Semiconductor device

1 . A semiconductor device, comprising:

an input-side lead;

a light-emitting element provided on the input-side lead;

a first output-side lead facing the input-side lead with the light-emitting element interposed;

a first switching element provided on the first output-side lead and positioned between the light-emitting element and the first output-side lead, the first switching element including a back-side electrode, a front-side electrode and a control pad, the back-side electrode being connected to the first output-side lead, the front-side electrode being positioned at a front side of the first switching element opposite to the back-side electrode, the front-side electrode and the control pad being provided at the front side of the first switching element;

a light-receiving element provided on the first switching element, the light-receiving element being connected to the front-side electrode of the first switching element, the light-receiving element being stacked on the front-side electrode of the first switching element with an insulative connection member interposed in a direction perpendicular to a front surface of the first switching element, the light-receiving element being positioned between the first switching element and the light-emitting element, the light-receiving element including a first bonding pad and a second bonding pad, the first bonding pad being electrically connected to the control pad of the first switching element via a first conductive member, the second bonding pad being electrically connected to the front-side electrode of the first switching element via a second conductive member; and

a first resin member sealing the light-emitting element on the input-side lead and sealing the first switching element and the light-receiving element on the first output-side lead, the first resin member including a portion interposed between the light-emitting element and the light-receiving element, the first resin member transmitting light radiated from the light-emitting element toward the light-receiving element.

2 . The device according to claim 1 , further comprising:

a second output-side lead having a front side facing the input-side lead; and

a second switching element provided on the front side of the second output-side lead, the second switching element including another front-side electrode, another back-side electrode and another control pad, said other back-side electrode being connected to the second output-side lead,

the light-receiving element being provided on the first switching element and the second switching element, the light-receiving element being connected to said other front-side electrode of the second switching element, the light-receiving element being stacked on said other front-side electrode of the second switching element with another insulative connection member interposed.

3 . The device according to claim 2 , wherein the first resin member further seals the second switching element on the second output-side lead.

4 . The device according to claim 2 , wherein

the light-receiving element has a front surface facing the light-emitting element and a back surface connected to the first and second switching elements, the first bonding pad and the second bonding pad of the light-receiving element being provided on the front surface of the light-receiving element,

the front surface of the first switching element being connected to the light-receiving element, the first bonding pad of the light-receiving element overlapping the first switching element in the direction perpendicular to the front surface of the first switching element,

the second switching element having a front surface connected to the light-receiving element, the second bonding pad of the light-receiving element overlapping the second switching element in a direction perpendicular to the front surface of the second switching element.

5 . The device according to claim 2 , wherein

the control pad of the first switching element is electrically connected to said other control pad of the second switching element via a third conductive member,

the front-side electrode of the first switching element is electrically connected to said other front-side electrode of the second switching element via a fourth conductive member,

the second bonding pad of the light-receiving element is electrically connected to said other front-side electrode of the second switching element via the second conductive member, and

the second bonding pad of the light-receiving element is electrically connected to the front-side electrode of the first switching element via the second and fourth conductive members.

6 . The device according to claim 5 , wherein

the light-receiving element has a front surface facing the light-emitting element, and

the first conductive member and the second conductive member are provided without crossing the third and fourth conductive members in a direction perpendicular to the front surface of the light-receiving element.

7 . The device according to claim 2 , wherein

the light-receiving element has a front surface facing the light-emitting element,

the light-receiving element has a first thickness in a direction perpendicular to the front surface of the light-receiving element, and

each of the first and second switching elements has a second thickness in the direction perpendicular to the front surface of the light-receiving element, the first thickness being greater than the second thickness.

8 . The device according to claim 3 , further comprising:

a second resin member sealing the light-emitting element on the input-side lead, the first resin member covering the light-emitting element with the second resin member interposed; and

a third resin member covering the first resin member, the input-side lead, the first output-side lead, and the second output-side lead, the third resin member shielding external light,

the input-side lead, the first output-side lead, and the second output-side lead including portions extending outside of the third resin member.

9 . The device according to claim 1 , further comprising:

a second resin member sealing the light-emitting element on the input-side lead, the first resin member covering the light-emitting element with the second resin member interposed; and

a third resin member covering the first resin member, the input-side lead, and the first output-side lead, the third resin member shielding external light,

the input-side lead and the first output-side lead including portions extending outside of the third resin member.

