Resin composition and cured product thereof
An object of the present invention is to provide an adhesive having sufficient adhesion strength during heat-curing when a lens holder and a substrate on which an imaging element is fixed are bonded in camera module assembly, and also having excellent adhesion strength and position accuracy after a high-temperature and high-humidity durability test after curing. The present invention relates to a resin composition comprises (a) a (meth)acrylate group-containing resin, (b) a specific polyfunctional thiol, and (c) a latent curing agent.
1 . A camera module assembly, comprising:
a substrate on which an imaging element is fixed;
a lens holder; and
a resin composition configured to bond the substrate and the lens holder, the resin composition comprising:
(a) a (meth)acrylate group-containing resin,
(b) a polyfunctional thiol having formula (2):
and
(c) a latent curing agent.
2 . The camera module assembly according to claim 1 , wherein the resin composition further comprises:
(d) at least one polymerization inhibitor selected from the group consisting of N-nitrosophenylhydroxylamine aluminum, triphenyl phosphite, p-methoxyphenol, and hindered phenol.
3 . The camera module assembly according to claim 1 , wherein the resin composition further comprises:
(e) an anionic polymerization inhibitor that is an organic acid.
4 . The camera module assembly according to claim 1 , wherein the resin composition further comprises:
(f) a photopolymerization initiator.
5 . The camera module assembly according to claim 1 , wherein the resin composition further comprises:
(g) epoxidized polybutadiene.
6 . A camera module, comprising:
a cured product obtainable by curing the resin composition of the camera module assembly according to claim 1 , wherein the cured product bonds the substrate and the lens holder.
7 . A camera module, comprising:
a substrate on which an imaging element is fixed;
a lens holder; and
a cured product bonding the substrate and the lens holder, wherein the cured product is formed by curing a resin composition comprising:
(a) a (meth)acrylate group-containing resin,
(b) a polyfunctional thiol having formula (2):
and
(c) a latent curing agent.
8 . A method for bonding a camera module lens holder and a camera module substrate on which an imaging element is fixed, the method comprising:
assembling the lens holder and the substrate using a resin composition;
the resin composition comprising:
(a) a (meth)acrylate group-containing resin,
(b) a polyfunctional having formula (2):
and
(c) a latent curing agent; and
curing the resin composition to bond the lens holder and the substrate.