IP Library › Granted Patent US 12,673,431

Granted Patent B2

US 12,673,431 · App. 18/514,818 · Granted Jul 7, 2026

System for processing a substrate in cleaning modules

Inventors: Jagan Rangarajan (San Jose, CA); Edward Golubovsky (San Jose, CA); Edwin Valazquez (San Jose, CA); Adrian S. Blank (Gilroy, CA); Steven M. Zuniga (Soquel, CA); Balasubramaniam C. Jagannathan (Bangalore, IN)

Assignee: Applied Materials, Inc.

B25J11/0095 B25J9/042 B25J11/0085 B25J15/0206

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Quick Facts

Patent No.: US 12,673,431
App. No.: 18/514,818
Granted: Jul 7, 2026
Kind: B2

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

Equipment is used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a substrate cleaning unit may include a pre-clean chamber that performs a pre-clean process on a substrate with the substrate in a horizontal orientation. The unit may also include a first cleaning chamber that performs a first cleaning process on the substrate with the substrate in a vertical orientation. The unit may also include a second cleaning chamber. The unit may also include an integrated cleaning and drying chamber that performs a cleaning and drying process on the substrate in the horizontal orientation. A substrate handler may transfer the substrate between the chambers. The first and second cleaning chambers may be positioned below the pre-clean chamber.

Claims (109)

1 . A substrate cleaning system, comprising:

a first substrate cleaning unit; and

a first substrate handler disposed adjacent to the first substrate cleaning unit, and configured to transfer a substrate from a polishing system to the first substrate cleaning unit,

wherein the first substrate cleaning unit comprises:

a first cleaning chamber configured to receive the substrate from the first substrate handler and to perform a first cleaning process on the substrate with the substrate in a horizontal orientation;

a second cleaning chamber configured to perform a second cleaning process on the substrate with the substrate in a vertical orientation;

a third cleaning chamber configured to perform a third cleaning process on the substrate with the substrate in the vertical orientation;

a fourth cleaning chamber configured to perform a fourth cleaning process on the substrate in the horizontal orientation; and

a second substrate handler comprising:

a first vertical actuator assembly coupled to a horizontal rail of a horizontal actuator assembly; and

a second vertical actuator assembly coupled to the horizontal rail of the horizontal actuator assembly, wherein

the first vertical actuator assembly, the second vertical actuator assembly, and the horizontal actuator assembly are configured to enable the transfer of the substrate within the first substrate cleaning unit, and

the first vertical actuator assembly is positionable within a first region of the horizontal actuator assembly and the second vertical actuator assembly is positionable within a second region of the horizontal actuator assembly, and

the first vertical actuator assembly and second vertical actuator assembly are each independently positionable along the horizontal rail.

2 . The substrate cleaning system according to claim 1 , wherein:

the first vertical actuator assembly comprises a second substrate handler configured to enable the transfer of the substrate between the first cleaning chamber and the second cleaning chamber, between the second cleaning chamber and the third cleaning chamber, or between the third cleaning chamber and the fourth cleaning chamber,

wherein the first substrate cleaning unit further comprises:

a fifth cleaning chamber configured to perform the fourth cleaning process on the substrate in the horizontal orientation, wherein the fourth cleaning chamber and the fifth cleaning chamber each comprise an integrated cleaning and drying module; and

the substrate cleaning system further comprises a second substrate cleaning unit, wherein the second substrate cleaning unit comprises:

a sixth cleaning chamber configured to receive the substrate from the first substrate handler and to perform the first cleaning process on the substrate with the substrate in the horizontal orientation;

a seventh cleaning chamber configured to perform the second cleaning process on the substrate with the substrate in the vertical orientation;

an eighth cleaning chamber configured to perform the third cleaning process on the substrate with the substrate in the vertical orientation; and

a ninth cleaning chamber configured to perform the fourth cleaning process on the substrate in the horizontal orientation; and

a tenth cleaning chamber configured to perform the fourth cleaning process on the substrate in the horizontal orientation,

wherein the ninth cleaning chamber and the tenth cleaning chambers each comprise the integrated cleaning and drying module.

3 . The substrate cleaning system according to claim 2 , further comprising:

a first feed gas box configured to deliver process gas to the fourth cleaning chamber; and

a second feed gas box configured to deliver a process gas to the fifth cleaning chamber.

