IP Library › Granted Patent US 12675048
Granted Patent B2
US 12675048 · App. 18/068,229 · Granted Jul 7, 2026

Flow cells and methods for making the same

Inventors: Jeffrey S. Fisher (San Diego, CA); Tanmay Ghonge (San Diego, CA); Sahngki Hong (San Diego, CA); Lewis J Kraft (San Diego, CA)
Assignee: Illumina, Inc.
G03F7/2026G03F7/0002G03F7/0035B29C59/026
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Quick Facts
Patent No.
US 12675048
App. No.
18/068,229
Granted
Jul 7, 2026
Kind
B2
Abstract

In a method, a resin layer of a stack (e.g., resin layer over sacrificial layer over transparent substrate) is imprinted to form a convex region including first region with first height and second region with second height <first height. Stack portions are etched around the convex region to expose a substrate portion. The stack is utilized to develop a curable layer to define a cured layer over the exposed substrate portion. The convex region and cured layer are etched. The resin layer and a sacrificial layer portion underlying the second region are removed. A second substrate portion is exposed and a third substrate portion remains covered by a remaining sacrificial layer portion. The cured layer is substantially co-planar with the remaining sacrificial layer portion. A depression is formed extending to the second substrate portion. The remaining sacrificial layer portion is utilized to define functionalized layers over different depression regions.

Claims (23)

1 . A method, comprising:

imprinting a resin layer of a multi-layer stack to form a multi-height convex region including a first region with a first height and a second region with a second height that is smaller than the first height, wherein the multi-layer stack includes the resin layer over a sacrificial layer over a transparent substrate;

selectively etching portions of the multi-layer stack around the multi-height convex region to expose a portion of the transparent substrate;

utilizing the multi-layer stack to develop a curable layer through the transparent substrate to define a cured layer over the exposed portion of the transparent substrate;

simultaneously etching i) the multi-height convex region to remove the resin layer and a portion of the sacrificial layer underlying the second region of the multi-height convex region, thereby exposing a second portion of the transparent substrate and whereby a third portion of the transparent substrate remains covered by a remaining portion of the sacrificial layer, and ii) the cured layer such that it is substantially co-planar with the remaining portion of the sacrificial layer, thereby forming a depression extending to the second portion of the transparent substrate; and

utilizing the remaining portion of the sacrificial layer to define first and second functionalized layers over different regions of the depression.

2 . The method as defined in claim 1 , wherein a thickness of the sacrificial layer corresponds to a depth of the depression.

3 . The method as defined in claim 1 , further comprising silanizing the second portion of the transparent substrate prior to utilizing the remaining portion of the sacrificial layer to define the first and second functionalized layers over different regions of the depression.

4 . The method as defined in claim 1 , wherein prior to utilizing the remaining portion of the sacrificial layer to define the first and second functionalized layers over different regions of the depression, the method further comprises applying the first functionalized layer over the cured layer, the remaining portion of the sacrificial layer, and the second portion of the transparent base support.

5 . The method as defined in claim 4 , wherein utilizing the remaining portion of the sacrificial layer to define the first and second functionalized layers over different regions of the depression involves:

lifting off the remaining portion of the sacrificial layer, thereby exposing the third portion of the transparent base support;

applying the second functionalized layer over the third portion of the transparent base support; and

removing the first functionalized layer from the cured layer.

6 . The method as defined in claim 5 , further comprising silanizing the third portion of the transparent base support prior to applying the second functionalized layer.

7 . The method as defined in claim 4 , wherein utilizing the remaining portion of the sacrificial layer to define the first and second functionalized layers over different regions of the depression involves:

applying a negative photoresist over the first functionalized layer;

directing, through the transparent base support, an ultraviolet light dosage, thereby forming an insoluble negative photoresist over a portion of the first functionalized layer that overlies the second portion of the transparent base support and a soluble negative photoresist over the cured layer and the remaining portion of the sacrificial layer;

removing the soluble negative photoresist;

etching the remaining portion of the sacrificial layer, thereby exposing the third portion of the transparent base support;

applying the second functionalized layer over the insoluble negative photoresist, the third portion of the transparent base support, and another portion of the first functionalized layer that overlies the cured layer;

removing the insoluble negative photoresist; and

removing the first and second functionalized layers from the cured layer.

8 . The method as defined in claim 7 , further comprising silanizing the third portion of the transparent base support prior to applying the second functionalized layer.