Modular and adjustable lighting apparatus and methods
Modular lighting apparatus and method of using whereby a heat sink is provided including a first mechanical pad and a first mating electrical connector; and a light pod is releasably secured to the heat sink, wherein the light pod further includes a mounting ring, a second mechanical pad or secondary circuit board, and a second mating electrical connector; wherein the second mating electrical connector of the light pod mates with the first mating electrical connector of the heat sink; and wherein the second mechanical pad or secondary circuit board of the light pod makes contact with the first mechanical pad of the heat sink when the light pod is removably secured to the heat sink; and wherein the mounting ring tightens and releasably secures the light pod to the heat sink. The light pod is replaced after use without the need for tools.
1 . A modular light apparatus, wherein the apparatus comprises:
a heat sink, said heat sink comprising the first mechanical pad and a first mating electrical connector, wherein the mechanical pad is capable of transferring an electrical signal on its surface;
a light pod releasably secured to the heat sink, wherein the light pod further comprises a mounting ring, a second mechanical pad, and a second mating electrical connector;
a mother/daughter assembly, wherein the mother/daughter assembly includes a motherboard card and a removable daughter card;
a mother control board input, wherein the motherboard control input is embedded within the heat sink and the mother/daughter assembly removably couples to the mother control board input; and an output for the mother/daughter assembly, wherein the output is embedded within the beat sink and provides power to the light pod when the light pod is releasably secured to the heat sink;
wherein the second mating electrical connector of the light pod mates with the first mating electrical connector of the heat sink;
wherein the second mechanical pad of the light pod makes direct contact with the first mechanical pad of the heat sink when the light pod is removably secured to the heat sink; and
wherein the mounting ring tightens and secures the light pod to the heat sink when the light pod is removably secured to the heat sink.
2 . The apparatus of claim 1 , wherein the light pod further comprises a mechanical holder and a media emission surface, wherein the mechanical holder houses the media emission surface.
3 . The apparatus of claim 2 , wherein the media emission surface is selected form the group consisting of an optical lens, LED light source, TIR optics, a hexagonal cellular louver, an optical film, zoom sublens, collimator film laminated to a lens, color filter, diffused lens, occupancy sensor lens, Li-Fi lens, clear lens, and a beam spreader lens.
4 . The apparatus of claim 1 , wherein the light pod further comprises a light pod cap.
5 . The apparatus of claim 1 , further comprising a housing.
6 . The apparatus of claim 1 , further comprising a transfer board for receiving power and signals from said mother/daughter assembly.
7 . A modular light apparatus, wherein the apparatus comprises:
a heat sink, said heat sink comprising the first mechanical pad and a first mating electrical connector, wherein the mechanical pad is capable of transferring an electrical signal on its surface;
a light pod releasably secured to the heat sink, wherein the light pod further comprises a mounting ring, a secondary circuit board, and a second mating electrical connector;
a mother/daughter assembly, wherein the mother/daughter assembly includes a motherboard card and a removable daughter card;
a mother control board input, wherein the motherboard control input is embedded within the heat sink and the mother/daughter assembly removably couples to the mother control board input; and
an output for the mother/daughter assembly, wherein the output is embedded within the heat sink and provides power to the light pod when the light pod is releasably secured to the heat sink;
wherein the second mating electrical connector of the light pod mates with the first mating electrical connector of the heat sink;
wherein the secondary circuit board of the light pod makes direct contact with the first mechanical pad of the heat sink when the light pod is removably secured to the heat sink; and
wherein the mounting ring tightens and secures the light pod to the heat sink when the light pod is removably secured to the heat sink.
8 . The apparatus of claim 7 , wherein the light pod further comprises a mechanical holder and a media emission surface, wherein the mechanical holder houses the media emission surface.
