Probe pin cleaning pad and cleaning method for probe pin

1 . A probe pin cleaning pad, comprising:

a first adhesive layer;

a substrate layer, disposed on the first adhesive layer;

a second adhesive layer;

a foam layer, wherein the second adhesive layer is disposed between the substrate layer and the foam layer;

a cleaning layer, wherein a material of the cleaning layer comprises:

silicone resin, having a cross-linked network structure; and

organic particles, having a Mohs hardness of less than 7; and

a polishing layer, wherein the cleaning layer is disposed between the foam layer and the polishing layer, wherein a material of the polishing layer comprises:

resin; and

inorganic particles, having a Mohs hardness of large than or equal to 7,

wherein:

the foam layer has a closed-cell structure;

the density of the foam layer is 0.1 g/cm 3 to 0.6 g/cm 3 ;

the foam layer is disposed between the second adhesive layer and the cleaning layer;

a portion of the cleaning layer is embedded in the foam layer;

a portion of the second adhesive layer is embedded in the foam layer; and

the probe pin cleaning pad is adapted for a probe pin with a plurality of substances attached thereto to penetrate through the polishing layer and to further penetrate into the cleaning layer for cleaning, and during the probe pin being sequentially extracted from the cleaning layer and the polishing layer, the plurality of substances is removed from the probe pin and are captured and/or trapped in the cross-linked network structure of the silicon resin of the cleaning layer.

2 . The probe pin cleaning pad according to claim 1 , wherein the cleaning layer is sandwiched between the foam layer and the polishing layer, and/or the foam layer and the polishing layer are in contact with two opposite sides of the cleaning layer.

3 . The probe pin cleaning pad according to claim 1 , wherein a thickness of the foam layer is greater than or equal to 200 μm and less than or equal to 1 mm.

4 . The probe pin cleaning pad according to claim 1 , wherein the organic particles are not catalysts during a reaction for forming the silicone resin.

5 . The probe pin cleaning pad according to claim 1 , wherein a Young's modulus of the polishing layer is larger than a Young's modulus of the cleaning layer.

6 . The probe pin cleaning pad according to claim 1 , further comprising:

a release layer or composite material layer,

where the first adhesive layer is disposed on the release layer or composite material layer.

7 . A cleaning method for a probe pin, comprising:

step 1: testing an electronic component by the probe pin; and

step 2: after step 1, cleaning the probe pin by the probe pin cleaning pad according to claim 1 .

8 . The cleaning method for a probe pin according to claim 7 , wherein step 1 and step 2 are performed in-situ or on-line.