Light emission assembly and an optical module
A light emission assembly including: a substrate; at least two channels including: a driving assembly including a driving chip; an EML laser assembly including an EML laser chip; a first magnetic bead; a second magnetic bead; a DC blocking capacitor; a driving multiplexing pad for electrically connecting a first end of the first magnetic bead with a signal pad of the driving chip and a first end of the DC blocking capacitor, a second end of the first magnetic bead being connected to a first supply voltage; an EML multiplexing pad for electrically connecting a first end of the second magnetic bead with the EML laser chip assembly and a second end of the DC blocking capacitor, a second end of the second magnetic bead being connected to a supply voltage of the EML laser chip. The present disclosure also provides an optical module including the light emission assembly.
1 . A light emission assembly configured to convert an electrical signal to an optical signal, comprising:
a substrate;
at least two channels carried by the substrate, wherein each channel comprises:
a driving assembly provided on a surface of the substrate, comprising a driving chip;
an EML laser assembly provided on the surface of the substrate, comprising an EML laser chip;
a first magnetic bead;
a second magnetic bead;
a DC blocking capacitor;
a filter capacitor;
a driving multiplexing pad provided on the surface of the substrate, configured to electrically connect a signal pad of the driving chip with a first end of the first magnetic bead, and to electrically connect said first end of the first magnetic bead to a first end of the DC blocking capacitor, wherein a second end of the first magnetic bead is connected to a power supply pin of a circuit board to provide a first supply voltage to the driving chip;
a driving power supply pad provided on the surface of the substrate, configured for electrically connecting a positive electrode of the driving chip with a first end of the filter capacitor, wherein a second end of the filter capacitor is connected to power supply pin of the circuit board to provide a second supply voltage different from the first supply voltage to the driving chip;
a first grounding pad of the driving chip provided adjacent to the driving chip, configured for electrically connecting a negative electrode of the driving chip and the substrate to realize grounding of the negative electrode of the driving chip; and
a second grounding pad of the driving chip provided adjacent to the driving chip, configured for electrically connecting the negative electrode of the driving chip and a negative electrode of the EML laser chip to achieve isolation between channels;
an EML multiplexing pad provided on the surface of the substrate, configured to electrically connect the EML laser chip assembly with a first end of the second magnetic bead, and to electrically connect said first end the second magnetic bead to a second end of the DC blocking capacitor, wherein a second end of the second magnetic bead is connected to a supply voltage of the EML laser chip;
wherein a first end of the driving power supply pad is electrically connected to a first end of the filter capacitor, and a second end of the driving power supply pad is electrically connected to a positive electrode of the driving chip; and wherein a second end of the filter capacitor is electrically connected to power supply pin of the circuit board to provide the second voltage to the driving chip.
2 . The light emission assembly according to claim 1 , wherein the channel further comprises:
a third grounding pad of the EML laser chip provided adjacent to the EML laser chip, configured for electrically connecting a negative electrode of the EML laser chip with the substrate to realize grounding of the negative electrode of the EML laser chip; and
a fourth grounding pad of the EML laser chip provided adjacent to the EML laser chip, configured for electrically connecting the negative electrode of the EML laser chip with a negative electrode of the driving chip to achieve isolation between channels.
3 . The light emission assembly according to claim 1 , wherein a first end of the filter capacitor is electrically connected to a power supply pin of the circuit board, and a second end of the filter capacitor is grounded.
4 . The light emission assembly according to claim 1 , wherein the second end of the first magnetic bead is electrically connected to a power supply pin of a circuit board, and the second end of the second magnetic bead is electrically connected to the power supply pin of the circuit board.
5 . The light emission assembly according to claim 1 , wherein a first end of the driving multiplexing pad is electrically connected to the driving chip, and a second end of the driving multiplexing pad is electrically connected to the first end of the first magnetic bead; and wherein the second end of the first magnetic bead is electrically connected to a power supply pin of a circuit board so as to provide a first voltage to the driving chip.
6 . The light emission assembly according to claim 1 , wherein a first end of the driving multiplexing pad is electrically connected to the driving chip, and a second end of the driving multiplexing pad is electrically connected to the first end of the DC blocking capacitor; and wherein the second end of the DC blocking capacitor is connected to the EML multiplexing pad, and the EML multiplexing pad is electrically connected to the EML laser chip for transmitting signals between the driving chip and the EML laser chip.
7 . The light emission assembly according to claim 1 , wherein a first end of the EML multiplexing pad is electrically connected to the EML laser chip, and a second end of the EML multiplexing pad is electrically connected to the first end of the second magnetic bead; and wherein the second end of the second magnetic bead is electrically connected to a power supply pin of a circuit board for providing a voltage to the EML laser chip.
8 . An optical module, comprising:
a circuit board; and
a light emission assembly according to claim 1 ;
wherein the light emission assembly is electrically connected to the circuit board.