IP Library Granted Patent US 12674248
Granted Patent B2
US 12674248 · App. 18/083,995 · Granted Jul 7, 2026

Plating apparatus, control method for plating apparatus and nonvolatile storage medium storing program

Inventors: Yosuke Nagasawa (Tokyo, JP); Tensei Sato (Tokyo, JP); Hideki Wakabayashi (Tokyo, JP)
Assignee: EBARA CORPORATION
C25D21/12C25D17/001C25D21/10
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Quick Facts
Patent No.
US 12674248
App. No.
18/083,995
Granted
Jul 7, 2026
Kind
B2
Abstract

The present disclosure provides a plating apparatus that can determine an acceleration at the time of an inappropriate deceleration of a transfer device that may cause contact between a substrate holder and a processing tank, a control method for a plating apparatus, and a storage medium storing a program. The plating apparatus according to the present disclosure includes a transfer device including an imaging device, the processing tank having an opening, a reference mark, and a control device, the control device is configured to be able to execute a test at a test acceleration, and the test includes: controlling, by the control device, the imaging device to capture a reference image when the transfer device is located at a determination position directly above the processing tank; moving the transfer device from a reference position to the determination position; controlling the imaging device to capture a comparison video when and after the transfer device stops; and determining, based on the reference image and the comparison video, whether the lower end portion of the substrate holder protrudes outside a region where the opening is extended in a vertical direction, to determine that the test acceleration has an inappropriate value when the lower end portion protrudes outside the region.

Claims (55)

1 . A plating apparatus comprising:

a transfer device for transferring a substrate holder in a vertical direction and a transfer direction perpendicular to the vertical direction, the transfer device including an imaging device,

a processing tank having an opening for the substrate holder to be put inside,

a reference mark, and

a control device that controls the transfer device and the imaging device, the plating apparatus having a first mode in which the control device is configured to execute a test at a test acceleration,

the test including:

controlling, by the control device, the imaging device to capture a reference image so that the opening and the reference mark are reflected, when the transfer device is located at a determination position directly above the processing tank;

moving, by the control device, the transfer device from a reference position to the determination position so that the transfer device gripping the substrate holder decelerates at the test acceleration and stops at the determination position;

controlling, by the control device, the imaging device to capture a comparison video so that the reference mark and a lower end portion of the substrate holder are reflected, when and after the transfer device stops; and

determining, by the control device, whether the lower end portion of the substrate holder protrudes outside a region where the opening is extended in the vertical direction when and after the transfer device stops, based on the reference image and the comparison video, to determine that the test acceleration has an inappropriate value when the lower end portion protrudes outside the region, wherein the control device performs normal operation of the plating apparatus using the acceleration that is not determined to be the inappropriate value.

2 . The plating apparatus according to claim 1 , wherein the test acceleration is constant from start of deceleration to stop.

3 . The plating apparatus according to claim 2 , wherein the control device is configured to execute the test at a plurality of test accelerations,

the control device repeatedly executes the test at the test accelerations in order from the test acceleration with the largest magnitude until the test acceleration that is not determined to have an inappropriate value is found, and

the control device outputs or stores, as a maximum allowable acceleration, the test acceleration that is not determined to have the inappropriate value and that is first found as a result of the repetition.

4 . The plating apparatus according to claim 1 , wherein the opening has a first end portion extending on a first straight line orthogonal to the transfer direction and the vertical direction, and a second end portion extending on a second straight line parallel to the first straight line,

the imaging device includes a first camera that images the lower end portion of the substrate holder, the first end portion and the reference mark,

the control device controls the first camera,

the reference mark is located between the first straight line and the second straight line in the transfer direction,

when the transfer device is located at the determination position, a center of the first camera is located directly above the opening, and

the test includes:

controlling, by the control device, the first camera to capture a first reference image so that the first end portion and the reference mark are reflected, at the determination position;

determining, by the control device, a first threshold from a length between the reference mark and the first end portion in the transfer direction, based on the first reference image;

controlling, by the control device, the first camera to capture a first comparison video so that the reference mark and the lower end portion of the substrate holder are reflected, when and after the transfer device stops;

sequentially determining, by the control device, a first variation comparison value from a length between the reference mark and the lower end portion of the substrate holder in the transfer direction, based on the first comparison video; and

comparing, by the control device, the first threshold and the first variation comparison value, to consider that the lower end portion of the substrate holder protrudes outside the region, when the first variation comparison value exceeds the first threshold.

