Touch assembly and method of manufacturing the same

1 . A touch assembly, comprising:

a protective cover plate;

a first adhesive layer, disposed on the protective cover plate, wherein a thickness of the first adhesive layer is from 20 μm to 200 μm and an initial tack of the first adhesive layer is from 1800 gf/in to 4000 gf/in;

a plurality of curved wires, disposed on the first adhesive layer and comprising a first group of wires and a second group of wires, wherein the first group of wires extends along a first direction, the second group of wires extends along a second direction and is spliced with the first group of wires, and each of the plurality of curved wires comprises a conductive inner core and a covering layer; and

a second adhesive layer, covering the plurality of curved wires and the first adhesive layer.

2 . The touch assembly of claim 1 , wherein each of the plurality of curved wires is an enameled wire.

3 . The touch assembly of claim 1 , wherein a material of the covering layer is selected from a group consisting of polyvinyl formal, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide, polyimide, and a combination thereof.

4 . The touch assembly of claim 1 , wherein a wire diameter of the conductive inner core is from 2 μm to 5 μm.

5 . The touch assembly of claim 1 , wherein a thickness of the covering layer is from 1 μm to 3 μm.

6 . The touch assembly of claim 1 , wherein a thickness of the second adhesive layer is from 25 μm to 150 μm.

7 . The touch assembly of claim 1 , wherein the first adhesive layer and the second adhesive layer fill gaps within the first group of wires and gaps within the second group of wires.

8 . A manufacturing method of a touch assembly, comprising:

disposing a plurality of curved wires on a first adhesive layer, wherein the plurality of curved wire comprise a first group of wires and a second group of wires, the first group of wires extends along a first direction, the second group of wires extends along a second direction and is spliced with the first group of wires, each of the plurality of curved wires comprises a conductive inner core and a covering layer, and a thickness of the first adhesive layer is from 20 μm to 200 μm and an initial tack of the first adhesive layer is from 1800 gf/in to 4000 gf/in;

putting a second adhesive layer over the plurality of curved wires and the first adhesive layer such that the second adhesive layer covers the plurality of curved wires and the first adhesive layer; and

laminating the first adhesive layer on a protective cover plate such that the first adhesive layer is disposed on the protective cover plate.

9 . The manufacturing method of the touch assembly of claim 8 , wherein laminating the first adhesive layer on the protective cover plate comprises: placing an assembly of the first adhesive layer, the plurality of curved wires, and the second adhesive layer over the protective cover plate.

10 . The manufacturing method of the touch assembly of claim 9 , wherein disposing the plurality of curved wires on the first adhesive layer comprises:

winding enameled wire on to the first adhesive layer; and

cutting the enameled wire to form the plurality of curved wires.

11 . The manufacturing method of the touch assembly of claim 10 , wherein disposing the plurality of curved wires on the first adhesive layer further comprises:

disposing pre-embedded wire on the first adhesive layer before winding the enameled wire on to the first adhesive layer, wherein winding the enameled wire on to the first adhesive layer is configured to let the enameled wire partially cover over the pre-embedded wire;

wherein cutting the enameled wire to form the plurality of curved wires comprises:

peeling the pre-embedded wire from the first adhesive layer, causing the enameled wire to break and form the plurality of curved wires.

12 . The manufacturing method of the touch assembly of claim 11 , wherein a wire diameter of the pre-embedded wire is larger than a wire diameter of the enameled wire.

13 . The manufacturing method of the touch assembly of claim 11 , wherein putting the second adhesive layer over the plurality of curved wires and the first adhesive layer comprises:

coating hydrogel on the first adhesive layer to cover the plurality of curved wires; and

hardening the hydrogel to form the second adhesive layer.

14 . The manufacturing method of the touch assembly of claim 13 , wherein putting the second adhesive layer over the plurality of curved wires and the first adhesive layer further comprises:

placing a plate over the hydrogel; and

rolling a roller over the plate.

15 . The manufacturing method of the touch assembly of claim 10 , wherein cutting the enameled wire to form the plurality of curved wires is carried out through a laser cutting process.

16 . The manufacturing method of the touch assembly of claim 15 , further comprising:

putting the second adhesive layer over the enameled wire and the first adhesive layer before cutting the enameled wire to form the plurality of curved wires, wherein cutting the enameled wire to form the plurality of curved wires also simultaneously cuts the second adhesive layer.

17 . The manufacturing method of the touch assembly of claim 8 , wherein laminating the first adhesive layer on the protective cover plate is performed before disposing the plurality of curved wires on the first adhesive layer.

18 . The manufacturing method of the touch assembly of claim 8 , wherein putting the second adhesive layer over the plurality of curved wires and the first adhesive layer is to let the first adhesive layer and the second adhesive layer fill gaps within the first group of wires and gaps within the second group of wires.

19 . The manufacturing method of the touch assembly of claim 8 , further comprising: welding circuit board to the plurality of curved wires.