is greater than a distance between adjacent the first wiring region.
5 . The flexible printed circuit board of claim 1 , wherein the third circuit pattern is a power supply circuit pattern.
6 . The flexible printed circuit board of claim 1 , wherein the line width of the second wiring region is 30 μm or more.
7 . The flexible printed circuit board of claim 1 , wherein the line width of the second wiring region is at least twice the line width of the fourth wiring portion.
8 . The flexible printed circuit board of claim 1 , wherein the minimum distance between the second wiring region and the fourth wiring portion is 1.5 times or more at least one of a distance between adjacent second wiring regions, the distance between adjacent the fourth wiring portions, a distance between the first wiring region and the fourth wiring portion, and a distance between adjacent the first wiring region.
9 . The flexible printed circuit board of claim 1 , wherein the first circuit pattern includes a first-first pad portion disposed inside a chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion connecting the first-first pad portion and the first-second pad portion, and extends in a first direction based on the chip mounting region, and
the second circuit pattern includes a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion connecting the second-first pad portion and the second-second pad portion, and extends in a second direction.
10 . The flexible printed circuit board of claim 8 , wherein the third circuit pattern extends in the first direction and the second direction.
11 . The flexible printed circuit board of claim 1 , wherein the third circuit pattern includes a region having a line width greater than that of the first circuit pattern and the second circuit pattern.
12 . The flexible printed circuit board of claim 1 , the second wiring region is a region formed by merging a plurality of first wiring regions.
13 . The flexible printed circuit board of claim 1 , wherein the line width of the fourth wiring part is less than or equal to the line width of the first wiring region of the third wiring part.
14 . A COF module comprising:
the flexible printed circuit board according to claim 1 ; and
a chip disposed in the chip mounting region.
15 . The COF module of claim 14 , wherein the minimum distance between the second wiring region and the fourth wiring portion is greater than a distance between adjacent the fourth wiring portions.
16 . The COF module of claim 14 , wherein the minimum distance between the second wiring region and the fourth wiring portion is greater than a distance between the first wiring region and the fourth wiring portion.
17 . The COF module of claim 14 , wherein the minimum distance between the second wiring region and the fourth wiring portion is greater than a distance between adjacent the first wiring region.
18 . An electronic device comprising:
the COF module according to claim 17 ;
a printed circuit board connected to the first circuit pattern; and
a display panel connected to the second circuit pattern.