4 . The substrate cleaning system according to claim 1 , wherein,

the first substrate cleaning unit further comprises a fifth cleaning chamber configured to perform the fourth cleaning process on the substrate in the horizontal orientation, wherein the fourth cleaning chamber and the fifth cleaning chamber each comprise an integrated cleaning and drying module, and

the first vertical actuator assembly comprises a second substrate handler configured to enable the transfer of the substrate from the respective third cleaning chamber to a selected one of the respective fourth and fifth cleaning chambers.

5 . The substrate cleaning system of claim 4 , wherein the integrated cleaning and drying module of the fourth cleaning chamber is positioned vertically below the respective integrated cleaning and drying module of the fifth cleaning chamber.

6 . The substrate cleaning system according to claim 1 , wherein the second cleaning chamber or the third cleaning chamber is positioned vertically below the first cleaning chamber by a distance greater than a diameter of the substrate.

7 . The substrate cleaning system of claim 1 , wherein the first vertical actuator comprises:

a first blade assembly comprising:

a gripping assembly including a pair of gripping blades, wherein the pair of gripping blades are configured to retain a substrate at its edges by use of a gripping actuator;

a first blade actuator for rotating the gripping assembly and the substrate about a first axis, wherein the first axis is substantially parallel to a front side of the substrate that is held at its edges; and

a second blade actuator for rotating the gripping assembly and the first blade actuator about a second axis, wherein the second axis is perpendicular to the vertical direction, and

wherein the actuator of the vertical actuator assembly is configured to cause the first blade assembly to be translated along the rail in the vertical direction.

8 . The substrate cleaning system of claim 7 , wherein the second substrate handler further comprises:

the first vertical actuator assembly comprising a first vertical rail and a first vertical actuator, wherein the first blade assembly is coupled to the first vertical rail and is configured to be positioned along the first vertical rail by the first vertical actuator, wherein the horizontal actuator assembly and the first and second vertical actuators of the second substrate handler are positioned on a first side of the first cleaning chamber that is adjacent to an external edge of the substrate cleaning system, and the first substrate handler is positioned on a side of the first cleaning chamber that is opposite to the first side.

9 . The substrate cleaning system of claim 8 , wherein the second substrate handler further comprises:

a second blade assembly comprising:

a gripping assembly comprising a pair of gripping blades and a gripping actuator, wherein the pair of gripping blades are configured to retain a substrate at its edges by use of the gripping actuator; and

the second vertical actuator assembly comprising a second vertical rail and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical rail and is configured to be positioned along the second vertical rail by the second vertical actuator,

wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and is configured to be positioned along the horizontal rail by a second rail actuator.

10 . The substrate cleaning system of claim 1 , wherein

the second substrate handler is configured to enable the transfer of the substrate between the first cleaning chamber and the second cleaning chamber or between the third cleaning chamber and the fourth cleaning chamber, and

a third substrate handler configured to enable the transfer of the substrate between the second cleaning chamber and the third cleaning chamber.

11 . The substrate cleaning system of claim 10 , wherein the substrate cleaning system further comprises a fourth substrate handler positioned to transfer the substrate from the fourth cleaning chamber to one or more loading stations.

12 . The substrate cleaning system of claim 10 , wherein the second substrate handler comprises:

a first actuator configured to rotate the substrate about a first rotational axis between the vertical orientation and the horizontal orientation; and

a second actuator configured to rotate the substrate about a second rotational axis, the second rotational axis perpendicular to the first rotational axis and a vertical direction.

13 . The substrate cleaning system of claim 12 , further comprising a rail, wherein the second actuator is coupled to the rail via the first actuator.

14 . The substrate cleaning system of claim 12 , wherein the third substrate handler comprises an actuator configured to rotate the substrate about an axis that is perpendicular to the vertical direction.

15 . A substrate cleaning system, comprising:

a first substrate cleaning chamber comprising a rotating buffing pad;

a second substrate cleaning chamber disposed below the first substrate cleaning chamber, the second substrate cleaning chamber comprising an actuator and one or more rollers;

a third substrate cleaning chamber disposed adjacent to the second substrate cleaning chamber, the third substrate cleaning chamber comprising an actuator and one or more rollers;

a fourth substrate cleaning chamber comprising one or more sweep arms;

a first vertical actuator assembly coupled to a horizontal rail of a horizontal actuator assembly, wherein the first vertical actuator assembly comprises a first blade assembly coupled to a portion of a first vertical rail of the first vertical actuator assembly that is aligned in a vertical direction, the first blade assembly comprising:

a gripping assembly including a pair of gripping blades, wherein the pair of gripping blades are configured to retain a substrate at its edges by use of a gripping actuator;

a second blade actuator for rotating the gripping assembly and the first blade actuator about a second axis, wherein the second axis is perpendicular to the vertical direction, and wherein an actuator of the first vertical actuator assembly is configured to cause the first blade assembly to be translated along the rail in the vertical direction; and

a second vertical actuator assembly coupled to the horizontal rail of the horizontal actuator assembly, wherein the first vertical actuator assembly and second vertical actuator assembly are each independently positionable along the horizontal rail.

