Electronic package having a chip with a trench in the surface
An electronic package and a manufacturing method thereof are provided, in which a full-panel wafer is provided and includes a plurality of electronic bodies arranged in an array at intervals, a plurality of trenches are formed across the electronic bodies along a first direction on the full-panel wafer, so that the trenches on a single electronic body are arranged parallel to each other at interval and along a second direction perpendicular to the first direction. Then, in a singulation process, any trench can be selected for cutting to obtain a plurality of electronic elements of a required size. Finally, each of the electronic elements is disposed on a packaging region of a carrier structure, so that each of the electronic elements is electrically connected to at least a portion of electrical contact pads in the packaging region.
1 . An electronic package, comprising:
a carrier structure with a surface thereof being defined with a packaging region, wherein the packaging region has a plurality of electrical contact pads therein; and
an electronic element having an active surface and an inactive surface opposing the active surface, wherein the active surface has a plurality of electrode pads, and the electronic element is electrically connected to at least a portion of the plurality of electrical contact pads via the plurality of electrode pads thereof,
wherein the active surface of the electronic element has at least one trench.
2 . The electronic package of claim 1 , wherein the trench is a pre-cut line without penetrating through the electronic element.
3 . The electronic package of claim 1 , wherein the at least one trench is a plurality of trenches, and at least one of the plurality of electrode pads is disposed between any two of the plurality of trenches.
4 . The electronic package of claim 1 , wherein the plurality of electrode pads of the electronic element are bonded to at least the portion of the plurality of electrical contact pads via a plurality of conductive bumps.
5 . The electronic package of claim 1 , wherein a quantity of the electrode pads is less than or equal to a quantity of the electrical contact pads.
6 . The electronic package of claim 1 , wherein another portion of the plurality of electrical contact pads is free from being electrically connected to the electrode pads.
7 . The electronic package of claim 1 , wherein an area of the active surface of the electronic element is less than or equal to an area of the packaging region.
8 . The electronic package of claim 7 , wherein the area of the active surface of the electronic element is equal to the area of the packaging region, so that the entire packaging region is covered by the electronic element.
9 . The electronic package of claim 7 , wherein the area of the active surface of the electronic element is less than the area of the packaging region, so that a portion of a surface of the packaging region is exposed.
10 . A method for manufacturing an electronic package, the method comprising:
providing a full-panel wafer comprising a plurality of electronic bodies arranged in an array at intervals, wherein each of the electronic bodies has an active surface and an inactive surface opposing the active surface, the active surface has a plurality of electrode pads, and a plurality of trenches across each of the electronic bodies along a first direction are formed on the full-panel wafer, wherein the plurality of trenches on each of the electronic bodies are arranged parallel to each other at interval and along a second direction perpendicular to the first direction, wherein the active surface of the electronic element has at least one trench of the plurality of trenches;
selecting one of the plurality of trenches to perform a singulation process to obtain a plurality of electronic elements; and
disposing each of the electronic elements on a carrier structure, wherein a surface of the carrier structure is defined with a packaging region, the packaging region has a plurality of electrical contact pads therein, and each of the electronic elements is electrically connected to at least a portion of the plurality of electrical contact pads via the plurality of electrode pads thereof.
11 . The method of claim 10 , wherein the trench is a pre-cut line without penetrating through each of the electronic elements.
12 . The method of claim 10 wherein the at least one trench is a plurality of trenches, and at least one of the plurality of electrode pads is disposed between any two of the plurality of trenches.
13 . The method of claim 10 , wherein the plurality of electrode pads of each of the electronic elements are bonded to at least the portion of the plurality of electrical contact pads via a plurality of conductive bumps.
14 . The method of claim 10 , wherein a quantity of the electrode pads is less than or equal to a quantity of the electrical contact pads.
15 . The method of claim 10 , wherein another portion of the plurality of electrical contact pads is free from being electrically connected to the electrode pads.
16 . The method of claim 10 , wherein an area of the active surface of each of the electronic elements is less than or equal to an area of the packaging region.
17 . The method of claim 16 , wherein the area of the active surface of each of the electronic elements is equal to the area of the packaging region, so that the entire packaging region is covered by each of the electronic elements.
18 . The method of claim 16 , wherein the area of the active surface of each of the electronic elements is less than the area of the packaging region, so that a portion of a surface of the packaging region is exposed.