Curable resin composition, a cured product, a laminated body composed of a cured product, and a method for disassembling thereof
The present invention relates to a curable resin composition capable of forming a cured product having excellent adhesive strength and easy dismantlability by an oxidizing agent, and capable of imparting excellent dismantlability when used as a primer to pretreat an adherend even when various adhesives, sealants, and coating agents are used. The curable resin composition includes the following components (A) and (B) but free of epoxy resin: Component (A): A compound having one or more (meth)acryloyl groups per molecule. Component (B): A hydrazide compound.
1 . A curable resin composition comprising the following components (A) to (C) but free of epoxy resin:
Component (A): Polyethylene glycol diacrylate;
Component (B): A hydrazide compound; and
Component (C): An inorganic filler;
wherein a melting point of the component (B) is 150 to 280° C., and wherein
the content of the component (C) is 1 to 100 parts by mass with respect to 100 parts by mass of the component (A).
2 . The curable resin composition according to claim 1 , wherein the component (A) consists only of (meth)acrylate monomers.
3 . The curable resin composition according to claim 1 , wherein the component (B) is selected from the group consisting of adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic dihydrazide, isophthalic acid dihydrazide, malonic acid dihydrazide, and succinic dihydrazide.
4 . The curable resin composition according to claim 1 , wherein the component (C) is selected from the group consisting of glass, silica, alumina, mica, ceramics, silicone rubber (powder), calcium carbonate, calcium oxide, aluminum nitride, carbon (powder), kaolin clay, wollastonite, and aluminum.
5 . A laminate comprising: a first adherend; and a layer of cured product formed by applying the curable resin composition according to claim 1 to a surface of the first adherend and curing the curable resin composition.
6 . A laminate obtained by applying the curable resin composition according to claim 1 to one or both of two adherends, bonding the two adherends sandwiching a region where the curable resin composition is applied, and then curing the curable resin composition.
7 . A laminate according to claim 5 , further comprising: a second adherend, wherein the second adherend is bonded to the first adherend sandwiching a region where an adhesive is further applied to the region where the curable resin composition is applied.
8 . The laminate according to claim 7 , wherein the adhesive contains at least one composition selected from the group consisting of thermosetting resin compositions, moisture-curing resin compositions, and photocurable resin compositions.
9 . The laminate according to claim 5 , wherein a coating agent is further applied to the region where the curable resin composition is applied and the curable resin composition and/or the coating agent is cured.
10 . The laminate according to claim 9 , wherein the coating agent contains at least one composition selected from the group consisting of thermosetting resin compositions, moisture-curing resin compositions, and photocurable resin compositions.
11 . A method of dismantling a laminate, comprising: contacting the laminate according to claim 5 with a dismantling agent to decompose the cured product of the curable resin composition in the laminate; and dismantling the laminate from the cured product.
12 . The method according to claim 11 , wherein the dismantling agent is an oxidizing agent.
13 . The method according to claim 11 , wherein the dismantling agent is hypochlorite.
14 . A method for preparing a curable resin composition comprising the following components (A) to (C) but free of epoxy resin:
Component (A): Polyethylene glycol diacrylate;
Component (B): A hydrazide compound; and
Component (C): An inorganic filler;
wherein a melting point of the component (B) is 150 to 280° C., and wherein
the content of the component (C) is 1 to 100 parts by mass with respect to 100 parts by mass of the component (A).
15 . The curable resin composition according to claim 1 , wherein the component (C) is a hydrophilic silica.
16 . The curable resin composition according to claim 1 , wherein the melting point of component (B) is 200 to 250° C.