Methods and systems for cooling an electronic component of a speaker device

1 . A passive heat removal component for a speaker device, the passive heat removal component comprising:

a body configured to be removably attached to the speaker device,

the body defining a plurality of valvular conduits, a valvular conduit from the plurality of valvular conduits having a first end and a second end, the valvular conduit allowing an airflow in a pre-determined direction through the body from the first end to the second end, an other one from the plurality of valvular conduits extending parallel to the valvular conduit in the body, the other one from the plurality of valvular conduits having an other first end and an other second end, the other one from the plurality of valvular conduits allowing an other airflow in an other pre-determined direction through the body from the other first end to the other second end; and

the body being disposed in proximity to an electronic component of the speaker device for transferring thermal energy from the electronic component to the airflow in the valvular conduit, the body further being disposed for transferring thermal energy from the electronic component to the other airflow in the other one from the plurality of valvular conduits, the other second end of the other one from the plurality of valvular conduits being disposed in proximity to an acoustic component of the speaker device such that other heated airflow exhausted from the other one from the plurality of valvular conduits is directed toward the acoustic component, and such that operation of the acoustic component is configured to cause movement of the other heated airflow away from the speaker device by acoustic waves generated by the acoustic component.

2 . The passive heat removal component of claim 1 , wherein the second end of the valvular conduit is disposed in proximity to the acoustic component of the speaker device, such that operation of the acoustic component is configured to cause movement of heated airflow away from the speaker device by the acoustic waves.

3 . The passive heat removal component of claim 1 , wherein the valvular conduit extends vertically in the body such that the first end is located at a bottom portion of the body and the second end is located at a top portion of the body.

4 . The passive heat removal component of claim 1 , wherein the valvular conduit is a channel-like valvular conduit defined on a surface of the body.

5 . The passive heat removal component of claim 1 , wherein the valvular conduit is a chamber-like valvular conduit defined in the body.

6 . The passive heat removal component of claim 1 , wherein the valvular conduit includes at least one of an enlargement, a recess, a projection, a baffle, or a bucket for at least one of (i) reducing resistance to the airflow in the pre-determined direction or (ii) increasing resistance to the airflow in a direction opposite to the pre-determined direction.

7 . The passive heat removal component of claim 1 , wherein the first end is disposed in proximity to the electronic component.

8 . The passive heat removal component of claim 1 , wherein at least a portion of the body is maintained in thermal contact with the electronic component.

9 . The passive heat removal component of claim 1 , wherein the acoustic component is a speaker.

10 . The passive heat removal component of claim 1 , wherein the electronic component is located on a motherboard.

11 . The passive heat removal component of claim 1 , wherein the electronic component comprises at least one of a processor, and a memory component.

12 . The passive heat removal component of claim 1 , wherein the body is made of a material selected from a group of material, said group comprising aluminum, zinc, and copper.

13 . A method of cooling an electronic component of a speaker device, the speaker device comprising the electronic component, an acoustic component, and a heat removal component, the heat removal component having a body removably attached to the speaker device, the method comprising:

passively intaking, by a valvular conduit defined in the body, air from environment, the valvular conduit allowing an airflow in a pre-determined direction through the body;

heating, by the body, the air in the valvular conduit;

passively exhausting, by the valvular conduit, heated air towards the acoustic component;

moving, by the acoustic component, the heated air away from the speaker device using acoustic waves generated by the acoustic component;

passively intaking, by an other valvular conduit defined in the body, other air from the environment, the other valvular conduit allowing an other airflow in an other pre-determined direction;

heating, by the body, the other air in the other valvular conduit;

passively exhausting, by the other valvular conduit, other heated air towards the acoustic component; and

moving, by the acoustic component, the other heated air away from the speaker device using the acoustic waves.

14 . The method of claim 13 , wherein the speaker device has a wall with an aperture, the method comprising:

guiding, by the aperture, the air from the environment towards the valvular conduit.

15 . A speaker device comprising:

an acoustic component generating acoustic waves;

an electronic component generating thermal energy; and

a passive heat removal component including a body removably attached to the speaker device,

the body defining a plurality of valvular conduits, a valvular conduit from the plurality of valvular conduits having a first end and a second end, the valvular conduit allowing an airflow in a pre-determined direction through the body from the first end to the second end, an other one from the plurality of valvular conduits extending parallel to the valvular conduit in the body, the other one from the plurality of valvular conduits having an other first end and an other second end, the other one from the plurality of valvular conduits allowing an other airflow in an other pre-determined direction through the body from the other first end to the other second end; and

the body being disposed in proximity to the electronic component for transferring thermal energy from the electronic component to the airflow in the valvular conduit, the body further being disposed for transferring thermal energy from the electronic component to the other airflow in the other one from the plurality of valvular conduits, the other second end of the other one from the plurality of valvular conduits being disposed in proximity to an acoustic component of the speaker device such that other heated airflow exhausted from the other one from the plurality of valvular conduits is directed toward the acoustic component, and such that operation of the acoustic component is configured to cause movement of the other heated airflow away from the speaker device by acoustic waves generated by the acoustic component.

16 . The speaker device of claim 15 , wherein the second end of the valvular conduit is disposed in proximity to the acoustic component, such that operation of the acoustic component is configured to cause movement of heated airflow away from the speaker device by the acoustic waves.

17 . The speaker device of claim 15 , wherein the valvular conduit includes at least one of an enlargement, recess, projection, baffle, or a bucket or a combination thereof for at least one of (i) reducing resistance to the airflow in the pre-determined direction or (ii) increasing resistance to the airflow in a direction opposite to the pre-determined direction.