Substrate comprising a lid structure, package substrate comprising the same and semiconductor device
View Patent ↗Example embodiments provide a package substrate including a lid structure. The package substrate includes a substrate, a semiconductor element arranged on one surface of the substrate, and a lid surrounding at least a portion of the semiconductor element. The lid includes a region extending outwardly beyond the outer periphery of the substrate.
1 . A substrate comprising:
a base substrate that is glass; and
a lid structure,
wherein the lid structure comprises an accommodation space accommodating an element and a frame surrounding at least a portion of the accommodation space,
wherein the lid structure is arranged on a surface of the base substrate, and is divided into an inner region and an outer region,
wherein the inner region is disposed on the surface of the base substrate and the outer region is a region exclusive of the inner region,
wherein the outer region is a portion of the lid structure that, in a plan view, extends beyond the surface of the base substrate,
wherein the outer region, in the plan view, has an outer vertical edge and an inner vertical edge opposite the outer vertical edge, and
wherein the frame comprises a plurality of holding holes, each recessed inwardly from the outer vertical edge to the inner vertical edge, the plurality of holding holes including at least one holding hole at each of two opposite edges of the lid structure.
2 . The substrate according to claim 1 , wherein a diagonal length of the lid structure is greater than a diagonal length of the base substrate.
3 . The substrate according to claim 1 , wherein a length of the lid structure measured at one edge of the substrate comprising the lid structure is 1% to 10% greater than a length of the base substrate measured at the same edge.
4 . The substrate according to claim 1 , wherein a redistribution layer is arranged between the base substrate and the accommodation space and a sum of weights of the base substrate and the redistribution layer is greater than a weight of the frame.
5 . The substrate according to claim 1 , wherein the base substrate comprises a plurality of side surfaces, and
wherein the lid structure further comprises a side closing portion surrounding all the plurality of side surfaces of the base substrate.
6 . The substrate according to claim 1 , wherein when the coefficients of thermal expansion of the base substrate and the lid structure at 25° C. are defined as Cs and Cl, respectively, a ratio Cl/Cs is 0.02 to 1.2.
7 . The substrate according to claim 1 , wherein the lid structure has a thermal conductivity of 50 W/mK to 425 W/mK.
8 . The substrate according to claim 1 , wherein the lid structure has a tensile strength of 12 MPa to 670 MPa.
9 . A substrate comprising:
a base substrate that is glass; and
a lid structure,
wherein the lid structure comprises an accommodation space accommodating an element and a frame surrounding at least a portion of the accommodation space,
wherein the lid structure is arranged on a surface of the base substrate, and is divided into an inner region and an outer region,
wherein the inner region is disposed on the surface of the base substrate and the outer region is a region exclusive of the inner region,
wherein the outer region is a portion of the lid structure that, in a plan view, extends beyond the surface of the base substrate,
wherein the outer region, in the plan view, has an outer vertical edge and an inner vertical edge opposite the outer vertical edge,
wherein a length of the lid structure measured at one edge of the substrate comprising the lid structure is 0% to 10% greater than a length of the base substrate measured at the same edge, and
wherein the frame comprises a plurality of holding holes, each recessed inwardly from the outer vertical edge to the inner vertical edge, the plurality of holding holes including at least one holding hole at each of two opposite edges of the lid structure.
10 . A package substrate according to claim 1 , comprising:
the substrate of claim 1 ; and the element,
wherein the element is accommodated in the accommodation space.
11 . The package substrate according to claim 10 , further comprising a top surface closing portion closing a top surface of the element.
12 . The package substrate according to claim 10 ,
wherein the height of a top surface of the lid structure is identical to or different by 10 μm or less from that of a top surface of the element.
13 . A package substrate comprising: the substrate of claim 9 ; and the element,
wherein the element is accommodated in the accommodation space.
14 . The package substrate according to claim 13 , further comprising a top surface closing portion closing a top surface of the element.
15 . A semiconductor device comprising: the substrate of claim 1 ;
the element arranged in the accommodation space; and
a printed circuit board connected to the substrate.
16 . A semiconductor device comprising:
the substrate of claim 9 ;
at least one element arranged in the accommodation space; and
a printed circuit board connected to the substrate.
17 . The package substrate according to claim 11 , wherein the top surface closing portion has a thickness of 10 μm to 1000 μm from its top surface to its bottom surface.
18 . The substrate according to claim 1 , wherein the lid structure has a thickness of 50 μm to 3000 μm from a bottom surface of the lid structure disposed on the base substrate to a top surface of the lid structure.