Method of transferring micro-LEDs on circuit substrates, removing support structure and grinding edge of circuit substrate
A display panel includes a circuit substrate, a first supporting structure, a glue layer residue and light-emitting diodes. The circuit substrate has electrodes. The first supporting structure is located outside the electrodes on the circuit substrate. The glue layer residue is located on the first supporting structure. The light-emitting diodes are electrically connected to the electrodes.
1 . A fabrication method of a display panel, comprising:
providing a circuit substrate with a plurality of electrodes on a surface thereof;
forming a first supporting structure and a second supporting structure on the circuit substrate, wherein the first supporting structure is located outside the electrodes on the circuit substrate, the second supporting structure is located outside the first supporting structure on the circuit substrate, and there is a gap between the first supporting structure and the second supporting structure;
forming a glue layer in the gap between the first supporting structure and the second supporting structure;
transferring a plurality of light-emitting diodes onto the circuit substrate by a transfer device, wherein the transfer device is pressed on the glue layer, and the plurality of light-emitting diodes are located on the plurality of electrodes;
removing the glue layer, leaving a glue layer residue on the first supporting structure and the second supporting structure;
removing the transfer device, leaving the plurality of light-emitting diodes on the circuit substrate;
cutting the circuit substrate to remove the second supporting structure; and
grinding an edge of the circuit substrate.
2 . The fabrication method of claim 1 , wherein after grinding the edge of the circuit substrate, the first supporting structure is aligned with at least one sidewall of the circuit substrate.
3 . The fabrication method of claim 1 , further comprises: when the transfer device is pressed on the glue layer, the plurality of light-emitting diodes are welded to the plurality of electrodes.
4 . The fabrication method claim 1 , further comprises:
forming an encapsulant on the plurality of light-emitting diodes; and
cutting the encapsulant, wherein the first supporting structure is aligned with at least one sidewall of the encapsulant.
5 . The fabrication method claim 1 , wherein the first supporting structure, the second supporting structure and the glue layer are closed rings or open rings, and the first supporting structure, the second supporting structure and the glue layer include circular or non-circular rings.