Substrate processing device and substrate processing method
Disclosed is a substrate processing apparatus including: a support unit for supporting a substrate and rotating the substrate; a solution discharge unit for discharging a processing solution including a first material and a second material onto the substrate to remove a film on the substrate; and a controller for controlling the solution discharge unit, in which the controller sets, when the solution discharge unit discharges the processing solution to a first position and a second position on the substrate, a hydrogen ion concentration of the processing solution discharged to the first position to be different from a hydrogen ion concentration of the processing solution discharged to the second position, and the first position is a center of the substrate or is located closer to the center of the substrate than the second position.
1 . A substrate processing method of processing a substrate, the substrate processing method comprising:
discharging a processing solution onto a rotating substrate to etch a film on the substrate,
wherein the processing solution includes a first material and a second material, and the first material is a material that etches the film, and the second material is a material that activates the first material,
the processing solution is discharged to a first location on the substrate and a second location on the substrate, and
a hydrogen ion concentration of the processing solution discharged at the first location is set to be different from a hydrogen ion concentration of the processing solution discharged at the second location.
2 . The substrate processing method of claim 1 , wherein the first position is a center of the substrate, or a position closer to the center of the substrate than the second position, and
the hydrogen ion concentration of the processing solution discharged at the second position is higher than the hydrogen ion concentration of the processing solution discharged at the first position.
3 . The substrate processing method of claim 1 , wherein the first material is a hydrogen peroxide solution, and
the second material is an alkaline solution.
4 . The substrate processing method of claim 1 , wherein the second position is located closer to an edge of the substrate than to a center position of the substrate, among the positions from the center position of the substrate to the edge of the substrate.
5 . The substrate processing method of claim 1 , wherein a mixing ratio of the first material and the second material in the processing solution discharged at the first position is set to a first ratio,
a mixing ratio of the first material and the second material in the processing solution discharged at the second position is set to a second ratio, and
the first ratio and the second ratio are set such that a content of the second material is 5% to 30% of a content of the first material.
6 . The substrate processing method of claim 5 , wherein the second ratio is set such that the content of the second material is higher than the content of the second material in the first ratio.
7 . The substrate processing method of claim 1 , wherein the film is a TiN layer.
8 . A substrate processing method of processing a substrate, the substrate processing method comprising:
discharging a processing solution onto a rotating substrate to etch a TiN film on the substrate,
wherein the processing solution includes a hydrogen peroxide solution and an alkaline solution, and the hydrogen peroxide solution is a material for etching the film, and the alkaline solution is a material for activating the hydrogen peroxide solution,
the processing solution is discharged to a first location on the substrate and a second location on the substrate, and
the first position is a center of the substrate, or a position closer to the center of the substrate than the second position, and
the hydrogen ion concentration of the processing solution discharged at the second position is higher than the hydrogen ion concentration of the processing solution discharged at the first position,
a mixing ratio of the first material and the second material in the processing solution discharged at the first position is set to a first ratio,
a mixing ratio of the first material and the second material in the processing solution discharged at the second position is set to a second ratio, and
the first ratio and the second ratio are set such that a content of the second material is 5% to 30% of a content of the first material, and
the second ratio is set such that the content of the second material is higher than the content of the second material in the first ratio.