IP Library Granted Patent US 12674554
Granted Patent B1
US 12674554 · App. 19/227,877 · Granted Jul 7, 2026

Circuit board having concave ribbon bonds

Inventors: Aaron Bradley Johnson (Allen Park, MI); Segundo Baldovino (Novi, MI); Michael Robertson (West Bloomfield, MI); Ketan K. Desai (Farmington Hills, MI)
Assignee: Ford Global Technologies, LLC
F21S41/192F21S41/151F21S45/47F21S45/49H05K1/181F21Y2103/10F21Y2115/10H05K2201/0382H05K2201/066H05K2201/10106H05K2201/1053H05K2201/2045
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Quick Facts
Patent No.
US 12674554
App. No.
19/227,877
Granted
Jul 7, 2026
Kind
B1
Abstract

A circuit board assembly has a circuit board with a mounting surface, first and second circuit components mounted on the circuit mounting surface, and first and second concave ribbon bonds extending between the first and second circuit components. The first and second ribbon bonds each have a first end connected to the first circuit component, a second end connected to the second circuit component and a concave portion extending between the first and second ends.

Claims (28)

1 . A circuit board assembly comprising:

a circuit board having a circuit mounting surface;

a first circuit component mounted on the circuit mounting surface;

a second circuit component mounted on the circuit mounting surface; and

a first concave ribbon bond extending between the first and second circuit components, the first concave ribbon bond having a first width greater than a first thickness and having a first end connected to the first circuit component, a second end connected to the second circuit component and a first concave portion extending downward between the first and second ends of the first concave ribbon bond, wherein the first concave portion of the first concave ribbon bond extends below a top surface of the first circuit component and a top surface of the second circuit component.

2 . The circuit board assembly of claim 1 , further comprising a second concave ribbon bond having a second width greater than a second thickness and extending between the first and second circuit components, the second concave ribbon bond having a first end connected to the first circuit component and a second end connected to the second circuit component and a second concave portion extending downward between the first and second ends of the second concave ribbon bond.

3 . The circuit board assembly of claim 2 , wherein the second concave portion of the second concave ribbon bond extends below the top surface of the first circuit component and the top surface of the second circuit component.

4 . The circuit board assembly of claim 1 , wherein the first circuit component comprises a light emitting diode (LED) chip.

5 . The circuit board assembly of claim 4 , wherein the LED chip is provided in a vehicle headlamp.

6 . The circuit board assembly of claim 1 , wherein the first component comprises one or more of a diode, a capacitor, an inductor and an LED chip.

7 . The circuit board assembly of claim 6 , wherein the second component comprises an electrical connector module.

8 . The circuit board assembly of claim 1 , wherein the first and second ends of the first and second concave ribbon bonds are each connected with a solder connection.

9 . The circuit board assembly of claim 1 , wherein the circuit board comprises a printed circuit board.

10 . The circuit board assembly of claim 9 , further comprising a heat sink thermally coupled to the printed circuit board.

11 . A vehicle lighting device comprising:

a lamp housing; and

a circuit board assembly disposed in the lamp housing, the circuit board assembly comprising:

a circuit board having a circuit mounting surface;

a first circuit component comprising an LED chip mounted on the circuit mounting surface;

a second circuit component mounted on the circuit mounting surface;

a first concave ribbon bond having a first width greater than a first thickness and extending between the first and second circuit components, the first concave ribbon bond having a first end connected to the first circuit component, a second end connected to the second circuit component and a first concave portion extending downward between the first and second ends of the first concave ribbon bond, wherein the first concave portion extends below a top surface of the first circuit component and a top surface of the second circuit component; and

a second concave ribbon bond having a second width greater than a second thickness and extending between the first and second circuit components, the second concave ribbon bond having a first end connected to the first circuit component and a second end connected to the second circuit component and a second concave portion extending downward between the first and second ends of the second concave ribbon bond, wherein the second concave portion extends below a top surface of the first circuit component and a top surface of the second circuit component.

12 . The vehicle lighting device of claim 11 , wherein the first circuit component comprises a light emitting diode (LED) chip.

13 . The vehicle lighting device of claim 12 , wherein the LED chip is provided in a vehicle headlamp.

14 . The vehicle lighting device of claim 11 , wherein the first component comprises one or more of a diode, a capacitor, an inductor and an LED chip.

15 . The vehicle lighting device of claim 14 , wherein the second component comprises an electrical connector module.

16 . The vehicle lighting device of claim 11 , wherein the circuit board comprises a printed circuit board.

17 . The vehicle lighting device of claim 16 , further comprising a heat sink thermally coupled to the printed circuit board.