Piezoelectric vibration element having conductive etch stop, piezoelectric vibrator, and piezoelectric oscillator
A piezoelectric vibration element that includes a piezoelectric piece having a first principal surface and a second principal surface; a via electrode penetrating the piezoelectric piece from the first principal surface to the second principal surface thereof; a conductive etch stop film covering the via electrode on the second principal surface; and a wiring electrode covering at least part of an outer edge of the conductive etch stop film on the second principal surface.
1 . A piezoelectric vibration element comprising:
a piezoelectric piece having a first principal surface and a second principal surface;
a via electrode penetrating the piezoelectric piece from the first principal surface to the second principal surface thereof;
a conductive etch stop film covering the via electrode on the second principal surface; and
a wiring electrode covering at least part of an outer edge of the conductive etch stop film on the second principal surface.
2 . The piezoelectric vibration element according to claim 1 , wherein a material of the conductive etch stop film is nickel, copper or platinum.
3 . The piezoelectric vibration element according to claim 1 , wherein a thickness of the conductive etch stop film is 0.03 μm to 0.2 μm.
4 . The piezoelectric vibration element according to claim 1 , further comprising:
a protective electrode covering at least a portion of the wiring electrode.
5 . The piezoelectric vibration element according to claim 4 , wherein a material of the protective electrode is identical to a material of the wiring electrode.
6 . The piezoelectric vibration element according to claim 4 , wherein a thickness of the protective electrode is at least twice as large as a thickness of the wiring electrode.
7 . The piezoelectric vibration element according to claim 6 , wherein the thickness of the protective electrode is 0.3 μm to 1.0 μm.
8 . The piezoelectric vibration element according to claim 1 , further comprising:
a protective electrode covering an entirety of the wiring electrode.
9 . The piezoelectric vibration element according to claim 8 , wherein a material of the protective electrode is identical to a material of the wiring electrode.
10 . The piezoelectric vibration element according to claim 8 , wherein a thickness of the protective electrode is at least twice as large as a thickness of the wiring electrode.
11 . The piezoelectric vibration element according to claim 10 , wherein the thickness of the protective electrode is 0.3 μm to 1.0 μm.
12 . The piezoelectric vibration element according to claim 1 , wherein a material of the wiring electrode is aluminum.
13 . The piezoelectric vibration element according to claim 1 , further comprising:
a first excitation electrode provided to the first principal surface; and
a second excitation electrode provided to the second principal surface, wherein
the wiring electrode is electrically connected to the second excitation electrode.
14 . The piezoelectric vibration element according to claim 13 , wherein the wiring electrode and the second excitation electrode are integrally formed.
15 . The piezoelectric vibration element according to claim 13 , wherein a material of the first excitation electrode is identical to a material of the second excitation electrode.
16 . A piezoelectric vibrator comprising:
the piezoelectric vibration element according to claim 1 ; and
a support substrate supporting the piezoelectric vibration element so that the piezoelectric vibration element can vibrate.
17 . The piezoelectric vibrator according to claim 16 , further comprising:
a bonding layer bonding the piezoelectric vibration element and the support substrate.
18 . The piezoelectric vibrator according to claim 17 , wherein
a material of the bonding layer is silicon dioxide, and
the bonding layer bonds the second principal surface and the support substrate.
19 . A piezoelectric oscillator comprising:
the piezoelectric vibrator according to claim 16 ; and
a lid body attached to the support substrate so as to define a space therebetween for accommodating the piezoelectric vibration element.