5 . The plating apparatus according to claim 4 , wherein the control device:

sets, as the first threshold, the number of pixels from the reference mark to the first end portion in the transfer direction in the first reference image, and

sets, as the first variation comparison value, the number of pixels from the reference mark to the lower end portion of the substrate holder in the transfer direction in each still image constituting the first comparison video.

6 . The plating apparatus according to claim 4 , wherein the imaging device includes a second camera that images the lower end portion of the substrate holder, the second end portion and the reference mark,

the control device controls the second camera,

when the transfer device is located at the determination position, a center of the second camera is located directly above the opening, and

the test includes:

controlling, by the control device, the second camera to capture a second reference image so that the second end portion and the reference mark are reflected, at the determination position;

determining, by the control device, a second threshold from a length between the reference mark and the second end portion in the transfer direction, based on the second reference image;

controlling, by the control device, the second camera to capture a second comparison video so that the reference mark and the lower end portion of the substrate holder are reflected, when and after the transfer device stops;

sequentially determining, by the control device, a second variation comparison value from a length between the reference mark and the lower end portion of the substrate holder in the transfer direction, based on the second comparison video; and

comparing, by the control device, the second threshold and the second variation comparison value, to consider that the lower end portion of the substrate holder protrudes outside the region, when the second variation comparison value exceeds the second threshold.

7 . The plating apparatus according to claim 6 , wherein the control device:

sets, as the second threshold, the number of pixels from the reference mark to the second end portion in the transfer direction in the second reference image, and

sets, as the second variation comparison value, the number of pixels from the reference mark to the lower end portion of the substrate holder in the transfer direction in each still image constituting the second comparison video.

8 . The plating apparatus according to claim 6 , which is settable to a second mode during a normal operation, wherein in the second mode, the control device:

moves the transfer device from a reference position to the determination position so that the transfer device gripping the substrate holder stops at the determination position,

controls the first camera to capture a third comparison video so that the reference mark and the lower end portion of the substrate holder are reflected when and after the transfer device stops, and controls the second camera to capture a fourth comparison video so that the reference mark and the lower end portion of the substrate holder are reflected, sequentially determines, based on the third comparison video, a third variation comparison value from a length between the reference mark and the lower end portion of the substrate holder in the transfer direction,

sequentially determines, based on the fourth comparison video, a fourth variation comparison value from the length between the reference mark and the lower end portion of the substrate holder in the transfer direction, and

stops the transfer device when the third variation comparison value exceeds the first threshold or when the fourth variation comparison value exceeds the second threshold.

9 . The plating apparatus according to claim 1 , wherein the reference position includes positions directly above a load/unload station, a stocker, a prewet module, a presoak module, a first rinse module, a second rinse module, a blow module and a plating tank.

10 . The plating apparatus according to claim 1 , wherein the determination position includes positions directly above a load/unload station, a stocker, a prewet module, a presoak module, a first rinse module, a second rinse module, a blow module and a plating tank.

11 . The plating apparatus according to claim 1 , wherein in a third mode, the control device:

controls the imaging device to capture a first reference still image that is an image of the opening of the processing tank when the substrate holder is allowed to enter the processing tank through the opening,

controls the imaging device to capture a first comparison still image that is an image of the opening of the processing tank from a position at which the first reference still image is captured before the transfer device transfers the substrate holder into the processing tank, and

compares the first reference still image and the first comparison still image, to stop the transfer device when a match rate between the first reference still image and the first comparison still image is equal to or less than a predetermined value.

12 . The plating apparatus according to claim 1 , wherein in a fourth mode, the control device:

controls the imaging device to capture a second reference still image that is an image of a stocker when the substrate holder is housed in the stocker,

controls the imaging device to capture a second comparison still image that is an image of the stocker from a position at which the second reference still image is captured,

determines that the substrate holder is housed in the stocker when a match rate between the second reference still image and the second comparison still image is equal to or more than a predetermined value, determines that the substrate holder is not housed in the stocker when the match rate between the second reference still image and the second comparison still image is less than the predetermined value, and outputs or stores loading information of the substrate holder in the stocker.