IP Library Granted Patent US 12675018
Granted Patent B2
US 12675018 · App. 19/032,952 · Granted Jul 7, 2026

Variable pitch fan-out routing for display panels having narrow borders

Inventors: You Ben Yin (Hsinchu City, TW); Quan Yu (Shanghai, CN); Yueh-Lin Yang (Zhubei City, TW)
Assignee: PARADE TECHNOLOGIES, LTD
G02F1/13452G02F1/13338G02F1/13458G06F3/0412G06F3/04166G06F3/0443
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Quick Facts
Patent No.
US 12675018
App. No.
19/032,952
Granted
Jul 7, 2026
Kind
B2
Abstract

An electronic device has a display substrate including a display area, a driver area, and a fan-out area. The fan-out area is divided to a plurality of fan-out regions, and has interconnects configured to access display elements formed on the display area. The driver area is adjacent to the fan-out area and configured to receive a driver chip having a plurality of pads. The interconnects of the fan-out area include a subset of first interconnects. Each first interconnect passes a first fan-out region and a second fan-out region to access a respective display element. A first portion of the subset of first interconnects is formed on the first fan-out region with a first interconnect pitch, and a second portion of the subset of first interconnects is formed on the second fan-out region with a second interconnect pitch different from the first interconnect pitch.

Claims (42)

1 . An electronic device, comprising:

a display substrate;

a display area formed on the display substrate and having a plurality of display elements; and

a fan-out area located adjacent to the display area on the display substrate and having a plurality of interconnects, wherein the fan-out area is divided to a plurality of fan-out regions;

wherein the plurality of interconnects include a subset of first interconnects, and each first interconnect passes a first fan-out region and a second fan-out region to access the display area, the first fan-out region having a region width equal to or greater than a driver width of a driver chip, the second fan-out region being external to the first fan-out region; and

wherein a first portion of the subset of first interconnects is formed on the first fan-out region with a first interconnect pitch, and a second portion of the subset of first interconnects is formed on the second fan-out region with a second interconnect pitch, the second interconnect pitch different from the first interconnect pitch.

2 . The electronic device of claim 1 , wherein the second interconnect pitch of the subset of first interconnects in the second fan-out region is greater than the first interconnect pitch of the subset of first interconnects in the first fan-out region.

3 . The electronic device of claim 1 , wherein the first portion of the subset of first interconnects has a first interconnect width, and the second portion of the subset of first interconnects has a second interconnect width, the second interconnect width greater than the first interconnect width.

4 . The electronic device of claim 1 , wherein the fan-out area further includes a third fan-out region, the second fan-out region located between the first and third fan-out regions, and each first interconnect passes the third fan-out region.

5 . The electronic device of claim 4 , wherein a third portion of the subset of first interconnects is formed on the third fan-out region with a third interconnect pitch, the second interconnect pitch greater than the first interconnect pitch and less than the third interconnect pitch.

6 . The electronic device of claim 1 , wherein the plurality of interconnects include a second interconnect passing the first fan-out region to access the display area, and the second interconnect does not extend to the second fan-out region and has a substantially uniform pitch equal to the first interconnect pitch of the subset of first interconnects in the first fan-out region.

7 . The electronic device of claim 1 , further comprising:

a driver area adjacent to the fan-out area and configured to receive the driver chip including a plurality of pads, each pad configured to be electrically coupled to the display area via a respective interconnect routed on the fan-out area.

8 . The electronic device of claim 7 , where the plurality of interconnects passes the first fan-out region to access the plurality of pads of the driver chip.

9 . The electronic device of claim 1 , wherein the driver chip includes an interconnect compensation component configured to generate electrical signals that compensate for parasitics of one or more interconnects of the plurality of interconnects actively.

10 . The electronic device of claim 1 , wherein the driver chip is flip-chip assembled to the display substrate, thereby facilitating each first interconnect to contact a respective first pad of the driver chip.

11 . The electronic device of claim 1 , wherein the first portion of the subset of first interconnects is partially or entirely concealed between the display substrate and the driver chip, and the second portion of the subset of first interconnects lies on the display substrate without being concealed by the driver chip.

12 . The electronic device of claim 1 , wherein the electronic device is one of a laptop display, a tablet computer display, and a mobile phone display, and the electronic device includes at least a source driver configured to drive the plurality of display elements and a timing controller configured to control driving of the plurality of display elements in a synchronous manner.

13 . An apparatus, comprising:

a display substrate;

a display area formed on the display substrate and having a plurality of display elements; and

a fan-out area located adjacent to the display area on the display substrate and having a plurality of interconnects, wherein the fan-out area is divided to a plurality of fan-out regions;

wherein the plurality of interconnects include a subset of first interconnects, and each first interconnect passes a first fan-out region and a second fan-out region to access the display area, the first fan-out region having a region width equal to or greater than a driver width of a driver chip, the second fan-out region being external to the first fan-out region; and

wherein a first portion of the subset of first interconnects is formed on the first fan-out region with a first interconnect pitch, and a second portion of the subset of first interconnects is formed on the second fan-out region with a second interconnect pitch, the second interconnect pitch different from the first interconnect pitch.

14 . The apparatus of claim 13 , wherein:

the second fan-out region is immediately adjacent to the first fan-out region; and

the second interconnect pitch of the subset of first interconnects in the second fan-out region is determined based on a first interconnect length of the subset of first interconnects.

15 . The apparatus of claim 14 , wherein:

the plurality of interconnects include a subset of second interconnects, and each second interconnect passes the first fan-out region to access the display area; and

the subset of second interconnects have an alternative interconnect pitch and an alternative interconnect length; and

the second interconnect pitch of the subset of first interconnects in the second fan-out region is determined based on the first interconnect length of the subset of first interconnects, the alternative interconnect pitch, and the alternative interconnect length.

16 . The apparatus of claim 13 , wherein:

the plurality of fan-out regions include a transition region connecting the first and second fan-out regions;

a pitch of the subset of first interconnects increases from the first interconnect pitch to the second interconnect pitch within the transition region.

17 . The apparatus of claim 16 , wherein for each first interconnect, a width of the respective first interconnect increases from a first interconnect width to a second interconnect width within the transition region, the second interconnect width greater than the first interconnect width.

18 . The apparatus of claim 13 , wherein the plurality of interconnects include a second interconnect, and the second interconnect passes the first fan-out region to access the display area, and at least a portion of the second interconnect is substantially parallel to a respective portion of each first interconnect.

19 . The apparatus of claim 13 , wherein:

the fan-out area includes and is symmetric with respect to a central axis, and the central axis is located in the first fan-out region and external to the second fan-out region;

the fan-out area further includes a fourth fan-out region;

the second and fourth fan-out regions are symmetric with respect to the central axis; and

a portion of a subset of third interconnects is formed on the fourth fan-out region with the second interconnect pitch.

20 . The apparatus of claim 13 , wherein the plurality of interconnects are formed on a single layer of conductive material, cannot cross each other, and are spatially ordered on the display substrate.