IP Library Granted Patent US 12675137
Granted Patent B2
US 12675137 · App. 18/610,018 · Granted Jul 7, 2026

Electronic device

Inventors: Hsin-Chih Chou (Taipei, TW); Juei-Chi Chang (Taipei, TW)
Assignee: Getac Technology Corporation
G06F1/1656H05K5/03
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Quick Facts
Patent No.
US 12675137
App. No.
18/610,018
Granted
Jul 7, 2026
Kind
B2
Abstract

An electronic device includes a casing, a cover, and a waterproof element. The casing has an opening. The cover is covered and assembled at the opening. The waterproof element includes a double-sided tape and an elastic body. The double-sided tape includes a first substrate, a first adhesive layer, and a second adhesive layer. The first adhesive layer and the second adhesive layer are coated on two opposite surfaces of the first substrate, respectively. The elastic body is fixed on the casing or the cover, adhered to the second adhesive layer, and tightly fitted to the cover or the casing repeatedly through the first adhesive layer.

Claims (25)

1 . An electronic device comprising:

a casing having an opening;

a cover covered and assembled at the opening; and

a waterproof element comprising:

a double-sided tape comprising a first substrate, a first adhesive layer, and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are respectively coated on two opposite surfaces of the first substrate, the first adhesive layer has a first adhesion force, and the second adhesive layer has a second adhesion force different than the first adhesion force; and

an elastic body fixed on the casing or the cover, wherein the elastic body is adhered to the second adhesive layer, and the elastic body is fitted to the cover or the casing repeatedly through the first adhesive layer.

2 . The electronic device according to claim 1 , wherein the elastic body is fixed on the cover, the elastic body is fitted to the casing repeatedly through the first adhesive layer, the first adhesion force is less than the second adhesion force, and the first adhesion force is adapted to allow the elastic body to be adhered to or peeled from the casing repeatedly through the first adhesive layer.

3 . The electronic device according to claim 1 , wherein the casing has a close-fit structure, the first adhesive layer contacts a planar surface of the casing, and the close-fit structure protrudes above the planar surface of the casing to press the elastic body.

4 . The electronic device according to claim 3 , wherein the close-fit structure is a protruding rib surrounding the opening, and the protruding rib forward presses the elastic body through the first adhesive layer.

5 . The electronic device according to claim 1 , wherein the waterproof element further comprises another double-sided tape, the another double-sided tape comprises a second substrate, a third adhesive layer, and a fourth adhesive layer, the third adhesive layer and the fourth adhesive layer are respectively coated on two opposite surfaces of the second substrate, the third adhesive layer is adhered to the elastic body, and the fourth adhesive layer is adhered to the cover.

6 . The electronic device according to claim 5 , wherein both an adhesion force between the third adhesive layer and the elastic body and an adhesion force between the fourth adhesive layer and the cover are greater than the first adhesion force.

7 . The electronic device according to claim 1 , wherein the elastic body is fixed on the casing, the elastic body is fitted to the cover repeatedly through the first adhesive layer, the first adhesion force is less than the second adhesion force, and the first adhesion force is adapted to allow the elastic body to be adhered to or peeled from the cover repeatedly through the first adhesive layer.

8 . The electronic device according to claim 1 , wherein the cover has a close-fit structure, the first adhesive layer contacts a planar surface of the cover, and the close-fit structure protrudes below the planar surface of the cover to press the elastic body.

9 . The electronic device according to claim 8 , wherein the close-fit structure is a plurality of protruding ribs, the plurality of protruding ribs surround an outer periphery of the cover and are spaced apart from each other, and the plurality of protruding ribs forward press the elastic body through the first adhesive layer.

10 . The electronic device according to claim 1 , wherein the elastic body is a foam or a rubber.

11 . The electronic device according to claim 1 , wherein a hardness of the elastic body is less than a hardness of the cover and less than a hardness of the casing.

12 . The electronic device according to claim 1 , wherein a top surface of the casing is coplanar with a top surface of the cover.

13 . The electronic device according to claim 1 , wherein a thickness of the elastic body, measured in a direction extending from the casing to a portion of the cover overlying the casing, at a middle of the elastic body is different than the thickness of the elastic body at an edge of the elastic body.

14 . The electronic device according to claim 1 , wherein the first adhesion force is less than the second adhesion force.

15 . The electronic device according to claim 1 , wherein the first adhesion force is 0.45±0.2 Kg/25 mm and the second adhesion force is greater than or equal to 1.3 Kg/25 mm.

16 . The electronic device according to claim 5 , wherein at least one of the third adhesive layer or the fourth adhesive layer has a third adhesion force, and the third adhesion force is greater than the first adhesion force.

17 . The electronic device according to claim 3 , wherein a bottom surface of the cover faces the close-fit structure, and a top surface of the cover, diametrically opposite the bottom surface, is coplanar with a top surface of the casing.

18 . The electronic device of claim 1 , wherein a first physical interface is defined between the first adhesive layer and the first substrate.

19 . The electronic device of claim 18 , wherein a second physical interface is defined between the first substrate and the second adhesive layer.

20 . The electronic device of claim 3 , wherein a bottom surface of the first substrate facing the close-fit structure is non-planar due to the close-fit structure.