Characteristic study of acrylic polymer dispersant coated on surface of polishing particle
View Patent ↗The invention relates to a polishing slurry composition, and more specifically, relates to a polishing slurry composition that has excellent thermal stability, dispersion stability, stability over time, and polishing efficiency compared to conventional polishing slurry compositions, and can minimize scratches on the surface to be polished. The polishing slurry composition of the present invention has excellent thermal stability, dispersion stability, stability over time, and polishing efficiency, so it can be widely used in fields such as abrasives for semiconductor wafer processing, biomedical, pharmaceutical, cosmetics, and catalysts.
1 . A polishing slurry composition comprising:
(a) one or more abrasives selected from the group consisting of aluminum oxide, silicon oxide, zirconium oxide and cerium oxide;
(b) a dispersant comprising ethylene-acrylic acid copolymer, salt of ethylene-acrylic acid copolymer, and styrene-maleic acid copolymer;
(c) a silane coupling agent oligomer; and
(d) a liquid carrier,
wherein the composition comprises 5 to 45% by weight of an abrasive, 1 to 15% by weight of dispersant, 2 to 10% by weight of a silane coupling agent oligomer, and the remaining amount of a liquid carrier,
a weight ratio of ethylene-acrylic acid copolymer, salt of ethylene-acrylic acid copolymer, and styrene-maleic acid copolymer is 100:30 to 50:10 to 30,
the silane coupling agent oligomer is prepared by reacting an acrylate group-containing silane coupling agent, an epoxy group-containing silane coupling agent, 2-hydroxyethyl acrylate (HEA), and 2-hydroxyethyl methacrylate (HEMA),
a weight ratio of the acrylate group-containing silane coupling agent, the epoxy group-containing silane coupling agent, 2-hydroxyethyl acrylate (HEA), and 2-hydroxyethyl methacrylate (HEMA) is 10 to 40:100:20 to 50:10 to 30, and
a weight average molecular weight of the silane coupling agent oligomer is 5,000 to 50,000 g/mol.
2 . A polishing slurry composition according to claim 1 ,
wherein the abrasive is cerium oxide.
3 . A polishing slurry composition according to claim 2 ,
wherein the composition further comprises one or more pH adjusters selected from the group consisting of trimethanolamine, triethanolamine, trimethylammonium hydroxide, triethylammonium hydroxide, dimethylbenzylamine, ethoxybenzylamine, sodium hydroxide, and potassium hydroxide.