IP Library Granted Patent US 12672408
Granted Patent B2
US 12672408 · App. 18/215,980 · Granted Jun 30, 2026

LED display unit group, manufacturing method of LED display unit group, and display panel

Inventors: Kuai Qin (Foshan, CN); Shaojia Xie (Foshan, CN); Bin Cai (Foshan, GD); Fangping He (Foshan, CN); Zhuang Peng (Foshan, CN); Caineng Huo (Foshan, CN)
Assignee: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
H10H20/857H10W90/00H10H20/0364
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12672408
App. No.
18/215,980
Granted
Jun 30, 2026
Kind
B2
Abstract

A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer and an ink layer, the substrate is provided with an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

Claims (31)

1 . A LED display unit group, comprising a substrate and an electronic device; wherein,

the substrate comprises a pad layer and an ink layer, the substrate is provided with an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device, the pad layer comprises pad regions and a non-pad region, each of the pad regions comprises a plurality of pads, and the non-pad region comprises metal traces, and the ink layer is disposed on a side of the pad layer facing away from the substrate; the ink layer at least partially covers the metal traces, the ink layer is provided with a window, and part of the metal traces exposed from the window forms the identification structure;

each pad of the plurality of pads is configured to secure the electronic device and is electrically connected to the electronic device;

the metal traces are connected to the plurality of pads, respectively, and the metal traces are configured to connect the plurality of pads via the metal traces; and

an orthographic projection of the identification structure on the substrate is partially overlapped or not overlapped with an orthographic projection of the pad regions on the substrate, the identification structure is configured to identify at least one of: a position of the electronic device on the substrate, a poor state of the plurality of pads, or a poor state of the metal traces.

2 . The LED display unit group of claim 1 , wherein a shape of the identification structure comprises at least one of a triangle, a circle, an ellipse, or a rectangle.

3 . The LED display unit group of claim 1 , wherein at least two of the pad regions are provided with a corresponding one identification structure; and

the at least two of the pad regions form a first region, and the identification structure is disposed at an intermediate position or an edge position of the first region.

4 . The LED display unit group of claim 1 , wherein the pad layer is symmetrical with respect to a symmetry axis in left-right directions, wherein the symmetry axis is a central axis of the substrate in a preset direction.

5 . A manufacturing method of a LED display unit group, comprising:

providing a substrate; and

preparing a pad layer and an ink layer on a side of the substrate and forming an identification structure on the side of the substrate; wherein,

the pad layer is disposed on a first surface of a side of the substrate adjacent to an electronic device, the pad layer comprises pad regions and a non-pad region, each of the pad regions comprises a plurality of pads, and the non-pad region comprises metal traces; and the ink layer is disposed on a side of the pad layer facing away from the substrate, and the ink layer at least partially covers the metal traces;

each pad of the plurality of pads is configured to secure the electronic device and is electrically connected to the electronic device;

the metal traces are connected to the plurality of pads respectively, and the metal traces are configured to connect the plurality of pads via the metal traces; and

an orthographic projection of the identification structure on the substrate is partially overlapped or not overlapped with an orthographic projection of the pad regions on the substrate, the identification structure is configured to identify at least one of: a position of the electronic device on the substrate, a poor state of the plurality of pads, or a poor state of the metal traces;

wherein preparing the pad layer and the ink layer on the side of the substrate and forming the identification structure on the side of the substrate comprises:

preparing the pad layer on the side of the substrate;

preparing the ink layer on a side of the pad layer facing away from the substrate; and

windowing a window at a position of the ink layer corresponding to the metal traces,

wherein part of the metal traces exposed from the window form the identification structure.

6 . A display panel, comprising a LED display unit group;

wherein the LED display unit group comprises a substrate and an electronic device; wherein,

the substrate comprises a pad layer and an ink layer, the substrate is provided with an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device, the pad layer comprises pad regions and a non-pad region, each of the pad regions comprises a plurality of pads, and the non-pad region comprises metal traces, and the ink layer is disposed on a side of the pad layer facing away from the substrate; the ink layer at least partially covers the metal traces the ink layer is provided with a window and part of the metal traces exposed from the window forms the identification structure;

each pad of the plurality of pads is configured to secure the electronic device and is electrically connected to the electronic device;

the metal traces are connected to the plurality of pads, respectively, and the metal traces are configured to connect the plurality of pads via the metal traces; and

an orthographic projection of the identification structure on the substrate is partially overlapped or not overlapped with an orthographic projection of the pad regions on the substrate, the identification structure is configured to identify at least one of: a position of the electronic device on the substrate, a poor state of the plurality of pads, or a poor state of the metal traces.

7 . The display panel of claim 6 , wherein a shape of the identification structure comprises at least one of a triangle, a circle, an ellipse, or a rectangle.

8 . The display panel of claim 6 , wherein at least two of the pad regions are provided with a corresponding one identification structure; and

the at least two of the pad regions form a first region, and the identification structure is disposed at an intermediate position or an edge position of the first region.

9 . The display panel of claim 6 , wherein the pad layer is symmetrical with respect to a symmetry axis in left-right directions, wherein the symmetry axis is a central axis of the substrate in a preset direction.