Multilayer electronic component
A multilayer electronic component includes a body having a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween, and an external electrode disposed on the body in a second direction perpendicular to the first direction and connected to the internal electrodes. The body includes an active portion including the internal electrodes to form capacitance and cover portions disposed on both end surfaces of the active portion in the first direction, and the cover portion includes a ceramic wire. The ceramic wire includes at least one or more groups arranged in one direction.
1 . A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween; and
an external electrode disposed on the body in a second direction perpendicular to the first direction and connected to the internal electrodes,
wherein the body includes:
an active portion including the internal electrodes to form capacitance, and
cover portions disposed on both end surfaces of the active portion in the first direction,
at least one of the cover portions comprises a dielectric layer and ceramic wires dispersed therewithin, wherein the ceramic wires include at least one group of the ceramic wires arranged in one direction, and
the dielectric layer between the internal electrodes is free of the ceramic wires.
2 . The multilayer electronic component of claim 1 , wherein the ceramic wires include at least one selected from SiC, TiC, TiO 2 , BaTiO 3 , ZnO, Al 2 O 3 , and fiberglass.
3 . The multilayer electronic component of claim 1 , wherein the ceramic wires include at least one of ceramic microwires and ceramic nanowires.
4 . The multilayer electronic component of claim 1 , wherein in the at least one group of ceramic wires arranged in the one direction, a number of the ceramic wires arranged in the one direction is 30% or more of a total number of the ceramic wires.
5 . The multilayer electronic component of claim 1 , wherein the ceramic wires further include another group of ceramic wires arranged in another direction.
6 . The multilayer electronic component of claim 5 , wherein the one direction is the second direction, and the another direction is a third direction.
7 . The multilayer electronic component of claim 1 , wherein at least one of the cover portions include an outer cover portion and an inner cover portion disposed between the active portion and the outer cover portion,
wherein the ceramic wires are selectively included in the inner cover portion or the outer cover portion.
8 . The multilayer electronic component of claim 1 , wherein the body further includes a margin portion disposed on both end surfaces of the active portion in a third direction perpendicular to the first and second directions,
wherein the margin portion includes the ceramic wires.
9 . The multilayer electronic component of claim 1 , wherein the external electrode includes:
a first electrode layer including a first conductive metal and glass and
a second electrode layer disposed on the first electrode layer and including a second conductive metal and a resin.
10 . A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween; and
an external electrode disposed on the body in a second direction perpendicular to the first direction and connected to the internal electrodes,
wherein the body includes:
an active portion including the internal electrodes to form capacitance and
a margin portion disposed on both end surfaces of the active portion in a third direction perpendicular to the first and second directions,
the margin portion comprises a dielectric layer and ceramic wires dispersed therewithin,
the ceramic wires include at least one group of the ceramic wires arranged in one direction, and
the dielectric layer between the internal electrodes is free of the ceramic wires.
11 . The multilayer electronic component of claim 10 , wherein the ceramic wire includes at least one of SiC, TiC, TiO 2 , BaTiO 3 , ZnO, Al 2 O 3 , and fiberglass.
12 . The multilayer electronic component of claim 10 , wherein the ceramic wires include at least one of ceramic microwires and ceramic nanowires.
13 . The multilayer electronic component of claim 10 , wherein in the at least one group of ceramic wires arranged in the one direction, a number of the ceramic wires arranged in the one direction is 30% or more compared to a total number of the ceramic wires.
14 . The multilayer electronic component of claim 10 , wherein the ceramic wires further include another group of ceramic wires arranged in another direction.
15 . The multilayer electronic component of claim 14 , wherein the one direction is the first direction, and the another direction is the second direction.
16 . The multilayer electronic component of claim 10 , wherein the margin portion includes an outer margin portion and an inner margin portion disposed between the active portion and the outer margin portion,
wherein the ceramic wires are selectively included in the inner margin portion or the outer margin portion.
17 . The multilayer electronic component of claim 10 , wherein the external electrode includes:
a first electrode layer disposed on the body and including a first conductive metal and glass, and
a second electrode layer disposed on the first electrode layer and including a second conductive metal and a resin.
18 . A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween; and
an external electrode disposed on the body in a second direction perpendicular to the first direction and connected to the internal electrodes,
wherein the body includes:
an active portion including the internal electrodes to form capacitance and
a margin portion disposed on both end surfaces of the active portion in a third direction perpendicular to the first and second directions,
the margin portion comprises a dielectric layer and at least one ceramic wire dispersed therewithin, and
the dielectric layer between the internal electrodes is free of the ceramic wires.
19 . The multilayer electronic component of claim 18 , wherein the dielectric layer is free of ceramic wire.
20 . The multilayer electronic component of claim 18 , wherein the at least one ceramic wire is arranged in the first direction.
21 . The multilayer electronic component of claim 18 , wherein the at least one ceramic wire includes at least one selected from SiC, TiC, TiO 2 , BaTiO 3 , ZnO, Al 2 O 3 , and fiberglass.
22 . The multilayer electronic component of claim 18 , wherein the at least one ceramic wire includes at least one of ceramic microwires and ceramic nanowires.
23 . The multilayer electronic component of claim 18 , wherein the margin portion includes an outer margin portion and an inner margin portion disposed between the active portion and the outer margin portion,
wherein the at least one ceramic wire is selectively included in the inner margin portion or the outer margin portion.