Packaging of roll-type solid electrolytic capacitor elements

1 . A method for quantity production of packaging structures of roll-type solid electrolytic capacitor including:

(a) providing a substrate, which includes on its surface multiple electrically conductive pads including electrically separated anodic conductive pads and cathodic conductive pads;

(b) disposing multiple roll-type solid electrolytic capacitor elements to surface of the substrate, each one of the multiple roll-type solid electrolytic capacitor elements with a roll axis perpendicular to the substrate and comprising an anodic lead and a cathodic lead, the anodic lead being electrically connected to one of the anodic conductive pads and the cathodic lead being electrically connected to one of the cathodic conductive pads;

(c) disposing a mold with a grid structure to partition the substrate with the multiple roll-type solid electrolytic capacitor elements into multiple individual cells such that each one of the multiple individual cells containing one of the multiple roll-type solid electrolytic capacitor elements;

(d) filling multiple individual cells with a liquid insulating material and then hardening the insulating material and then removing the mold with a grid structure so that the substrate and the capacitor elements and the insulating material join into an integral piece with multiple individual packaging structures partitioned by grooves;

(e) plating over outer conductive pads of the anodic conductive pads and the cathodic conductive pads to form external terminals;

(f) cutting the integral piece along the grooves to separate each of the multiple individual packaging structures.

2 . A packaging structure for roll-type solid electrolytic capacitor comprising:

a protective substrate comprising on its two surfaces electrically separated anodic conductive pads and cathodic conductive pads;

a roll-type solid electrolytic capacitor element disposed on the protective substrate with a roll axis perpendicular to the surfaces of the protective substrate, the capacitor element comprising an anodic lead and a cathodic lead, the anodic lead being electrically connected to the anodic conductive pads and the cathodic lead being electrically connected to the cathodic conductive pads;

an insulating material encompassing the capacitor element such that the protective substrate and the capacitor element and the insulating material form an integral solid body;

an anodic external terminal plated over an outer conductive pad of the anodic conductive pads and a cathodic external terminal plated over an outer conductive pad of the cathodic conductive pads, the anodic external terminal being electrically connected to the anodic conductive pads and the cathodic external terminal being electrically connected to the cathodic conductive pads.

3 . A packaging structure of claim 2 , wherein

the anodic conductive pads include an internal anodic conductive pad and the cathodic conductive pads include an internal cathodic conductive pad,

the anodic lead and the cathodic lead of the capacitor element are bent to reduce the distance between the capacitor element and the protective substrate.

4 . A packaging structure of claim 3 , wherein the anodic lead and the cathodic lead of the capacitor element comprise standard leads comprising copper clad end sections and a solder material joins the copper clad end sections to the internal anodic conductive pad and the internal cathodic conductive pad respectively.

5 . A packaging structure of claim 4 , wherein the internal anodic conductive pad and the internal cathodic conductive pad are electrically connected to the anodic external terminal and the cathodic external terminal respectively by plated through holes on the protective substrate.

6 . A packaging structure of claim 4 , wherein the protective substrate comprises an all-conductor substrate comprising a thin copper sheet, the conductive pads comprise parts of the thin copper sheet electrically separated by selective etching.

7 . A packaging structure of claim 3 , wherein the anodic lead and the cathodic lead of the capacitor element comprise aluminum leads.

8 . A packaging structure of claim 7 , wherein the anodic lead and the cathodic lead of the capacitor element are electrically connected to the internal anodic conductive pad and the internal cathodic conductive pad respectively by wire bonding and the internal anodic conductive pad and the internal cathodic conductive pad are electrically connected to the anodic external terminal and the cathodic external terminal respectively by plated through holes on the protective substrate.

9 . A packaging structure of claim 7 , wherein the anodic lead and the cathodic lead of the capacitor element are electrically connected to the internal anodic conductive pad and the internal cathodic conductive pad respectively by a conductive paste and the internal anodic conductive pad and the internal cathodic conductive pad are electrically connected to the anodic external terminal and the cathodic external terminal respectively by a conductive paste.

10 . A packaging structure of claim 7 , wherein the anodic lead and the cathodic lead of the capacitor element are electrically connected to the anodic external terminal and the cathodic external terminal respectively on side surfaces of the packaging structure through an inner nickel layer.

11 . A packaging structure of claim 3 , wherein

the anodic conductive pads and the cathodic conductive pads comprise through holes passing through the protective substrate;

the anodic lead of the capacitor element passes through the through holes on the anodic conductive pads and the cathodic lead of the capacitor element passes through the through holes on the cathodic conductive pads.

12 . A packaging structure of claim 11 , wherein

the anodic external terminal and the cathodic external terminal comprise plated copper;

the anodic lead and the cathodic lead of the capacitor element comprise aluminum leads;

the anodic lead and the cathodic lead of the capacitor element are electrically connected to the anodic external terminal and the cathodic external terminal respectively through an inner nickel layer.

13 . A packaging structure of claim 11 , wherein

the through holes are plated through holes;

the anodic lead and the cathodic lead of the capacitor element comprise standard leads with copper clad end sections and the copper clad end sections are electrically connected to the anodic conductive pads and the cathodic conductive pads respectively by applying a solder material;

the anodic external terminal and the cathodic external terminal comprise the applied solder material and copper plated over the applied solder material.

14 . An intermediate assembly structure for quantity production of multiple packaging structures of roll-type solid electrolytic capacitor comprising

a large substrate carrying on its surface multiple electrically conductive pads including anodic conductive pads and cathodic conductive pads;

multiple roll-type solid electrolytic capacitor elements disposed on surface of the large substrate, wherein

each one of the multiple roll-type solid electrolytic capacitor elements is disposed with a roll axis perpendicular to the large substrate and is encompassed by a separate individual packaging structure of an insulating material;

each one of the multiple roll-type solid electrolytic capacitor elements comprises an anodic lead and a cathodic lead, the anodic lead being electrically connected to one of the anodic conductive pads and the cathodic lead being electrically connected to one of the cathodic conductive pads; anodic external terminals plated over outer conductive pads of the anodic conductive pads and cathodic external terminals plated over outer conductive pads of the cathodic conductive pads;

thereby the intermediate assembly structure comprising the multiple packaging structures of roll-type solid electrolytic capacitors with each of the multiple packaging structures comprising:

a protective substrate comprising on its two surfaces at least one of the anodic conductive pads and at least one of the cathodic conductive pads, the anodic conductive pads and the cathodic conductive pads being electrically separated;

one of the roll-type solid electrolytic capacitor elements disposed on the protective substrate with a roll axis perpendicular to the surfaces of the protective substrate, the capacitor element comprising the anodic lead and the cathodic lead, the anodic lead being electrically connected to the at least one of the anodic conductive pads and the cathodic lead being electrically connected to the at least one of the cathodic conductive pads;

the insulating material encompassing the capacitor element such that the protective substrate and the capacitor element and the insulating material form an integral solid body;

the anodic external terminal plated over the outer conductive pad of the anodic conductive pads and the cathodic external terminal plated over the outer conductive pad of the cathodic conductive pads, the anodic external terminal being electrically connected to the anodic conductive pads and the cathodic external terminal being electrically connected to the cathodic conductive pads.