IP Library Granted Patent US 12672573
Granted Patent B2
US 12672573 · App. 17/949,142 · Granted Jun 30, 2026

Flexible package

Inventor: Wei-Hao Chang (Kaohsiung, TW)
Assignee: Advanced Semiconductor Engineering, Inc.
H10W70/688H10W70/611H10W70/65H10W70/685H10W74/114H10W74/121H10W70/655H10W72/252H10W74/15H10W90/724H10W90/734
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Quick Facts
Patent No.
US 12672573
App. No.
17/949,142
Filed
Sep 20, 2022
Granted
Jun 30, 2026
Kind
B2
Art Unit
2817
USPC
257/734
Abstract

A flexible package is provided. The flexible package includes a first carrier and a second carrier. The second carrier is electrically connected to the first carrier. The second carrier is at least partially embedded in the first carrier, and an electrical connection interface between the first carrier and the second carrier is within the first carrier.

Claims (21)

1 . A flexible package, comprising:

a first carrier; and

a second carrier electrically connected to the first carrier, wherein the second carrier is at least partially embedded in the first carrier, and an electrical connection interface between the first carrier and the second carrier is within the first carrier,

wherein a hardness of the second carrier is greater than a hardness of the first carrier,

wherein a top surface of the second carrier comprises a first portion covered by the first carrier.

2 . The flexible package as claimed in claim 1 , wherein a CTE or a glass transition temperature (Tg) of the second carrier is less than a CTE or a Tg of the first carrier.

3 . The flexible package as claimed in claim 1 , wherein the second carrier has a bottom surface opposite to the top surface, and an elevation of a top surface of the first carrier is between an elevation of the top surface and an elevation of the bottom surface of the second carrier.

4 . The flexible package as claimed in claim 1 , wherein the second carrier has a lateral surface angled with the top surface, and the lateral surface has a first portion and a second portion non-coplanar to the first portion.

5 . The flexible package as claimed in claim 1 , wherein the top surface of the second carrier further comprises a second portion substantially coplanar with a top surface of the first carrier.

6 . The flexible package as claimed in claim 1 , wherein the first carrier has a top surface and a bottom surface opposite to the top surface, and an elevation of the top surface of the second carrier is lower than an elevation of the top surface of the first carrier with respect to the bottom surface of the first carrier.

7 . The flexible package as claimed in claim 1 , further comprising an electronic component disposed on and electrically connected to the second carrier, wherein a projection of the electronic component is entirely within the top surface of the second carrier.

8 . The flexible package as claimed in claim 7 , further comprising a first protective element encapsulating the electronic component, wherein the first carrier has a first region contacting the second carrier and spaced apart from the first protective element.

9 . The flexible package as claimed in claim 8 , wherein the first protective element comprises a protrusion embedded in the first carrier.

10 . The flexible package as claimed in claim 8 , wherein a top surface of the first carrier has a first portion covered by the first protective element and a second portion exposed by the first protective element.

11 . The flexible package as claimed in claim 8 , an edge of the first protective element is substantially aligned with or recessed with respect to an edge of the second carrier.

12 . The flexible package as claimed in claim 8 , further comprising a second protective element between the electronic component and the first protective element, wherein a Young's modulus of the first protective element is less than a Young's modulus of the second protective element.

13 . The flexible package as claimed in claim 9 , wherein the protrusion of the first protective element contacts the second carrier and lateral surfaces of the first carrier.

14 . The flexible package as claimed in claim 13 , wherein a width of the protrusion is greater than a width of the electronic component and less than a width of the second carrier.

15 . The flexible package as claimed in claim 13 , wherein a contact interface between the first carrier and the protective element and a contact interface between the second carrier and the protective element are at different elevations.

16 . The flexible package as claimed in claim 1 , wherein the first carrier is electrically connected to the second carrier through a solder-free connection structure comprising the electrical connection interface.

17 . The flexible package as claimed in claim 1 , further comprising a protective element over the first carrier, wherein the second carrier comprises a stepped structure, and the first carrier comprises a portion extending into a space between the protective element and a stepped surface of the stepped structure to interlock with the second carrier.