10 . The device according to claim 5 , wherein

the first switching element and the second switching element each include a semiconductor part, a control electrode, an insulating member, a first control pad and a second control pad,

for each of the first and second switching elements, the respective back-side electrode is electrically connected to a back side of the respective semiconductor part,

for each of the first and second switching elements, the respective front-side electrode is electrically connected to a front side of the respective semiconductor part,

for each of the first and second switching elements, the respective control electrode is provided at the front side of the respective semiconductor part, the respective control electrode being provided between the respective front-side electrode and the respective back-side electrode and electrically insulated from the respective semiconductor part and the respective front-side electrode,

for each of the first and second switching elements, the respective insulating member covers the respective front-side electrode at the front side of the respective semiconductor part and includes openings, the respective front-side electrode including a first bonding region and a second bonding region exposed respectively in the openings of the respective insulating member, the respective first and second bonding regions being apart from each other,

for each of the first and second switching elements, the respective first control pad and the respective second control pad are provided at the front side of the respective semiconductor part and apart from each other, the respective first and second control pads being electrically connected to the respective control electrode,

the first conductive member electrically connects the first bonding pad of the light-receiving element and the first control pad of the first switching element,

the second conductive member electrically connects the second bonding pad of the light-receiving element and the second bonding region of the second switching element,

the third conductive member electrically connects the second control pad of the first switching element and the first control pad of the second switching element, and

the fourth conductive member electrically connects the second bonding region of the first switching element and the first bonding region of the second switching element.

11 . The device according to claim 10 , wherein the first and second switching elements have the same layouts, at front sides, of the respective first and second bonding regions and the respective first and second control pads.

12 . The device according to claim 11 , wherein the layouts of the first and second switching elements are line-symmetric with respect to symmetry lines along front sides of the first and second switching elements, the symmetry lines crossing a direction in which the first and second switching elements overlap.

13 . The device according to claim 10 , wherein the first and second switching elements each include the first and second bonding regions overlapping in a first direction along the front side of the semiconductor part and the respective first and second control pads overlapping in the first direction along the front side of the semiconductor part, the respective first and second control pads being apart from the respective first and second bonding regions in a second direction crossing the first direction.

14 . The device according to claim 13 , wherein

the first switching element overlaps the second switching element in the first direction,

the first and second bonding regions of the first switching element overlap the first and second bonding regions of the second switching element in the first direction, and

the first and second control pads of the first switching element overlap the first and second control pads of the second switching element in the first direction.

15 . The device according to claim 2 , wherein

the light-receiving element further includes a third bonding pad electrically connected to the first bonding pad and a fourth bonding pad electrically connected to the second bonding pad,

the first switching element and the second switching element each include a semiconductor part, a control electrode, an insulating member, a first control pad and a second control pad, the respective back-side electrodes being electrically connected to back sides of the respective semiconductor parts,

for each of the first and second switching elements, the respective front-side electrode is electrically connected to a front side of the respective semiconductor part,

for each of the first and second switching elements, the respective control electrode is provided at the front side of the respective semiconductor part, the respective control electrode being provided between the respective front-side electrode and the respective back-side electrode and electrically insulated from the respective semiconductor part and the respective front-side electrode,

for each of the first and second switching elements, the respective insulating member covers the respective front-side electrode at the front side of the respective semiconductor part and includes openings, the respective front-side electrode including a first bonding region and a second bonding region exposed respectively in the openings of the respective insulating member, the respective first and second bonding regions being apart from each other,

for each of the first and second switching elements, the respective first control pad and the respective second control pad are provided at the front side of the respective semiconductor part and apart from each other, the respective first and second control pads being electrically connected to the respective control electrode,

the first bonding pad of the light-receiving element is electrically connected to the first control pad of the first switching element via the first conductive member,

the second bonding pad of the light-receiving element is electrically connected to the second bonding region of the first switching element via the second conductive member,

the third bonding pad of the light-receiving element is electrically connected to the second control pad of the second switching element via a fifth conductive member,

the fourth bonding pad of the light-receiving element is electrically connected to the second bonding region of the second switching element via a sixth conductive member, and

the first bonding region of the first switching element is electrically connected to the first bonding region of the second switching element via a fourth conductive member.

16 . The device according to claim 15 , wherein

for each of the first and second switching elements, the respective first control pad overlaps the respective second control pad in a first direction along the front side of the semiconductor part, and

for each of the first and second switching elements, the respective first bonding region overlaps the respective second bonding region in a second direction crossing the first direction along the front side of the semiconductor part, the respective first and second bonding regions further being apart from the respective first and second control pads.