9 . The apparatus of claim 8 , wherein the media emission surface is selected form the group consisting of an optical lens, LED light source, TIR optics, a hexagonal cellular louver, an optical film, zoom sublens, collimator film laminated to a lens, color filter, diffused lens, occupancy sensor lens, Li-Fi lens, clear lens, and a beam spreader lens.
10 . The apparatus of claim 7 , wherein the light pod further comprises a light pod cap.
11 . The apparatus of claim 7 , wherein the light pod further comprises a holder, wherein the secondary circuit board is mounted onto said holder.
12 . The apparatus of claim 7 , further comprising a housing.
13 . The apparatus of claim 7 , further comprising a transfer board for receiving power and signals from said mother/daughter assembly.
14 . A modular lighting apparatus, wherein the apparatus comprises:
a mounting unit to which a heat sink is coupled, said heat sink comprising an electrical conductor having a first connector, configured for coupling to a power supply, on a first end and a second connector on its other end, said second connector being positioned at a base portion of said heat sink, said connector having a pair of electrical contacts; and
a media holder comprising a transfer printed circuit board (PCB) and an optical assembly including a light source electrically coupled together, said transfer PCB comprising a corresponding pair of electrical contacts such that when said media holder is releasably secured to said base portion of said heat sink, corresponding pair of electrical contacts are in electrical contact with said pair of electrical contacts of said second connector, thereby powering said light source without the need to connect any connectors or wires together.
15 . The apparatus of claim 14 , wherein said second connector comprises a multi-port connector.
16 . The apparatus of claim 14 , wherein said first connector comprises a universal connector.
17 . The apparatus of claim 14 , wherein the media holder further comprises a chip on board holder.
18 . The apparatus of claim 14 , wherein the optical assembly comprises a lens and a housing.
19 . The apparatus of claim 14 , wherein the light source is selected from the group consisting of a light emitting diode (LED) bulb, an LED board, a laser, a halogen bulb, an incandescent bulb, and a compact florescent fluorescent bulb.
20 . The apparatus of claim 14 , further comprising a joint.
21 . The apparatus of claim 20 , wherein the joint is selected from the group consisting of a hinge and a ball-in-socket.
22 . The apparatus of claim 14 , further comprising a light blocking shield.
23 . A method of providing a modular light apparatus that requires no loose wires for electrically-powering said light apparatus, said method comprising:
providing a heat sink, wherein the heat sink comprises a first mechanical pad and a first mating electrical connector, wherein the first mechanical pad is capable of transferring an electrical signal on its surface;
providing a light pod, wherein the light pod comprises a mounting ring, a mechanical holder, and a media emission surface, a second mechanical pad, and a second mating electrical connector, wherein the mechanical holder houses the media emission surface;
a mother/daughter assembly, wherein the mother/daughter assembly includes a motherboard card and a removable daughter card;
a mother control board input, wherein the motherboard control input is embedded within the heat sink and the mother/daughter assembly removably couples to the mother control board input; and
an output for the mother/daughter assembly, wherein the output is embedded within the heat sink and provides power to the light pod when the light pod is releasably secured to the heat sink;
releasably securing the light pod to the heat sink by mating the second mating electrical connector of the light pod with the first mating electrical connector of the heat sink and allowing the second mechanical pad of the light pod to make direct contact with the first mechanical pad of the heat sink; and
tightening the mounting ring to releasably secure the light pod to the heat sink.
24 . The method of claim 23 , further including:
loosening the mounting ring after use of the light pod;
removing the light pod from the heat sink;
providing a second light pod; and
releasably securing the second light pod to the heat sink by mating a second mating electrical connector of the second light pod with the first mating electrical connector of the heat sink and allowing a second mechanical pad of the second light pod to make direct contact with the first mechanical pad of the heat sink; and
tightening a mounting ring of the second light pod to releasably secure the second light pod to the heat sink.
25 . The method of claim 23 , further comprising providing a transfer board and coupling the transfer board to the heat sink, said transfer board receiving power and signals from said mother/daughter assembly.