Hollow resin particles, method for producing hollow resin particles, and use of hollow resin particles
Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).
1 . A hollow resin particle comprising a shell portion and a hollow portion surrounded by the shell portion,
wherein the shell portion has an ether structure represented by formula (1),
and
wherein the hollow resin particle has an average particle diameter of 0.3 μm to 50.0 μm.
2 . The hollow resin particle according to claim 1 , wherein the hollow portion is composed of one hollow region.
3 . The hollow resin particle according to claim 1 , wherein the hollow portion is composed of a plurality of hollow regions.
4 . The hollow resin particle according to claim 1 , wherein the hollow portion is composed of a porous structure.
5 . The hollow resin particle according to claim 1 , wherein the hollow resin particle has a 5% thermal weight loss temperature of 300° C. or higher when a temperature of the hollow resin particle is increased at a rate of 10° C./min in a nitrogen atmosphere.
6 . The hollow resin particle according to claim 1 , wherein the hollow resin particle is used for a resin composition for a semiconductor component.
7 . The hollow resin particle according to claim 1 , wherein the hollow resin particle is used for a paint composition.
8 . The hollow resin particle according to claim 1 , wherein the hollow resin particle is used for a heat-insulating resin composition.
9 . The hollow resin particle according to claim 1 , wherein the hollow resin particle is used for a light-diffusible resin composition.
10 . The hollow resin particle according to claim 1 , wherein the hollow resin particle is used for a light-diffusing film.
11 . The hollow resin particle according to claim 1 , wherein the hollow resin particle has an average particle diameter of 0.3 μm to 30.0 μm.
12 . The hollow resin particle according to claim 1 , wherein the hollow resin particle has an average particle diameter of 0.3 μm to 20.0 μm.
13 . A resin composition for a semiconductor component, containing the hollow resin particle according to claim 1 .
14 . A paint composition containing the hollow resin particle according to claim 1 .
15 . A heat-insulating resin composition containing the hollow resin particle according to claim 1 .
16 . A light-diffusible resin composition containing the hollow resin particle according to claim 1 .
17 . A light-diffusing film containing the hollow resin particle according to claim 1 .
18 . A method for producing the hollow resin particle according to claim 1 , the method comprising
reacting 20 parts by weight to 80 parts by weight of a compound (A) having an ether structure represented by formula (1) and 80 parts by weight to 20 parts by weight of a monomer (B) which reacts with the compound (A) (a total amount of the compound (A) and the monomer (B) is 100 parts by weight), in an aqueous medium in the presence of a non-reactive solvent,