Resin-sealing method
There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.
1 . A resin-sealing method for carrying a sheet-shaped resin to be compression molded and a workpiece having an electronic component mounted on a plate-shaped member into a sealing mold, and performing compression molding, the resin-sealing method comprising:
a step of acquiring workpiece information on a mounting ratio of the electronic component mounted on the plate-shaped member or a total volume of the electronic component for each workpiece which is supplied from a workpiece supply part;
a step of calculating an amount of resin required for each workpiece from the workpiece information;
a resin supplying step of supplying the sheet-shaped resin to be compression molded by cutting out an appropriate amount of sheet-shaped resin to be compression molded into a predetermined shape corresponding to a shape of the workpiece without redundancy or deficiency for one-time compression molding over an entire periphery from a long resin sheet formed to have a predetermined thickness, the long resin sheet being unwound by a resin supply part;
a step of measuring an amount of the sheet-shaped resin to be compression molded cut out by the resin supply part by a measurement stage arranged on an upstream side of the sealing mold before the sheet-shaped resin to be compression molded is carried into the sealing mold, wherein after a measurement, the whole sheet-shaped resin to be compression molded is completely discarded in a case that the sheet-shaped resin to be compression molded is measured to be out of a range of the appropriate amount and another sheet-shaped resin to be compression molded is supplied by the resin supply part before the sheet-shaped resin to be compression molded is carried into the sealing mold;
a step of providing and holding a film on a resin feeding hole formed in a transport tool;
a step of dropping the sheet-shaped resin to be compression molded on the film held by the resin feeding hole;
a step of carrying the transport tool that holds the film and the sheet-shaped resin to be compression molded into the sealing mold; and
a step of carrying the workpiece into the sealing mold and clamping and compression-molding the workpiece, the film and the sheet-shaped resin to be compression molded.
2 . The resin-sealing method according to claim 1 ,
wherein, when the amount of resin is deficient according to the mounting ratio of the electronic component mounted on the plate-shaped member, an appropriate amount of sheet-shaped resin to be compression molded obtained by adding the deficient amount of resin is cut out.
3 . The resin-sealing method according to claim 2 , further comprising:
a computing step of computing the appropriate amount of sheet-shaped resin to be compression molded.
4 . The resin-sealing method according to claim 1 ,
wherein a required resin volume is calculated by subtracting the total volume of the electronic component mounted on the plate-shaped member from a volume of an empty cavity of the sealing mold such that the appropriate amount of sheet-shaped resin to be compression molded is cut out.
5 . The resin-sealing method according to claim 4 , further comprising:
a computing step of computing the appropriate amount of sheet-shaped resin to be compression molded.
6 . The resin-sealing method according to claim 1 , further comprising:
a computing step of computing the appropriate amount of sheet-shaped resin to be compression molded.
7 . A resin-sealing method for carrying a sheet-shaped resin to be compression molded and a workpiece having an electronic component mounted on a plate-shaped member into a sealing mold, and performing compression molding, the resin-sealing method comprising:
a step of acquiring workpiece information on a mounting ratio of the electronic component mounted on the plate-shaped member or a total volume of the electronic component for each workpiece which is supplied from a workpiece supply part;
a step of calculating an amount of resin required for each workpiece from the workpiece information;
a resin supplying step of supplying the sheet-shaped resin to be compression molded by cutting out an appropriate amount of sheet-shaped resin to be compression molded by a predetermined length without redundancy or deficiency for one-time compression molding for each workpiece from a long resin sheet formed to have a predetermined width and a predetermined thickness, the long resin sheet being unwound by a resin supply part;
a step of measuring an amount of the sheet-shaped resin to be compression molded cut out by the resin supply part by a measurement stage arranged on an upstream side of the sealing mold before the sheet-shaped resin to be compression molded is carried into the sealing mold, wherein after a measurement, the whole sheet-shaped resin to be compression molded is completely discarded in a case that the sheet-shaped resin to be compression molded is measured to be out of a range of the appropriate amount and another sheet-shaped resin to be compression molded is supplied by the resin supply part before the sheet-shaped resin to be compression molded is carried into the sealing mold;
a step of providing and holding a film on a resin feeding hole formed in a transport tool;
a step of dropping the sheet-shaped resin to be compression molded on the film held by the resin feeding hole;
a step of carrying the transport tool that holds the film and the sheet-shaped resin to be compression molded into the sealing mold; and
a step of carrying the workpiece into the sealing mold and clamping and compression-molding the workpiece, the film and the sheet-shaped resin to be compression molded.
8 . The resin-sealing method according to claim 7 ,
wherein, when the amount of resin is deficient according to the mounting ratio of the electronic component mounted on the plate-shaped member, an appropriate amount of sheet-shaped resin to be compression molded obtained by adding the deficient amount of resin is cut out.
9 . The resin-sealing method according to claim 8 , further comprising:
a computing step of computing the appropriate amount of sheet-shaped resin to be compression molded.
10 . The resin-sealing method according to claim 7 ,
wherein a required resin volume is calculated by subtracting the total volume of the electronic component mounted on the plate-shaped member from a volume of an empty cavity of the sealing mold such that the appropriate amount of sheet-shaped resin to be compression molded is cut out.
11 . The resin-sealing method according to claim 10 , further comprising:
a computing step of computing the appropriate amount of sheet-shaped resin to be compression molded.
12 . The resin-sealing method according to claim 7 , further comprising:
a computing step of computing the appropriate amount of sheet-shaped resin to be compression molded.