Cooling system for electronic devices

1 . A cooling system for cooling electronic devices, the cooling system comprising:

a fluid tank comprising a bottom surface, sidewalls, and a coolant fluid having a fluid level within the fluid tank;

a support structure above the bottom surface of the fluid tank;

a fluid inlet adjacent to the bottom surface of the fluid tank, the fluid inlet comprising a plurality of distribution conduits extending along the bottom surface of the fluid tank, the plurality of distribution conduits defining an array of apertures that are adapted to introduce coolant fluid adjacent to the bottom surface of the fluid tank, the array of apertures being spaced below the support structure;

a fluid outlet spaced from the fluid inlet, the fluid outlet comprising an elongated conduit disposed within the fluid tank and submerged within the coolant fluid, the elongated conduit comprising a series of fluid ports spaced along a length of the fluid tank to withdraw fluid from the fluid tank, the fluid inlet and the fluid outlet being in fluid communication through a flow path;

a baffle that is disposed between the fluid inlet and the fluid outlet, a top of the baffle being below the fluid level of the coolant fluid; and

a plurality of electronic devices positioned within the fluid tank, the plurality of electronic devices being supported by the support structure such that:

the plurality of electronic devices are submerged within the coolant fluid; and the plurality of electronic devices engage the baffle to define parallel channels that extend vertically along a portion of the flow path such the coolant fluid cools the plurality of electronic devices.

2 . The cooling system of claim 1 , wherein the baffle comprises a stepped cross-section that engages the plurality of electronic devices.

3 . The cooling system of claim 1 , wherein the fluid outlet is positioned above the fluid inlet.

4 . The cooling system of claim 1 , further comprising a heat exchanger connected to receive coolant fluid from the fluid outlet and to supply coolant fluid to the fluid inlet.

5 . The cooling system of claim 1 , wherein the plurality of electronic devices comprise an array of computing units, the array having more than one row and more than one column, wherein a first row of computing units engages the baffle and one or more adjacent rows extend parallel to the first row.

6 . The cooling system of claim 5 , wherein the plurality of distribution conduits extend perpendicular to the baffle.

7 . The cooling system of claim 1 , wherein the top of the baffle is below a top of the plurality of electronic devices.

8 . A method of cooling a plurality of electronic devices, the method comprising the steps of:

inserting the plurality of electronic devices into a fluid tank that comprises:

a bottom surface, sidewalls, and a coolant fluid having a fluid level within the fluid tank;

a support structure above the bottom surface of the fluid tank;

a fluid inlet adjacent to the bottom surface of the fluid tank, wherein the fluid inlet comprises a manifold having a plurality of distribution conduits spaced along and extending perpendicular to the baffle that are positioned to introduce coolant fluid adjacent to the bottom surface of the fluid tank;

a fluid outlet spaced from the fluid inlet, the fluid outlet comprising an elongated conduit disposed within the fluid tank and submerged within the coolant fluid, the elongated conduit comprising a series of fluid ports spaced along a length of the fluid tank to withdraw fluid from the fluid tank, the fluid inlet and the fluid outlet being in fluid communication through a flow path; and

a baffle that is disposed between the fluid inlet and the fluid outlet, wherein a top of the baffle is below the fluid level of the coolant fluid;

the plurality of electronic devices being inserted such that:

the plurality of electronic devices are positioned below the fluid level such that the plurality of electronic devices are submerged within the coolant fluid; and

the plurality of electronic devices engage the baffle to define parallel channels that extend vertically along a portion of the flow path;

and circulating the coolant fluid along the flow path to cool the plurality of electronic devices.

9 . The method of claim 8 , further comprising the step of cooling the coolant fluid by circulating the coolant fluid through a heat exchanger outside the fluid tank.

10 . The method of claim 8 , wherein the baffle comprises a stepped cross section that engages the plurality of electronic devices.

11 . The method of claim 8 , wherein the fluid outlet is positioned above the fluid inlet.

12 . The method of claim 8 , wherein the plurality of electronic devices comprise an array of computing units, the array having more than one row and more the one column.

13 . The method of claim 8 , further comprising the step of engaging a first row of computing units to the baffle.

14 . The method of claim 8 , wherein the top of the baffle is below a top of the plurality of electronic devices.