Power module assembly
A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.
1 . A power module assembly disposed on a substrate for dissipating heat generated from the power module assembly, wherein the power module assembly comprises:
a circuit board comprising at least one plane;
at least one heat-generating device disposed on the at least one plane;
at least one first metal block comprising a first side and a second side, wherein the first side of the first metal block faces the at least one heat-generating device, and the second side of the first metal block faces the substrate, wherein each one of the at least one first metal block substantially thermally contacts a corresponding one of the at least one heat-generating device, wherein a projection of each one of the at least one first metal block on the at least one plane overlaps a projection of the corresponding heat-generating device on the at least one plane, and does not overlap a projection of another heat-generating device on the at least one plane;
a first filling material disposed between the first side of the first metal block and the at least one heat-generating device, and
a second filling material disposed between the second side of the first metal block and the substrate.
2 . The power module assembly according to claim 1 , wherein the substrate is a system board, and the first metal block is connected to a leading-connection area of the system board through the second filling material, wherein the second filling material is a conductive glue, a solder, a thermal adhesive or an adhesive glue.
3 . The power module assembly according to claim 1 , wherein the at least one heat-generating device comprises two heat-generating devices commonly connected to the first metal block through the first filling material.
4 . The power module assembly according to claim 3 , wherein the two heat-generating devices are dual-side cooling switch devices and connected in parallel through the first metal block and the first filling material, and the first metal block is thermally and/or electrically connected to a system board through the second filling material.
5 . The power module assembly according to claim 1 , wherein the at least one heat-generating device comprises two heat-generating devices arranged adjacent to each other, wherein the two heat-generating devices are dual-side cooling switch devices, one of the two heat-generating devices is electrically connected to the substrate through the first metal block, the other of the two heat-generating devices is electrically connected to the substrate through another first metal block, and two the first metal blocks have current in opposite directions.
6 . The power module assembly according to claim 1 , further comprising a second metal block having a first end connected to the at least one plane of the circuit board, and a second end connected to the substrate through the second filling material.
7 . The power module assembly according to claim 6 , wherein a height difference formed between the second metal block and the at least one heat-generating device relative to the at least one plane is greater than 0.2 mm.
8 . The power module assembly according to claim 6 , wherein the second end of the second metal block is flat and coplanar with the second side of the first metal block.
9 . The power module assembly according to claim 6 , wherein the substrate is a system board, the first metal block and the second metal block are electrically connected to an installation plane of the system board through the second filling material, wherein the second filling material is a conductive glue, a solder, a thermal adhesive or an adhesive glue.
10 . The power module assembly according to claim 6 , wherein the substrate is a heat sink, and the first metal block and the second metal block are fixed and connected to an installation plane of the heat sink through the second filling material, wherein the second filling material is a thermal adhesive or an adhesive glue.
11 . The power module assembly according to claim 1 , wherein the substrate is a heat sink, and the first metal block is fixed and connected to an installation plane of the heat sink through the second filling material, wherein the second filling material is a thermal adhesive or an adhesive glue.
12 . The power module assembly according to claim 1 , wherein an electronic component disposed on the at least one plane has a maximum height relative to the at least one plane, and the at least one heat-generating device and the first filling material and the first metal block corresponding thereto have a total height equal to the maximum height.
13 . The power module assembly according to claim 1 , wherein the substrate is a system board, the at least one heat-generating device comprises a dual-side cooling switch device, and the dual-side cooling switch device is thermally and/or electrically connected to the system board through the first filling material, the first metal block and the second filling material.
14 . A power module assembly comprising:
a circuit board comprising at least one plane;
at least one heat-generating device disposed on the at least one plane;
at least one first metal block comprising a first side and a second side, wherein the first side of the first metal block faces the at least one heat-generating device, and the second side of the first metal block faces a substrate, wherein each one of the at least one first metal block substantially thermally contacts a corresponding one of the at least one heat-generating device, wherein a projection of each one of the at least one first metal block on the at least one plane overlaps a projection of the corresponding heat-generating device on the at least one plane, and does not overlap a projection of another heat-generating device on the at least one plane;
a first filling material disposed between the first side of the first metal block and the at least one heat-generating device, and
a second metal block comprising a first end and a second end, wherein the first end is connected to the at least one plane, the second end is flat and coplanar with the second side of the first metal block, and configured to connect to an installation plane of the substrate.
15 . The power module assembly according to claim 14 , further comprising a second filling material, wherein the second side of the first metal block and the second end of the second metal block are connected to the installation plane of the substrate through the second filling material.
16 . The power module assembly according to claim 14 , wherein a height difference formed between the second metal block and the at least one heat-generating device relative to the at least one plane is greater than 0.2 mm.
17 . The power module assembly according to claim 14 , wherein the first metal block has a height greater than 0.2 mm.
18 . The power module assembly according to claim 14 , wherein the substrate is a system board or a heat sink.
19 . The power module assembly according to claim 14 , wherein the at least one heat-generating device comprises two heat-generating devices, and the two heat-generating devices are dual-side cooling switch devices and commonly connected to the first metal block through the first filling material, wherein the first filling material is a thermal adhesive, an adhesive glue, a conductive glue or a solder.
20 . The power module assembly according to claim 14 , wherein the at least one heat-generating device comprises two heat-generating devices arranged adjacent to each other, the two heat-generating devices are dual-side cooling switch devices, one of the two heat-generating devices is electrically connected to the substrate through the first metal block, and the other of the two heat-generating devices is electrically connected to the substrate through another first metal block, wherein two of the first metal blocks have current in opposite directions.