Ultrasonic bonding device and wire guiding module therefor
An ultrasonic bonding device includes a bonding head movable and/or positionable in a movement axis and rotatable and/or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the bonding wire; an elongated wire feed that is cylindrical in cross-section; a first wire guiding module having an inlet and outlet opening for the bonding wire, and being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and a second wire guiding module having an elongated guide channel for the bonding wire, the second guide channel having an inlet and outlet opening, the second wire guiding module being provided between the wire feed and the first wire guiding module.
1 . An ultrasonic bonding device, comprising:
a bonding head at least one of movable and positionable in at least one movement axis and at least one of rotatable and positionable about a rotational axis, the bonding head comprising a tool configured to ultrasonically bond a bonding wire and a transducer module configured to excite the tool to produce ultrasonic vibrations;
a stationary wire supply for the bonding wire;
an elongated wire feed that is cylindrical in cross-section;
a first wire guiding module having an inlet opening and an outlet opening for the bonding wire, the first wire guiding module being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and
a second wire guiding module having an elongated guide channel for the bonding wire, the elongated guide channel having an inlet opening and an outlet opening, the second wire guiding module being provided between the elongated wire feed and the first wire guiding module,
wherein the first and the second wire guiding modules each comprise part of the bonding head,
wherein, on the bonding head, a holder is provided by which an end of the elongated wire feed facing the second wire guiding module is fixed on the bonding head,
wherein the bonding head provides a module carrier on which the holder for the elongated wire feed and the second wire guiding module are fixed adjacently to one another,
wherein the first wire guiding module is held on the module carrier, and
wherein the first and the second wire guiding modules are fixed with respect to the tool and the transducer module so as to movable together with the tool and the transducer module.
2 . The ultrasonic bonding device of claim 1 , wherein at least one of:
a distance of the elongated guide channel to the rotational axis changes in an extension direction of the elongated guide channel,
a distance of the elongated guide channel to the rotational axis is smaller in a region of the inlet opening than in a region of the outlet opening.
3 . The ultrasonic bonding device of claim 1 , wherein the inlet opening of the elongated guide channel of the second wire guiding module is provided coaxially to the rotational axis.
4 . The ultrasonic bonding device of claim 1 , wherein at least one of the tool and an end portion of the elongated wire feed facing the second wire guiding module at least one of extend longitudinally in a direction of the rotational axis and are arranged at least one of coaxially to one another and coaxially to the rotational axis.
5 . The ultrasonic bonding device of claim 1 , wherein the transducer module is held on the module carrier.