16 . The substrate cleaning system of claim 15 , wherein

the fourth substrate cleaning chamber comprises a first opening oriented to receive a substrate from the first substrate handler,

the first opening is positioned on a first side of the fourth cleaning chamber, and

a second substrate handler of a factory interface, which is positioned adjacent to a second side of the fourth cleaning chamber, is configured to remove the substrate from the fourth substrate cleaning chamber through a second opening positioned on the second side of the fourth substrate cleaning chamber.

17 . A substrate cleaning system, comprising:

a first cleaning chamber configured to perform a first cleaning process on a substrate with the substrate in a horizontal orientation, wherein the first cleaning chamber comprises:

a first door positioned on a first side of the first cleaning chamber, wherein the first door is configured to receive the substrate from a first substrate handler; and

a second door positioned on a second side of the first cleaning chamber, wherein the second side is oriented orthogonal to the first side;

a second cleaning chamber configured to perform a second cleaning process on the substrate with the substrate in a vertical orientation;

a third cleaning chamber configured to perform a third cleaning process on the substrate with the substrate in the vertical orientation;

a fourth cleaning chamber configured to perform a fourth cleaning process on the substrate in the horizontal orientation;

a second substrate handler configured to access a substrate positioned in the first cleaning chamber through the second door and to transfer the substrate from the first cleaning chamber to the second cleaning chamber and from the third cleaning chamber to the fourth cleaning chamber; and

a third substrate handler configured to transfer the substrate from the second cleaning chamber to the third cleaning chamber.

18 . The substrate cleaning system of claim 17 , further comprises:

19 . The substrate cleaning system of claim 18 , wherein the second substrate handler is configured to transfer the substrate from the third cleaning chamber to a selected one of the fourth or fifth cleaning chambers.

20 . The substrate cleaning system of claim 18 , wherein the fourth cleaning chamber is positioned vertically above the fifth cleaning chamber, and the first cleaning chamber is positioned over at least one of the second cleaning chamber and the third cleaning chamber.

21 . The substrate cleaning system of claim 17 , wherein the second substrate handler further comprises:

a substrate handling device that comprises:

a vertical actuator assembly comprising a rail aligned in a vertical direction, and an actuator; and

a first blade assembly comprising:

a gripping assembly including a pair of gripping blades, wherein the pair of gripping blades are configured to retain a substrate at its edges by use of a gripping actuator;

a second blade actuator for rotating the gripping assembly and the first blade actuator about a second axis, wherein the second axis is perpendicular to the vertical direction, and

wherein the actuator of the vertical actuator assembly is configured to cause the first blade assembly to be translated along the rail in the vertical direction.

22 . The substrate cleaning system of claim 21 , wherein the second substrate handler further comprises:

a first vertical actuator assembly comprising a first vertical rail and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical rail and is configured to be positioned along the first vertical rail by the first vertical actuator; and

a horizontal actuator assembly comprising a horizontal rail and a first rail actuator, wherein the first vertical actuator assembly is coupled to a first portion of the horizontal rail and is configured to be positioned along the horizontal rail by the first rail actuator,

wherein the horizontal actuator assembly and the first vertical actuator is positioned at an external edge of the substrate cleaning system.

23 . The substrate cleaning system of claim 22 , wherein the third substrate handler further comprises:

a second blade assembly comprising:

a second vertical actuator assembly comprising a second vertical rail and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical rail and is configured to be positioned along the second vertical rail by the second vertical actuator,

wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and is configured to be positioned along the horizontal rail by a second rail actuator.

24 . The substrate cleaning system of claim 22 , further comprises:

a first feed gas box configured to deliver a process gas to the fourth cleaning chamber; and

a second feed gas box configured to deliver process gas to the fifth cleaning chamber,

wherein the fourth cleaning chamber is positioned vertically above the fifth cleaning chamber.

25 . The substrate cleaning system of claim 24 , wherein the third substrate handler further comprises:

a second blade assembly comprising:

wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and is configured to be positioned along the horizontal rail by a second rail actuator.