IP Library Granted Patent US 12673341
Granted Patent B2
US 12673341 · App. 18/844,141 · Granted Jul 7, 2026

Method for operating a cold glue application device, and device for applying cold glue

Inventor: Bertram Heddergott (Buettstedt, DE)
Assignee: 4BoxProducer.com Ltd.
B05B17/06B05D5/10
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Quick Facts
Patent No.
US 12673341
App. No.
18/844,141
Granted
Jul 7, 2026
Kind
B2
Abstract

A method is provided for operating a cold glue applicator device having an applicator connected to a glue reservoir so that cold glue can be applied to a target material. The method includes: generating moist air by using a moist air generating device that has an ultrasonic evaporator; and feeding the generated moist air as inflow air that flows externally against the applicator. An inflow temperature, namely the temperature of the inflow air, is set by a temperature adjusting device. The inflow temperature is set to a temperature value above the dew point temperature of the inflow air. A corresponding cold glue applicator also is provided.

Claims (29)

1 . A method of operating a cold glue applicator ( 10 ) having an application means connected to a glue reservoir ( 16 ) so that the application means can apply cold glue to a target material, said method comprising:

generating moist air ( 18 ) by means of a moist air generating device ( 20 ) comprising an ultrasonic evaporator ( 22 ) with an open water bath ( 24 ) that is set into-high frequency oscillation during operation by an ultrasonic generator ( 26 ), and

feeding the generated moist air ( 18 ) externally against the application means as inflow air ( 18 ′),

wherein:

an inflow temperature of the inflow air ( 18 ′) is set by a temperature adjusting device to a temperature value above the dew point temperature of the inflow air ( 18 ′); and

the temperature adjusting device has a water bath cooler ( 36 ″) that cools the water bath ( 24 ) so that a generation temperature at which the moist air ( 18 ) is generated is set so that the inflow air ( 18 ′) has the inflow temperature.

2 . The method of claim 1 , wherein at least one of the moist air ( 18 ) and the open water bath in the moist air generating device ( 20 ) is treated antibacterially.

3 . The method of claim 1 , wherein at least one of the moist air ( 18 ) and the open water bath in the moist air generating device ( 20 ) is treated fungicidally.

4 . A method of operating a cold glue applicator ( 10 ) having an application means connected to a glue reservoir ( 16 ) so that the application means can apply cold glue to a target material, said method comprising:

generating moist air ( 18 ) by means of a moist air generating device ( 20 ) comprising an ultrasonic evaporator ( 22 ) with an open water bath ( 24 ) that is set into-high frequency oscillation during operation by an ultrasonic generator ( 26 ), and

feeding the generated moist air ( 18 ) externally against the application means as inflow air ( 18 ′),

wherein:

an inflow temperature of the inflow air ( 18 ′) is set by a temperature adjusting device to a temperature value above the dew point temperature of the inflow air ( 18 ′); and

the temperature adjusting device has a cold trap ( 34 ) through which the moist air ( 18 ) passes before it is fed to the application means and in which the moist air ( 18 ) is cooled to a target temperature, the cold trap ( 34 ) is dimensioned such that the inflow air ( 18 ′) has the inflow temperature.

5 . The method of claim 4 , wherein moisture precipitating in the cold trap ( 34 ) is returned to the water bath.

6 . The method of claim 4 , wherein moisture precipitating in the cold trap ( 34 ) is discharged as waste water and/or as cooling water.

7 . The method of claim 4 , wherein at least one of the moist air ( 18 ) and the open water bath in the moist air generating device ( 20 ) is treated antibacterially.

8 . The method of claim 4 , wherein at least one of the moist air ( 18 ) and the open water bath in the moist air generating device ( 20 ) is treated fungicidally.

9 . A method of operating a cold glue applicator ( 10 ) having an application means connected to a glue reservoir ( 16 ) so that the application means can apply cold glue to a target material, said method comprising:

generating moist air ( 18 ) by means of a moist air generating device ( 20 ) comprising an ultrasonic evaporator ( 22 ) with an open water bath ( 24 ) that is set into-high-frequency oscillation during operation by an ultrasonic generator ( 26 ), and

feeding the generated moist air ( 18 ) externally against the application means as inflow air ( 18 ′),

wherein:

an inflow temperature of the inflow air ( 18 ′) is set by a temperature adjusting device to a temperature value above the dew point temperature of the inflow air ( 18 ′); and

the temperature adjusting device has a supply air cooler ( 36 ′), by means of which a supply air ( 32 ) is cooled in such a way that a generation temperature, namely the temperature at which the moist air ( 18 ) is generated, is set in such a way that the inflow air ( 18 ′) has the inflow temperature.

10 . The method of claim 9 , wherein a setting specification for the inflow temperature is continuously determined based on repeated temperature measurements and the temperature adjusting device is actuated for a correspondingly tracking adjustment of the inflow temperature.

11 . The method of claim 10 , wherein a nozzle temperature of an application nozzle ( 12 ), an air temperature of a room air at the installation site of the cold glue applicator ( 10 ), a wall temperature and/or floor temperature of room boundaries at the installation site of the cold glue applicator ( 10 ) and/or a temperature of peripheral machine parts are determined by the temperature measurements.

12 . The method of claim 9 , wherein the inflow temperature is fixed.

13 . The method of claim 9 , wherein at least one of the moist air ( 18 ) and the open water bath in the moist air generating device ( 20 ) is treated antibacterially.

14 . The method of claim 9 , wherein at least one of the moist air and the open water bath in the moist air generating device ( 20 ) is treated fungicidally.