IP Library › Granted Patent US 12674944
Granted Patent B2
US 12674944 · App. 18/190,223 · Granted Jul 7, 2026

Photonic device and method of manufacture

Inventors: Tung-Liang Shao (Hsinchu, TW); Hsing-Kuo Hsia (Jhubei City, TW); Chen-Hua Yu (Hsinchu, TW); Chih-Ming Ke (Hsinchu, TW); Chih-Wei Tseng (Hsinchu, TW); You-Rong Shaw (Hsinchu, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
G02B6/4214
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Quick Facts
Patent No.
US 12674944
App. No.
18/190,223
Granted
Jul 7, 2026
Kind
B2
Abstract

In some embodiments, a photonic device includes a photonic interconnect structure that includes a first cladding layer; a waveguide over the first cladding layer; a second cladding layer disposed over the waveguide; a transparent material in the first cladding layer and the second cladding layer, the transparent material includes a first sidewall adjacent to the waveguide and a second sidewall tilted with respect to the first sidewall of the transparent material; and a first reflective film over the second sidewall of the transparent material. In some embodiments, the photonic device also includes a light-receiving structure that includes a transparent protrusion above the transparent material, the transparent protrusion including a first sidewall and a second sidewall opposite to the second sidewall of the transparent protrusion; and a second reflective film over the second sidewall of the transparent protrusion and horizontally overlapping the first reflective film.

Claims (48)

1 . A photonic device, comprising:

a photonic interconnect structure comprising:

a first cladding layer;

a waveguide disposed over the first cladding layer;

a second cladding layer disposed over the waveguide and the first cladding layer;

a transparent material disposed in the first cladding layer and the second cladding layer, wherein the transparent material comprises a first sidewall directly facing the waveguide, wherein the transparent material comprises a second sidewall tilted with respect to the first sidewall of the transparent material; and

a first reflective film disposed over the second sidewall of the transparent material; and

a light-receiving structure disposed over the photonic interconnect structure, the light-receiving structure comprising:

a transparent protrusion above the transparent material, the transparent protrusion comprising a first sidewall and a second sidewall opposite to the first sidewall of the transparent protrusion, wherein the second sidewall of the transparent protrusion is a curved sidewall; and

a second reflective film disposed over the second sidewall of the transparent protrusion and horizontally overlapping the first reflective film.

2 . The photonic device of claim 1 , further comprising an electrical interconnect structure disposed below the photonic interconnect structure.

3 . The photonic device of claim 2 , wherein the electrical interconnect structure comprises a transparent dielectric layer and a conductive feature disposed in the transparent dielectric layer, wherein the electrical interconnect structure comprises a transparent area free of the conductive feature, wherein the transparent area horizontally overlaps a sidewall of the waveguide.

4 . The photonic device of claim 1 , wherein the transparent material and the first reflective film collectively have a triangular shape, a fan shape, or a trapezoidal shape.

5 . The photonic device of claim 1 , wherein the transparent material is in physical contact with the waveguide.

6 . The photonic device of claim 1 , wherein the first reflective film extends over a top surface of the second cladding layer.

7 . The photonic device of claim 1 , wherein the waveguide comprises a tapered end in a plan view.

8 . The photonic device of claim 1 , wherein the light-receiving structure further comprises an optical fiber attached to the first sidewall of the transparent protrusion.

9 . The photonic device of claim 8 , wherein the light-receiving structure further comprises a transparent layer, wherein the transparent protrusion and the optical fiber are disposed over the transparent layer.

10 . The photonic device of claim 9 , wherein the transparent layer comprises a groove recessed from a top surface of the transparent layer, wherein the optical fiber comprises at least a portion disposed in the groove.

11 . The photonic device of claim 10 , wherein the groove of the transparent layer comprises a V-shape or a U-shape in a cross-sectional view.

12 . A photonic device, comprising:

a photonic interconnect structure comprising:

a first cladding layer;

a waveguide disposed over the first cladding layer;

a second cladding layer disposed over the waveguide and the first cladding layer;

a transparent material disposed in the first cladding layer and the second cladding layer, wherein the transparent material comprises a first sidewall directly facing and in physical contact with the waveguide, wherein the transparent material comprises a second sidewall tilted with respect to the first sidewall of the transparent material; and

a first reflective film disposed over the second sidewall of the transparent material; and

an electrical interconnect structure disposed below the photonic interconnect structure;

a light-receiving structure disposed over the photonic interconnect structure, the light-receiving structure comprising:

a transparent protrusion above the transparent material, the transparent protrusion comprising a first sidewall and a second sidewall opposite to the first sidewall of the transparent protrusion, wherein the second sidewall of the transparent protrusion is a curved sidewall; and

a second reflective film disposed over the second sidewall of the transparent protrusion and horizontally overlapping the first reflective film.

13 . The photonic device of claim 12 , wherein the transparent material and the first reflective film collectively have a triangular shape.

14 . The photonic device of claim 12 , wherein the transparent material and the first reflective film collectively have a fan shape.

15 . The photonic device of claim 12 , wherein the transparent material and the first reflective film collectively have a trapezoidal shape.

16 . A photonic device, comprising:

a photonic interconnect structure comprising:

a first cladding layer;

a waveguide disposed over the first cladding layer, wherein the waveguide comprises a tapered end in a plan view;

a second cladding layer disposed over the waveguide and the first cladding layer;

a transparent material disposed in the first cladding layer and the second cladding layer, wherein the transparent material comprises a first sidewall directly facing the waveguide, wherein the transparent material comprises a second sidewall tilted with respect to the first sidewall of the transparent material; and

a first reflective film disposed over the second sidewall of the transparent material, wherein the first reflective film extends over a top surface of the second cladding layer; and

a light-receiving structure disposed over the photonic interconnect structure, the light-receiving structure comprising:

a transparent protrusion above the transparent material, the transparent protrusion comprising a first sidewall and a second sidewall opposite to the first sidewall of the transparent protrusion, wherein the second sidewall of the transparent protrusion is a curved sidewall; and

a second reflective film disposed over the second sidewall of the transparent protrusion and horizontally overlapping the first reflective film.

17 . The photonic device of claim 16 , wherein the light-receiving structure further comprises an optical fiber attached to the first sidewall of the transparent protrusion.

18 . The photonic device of claim 16 , wherein the light-receiving structure further comprises a transparent layer, wherein the transparent protrusion and the optical fiber are disposed over the transparent layer.

19 . The photonic device of claim 18 , wherein the transparent layer comprises a groove recessed from a top surface of the transparent layer, wherein the optical fiber comprises at least a portion disposed in the groove.

20 . The photonic device of claim 19 , wherein the groove of the transparent layer comprises a V-shape in a cross-sectional view.