Camera device having adhesive layer fixed to photosensitive element
A camera device includes a circuit board, a photosensitive element, a first adhesive layer, a lens assembly, and second adhesive layer. The photosensitive element has a photosensitive region and a non-photosensitive region around the photosensitive region. The first adhesive layer is adhesively fixed to the photosensitive element and the circuit board. The lens assembly includes a base and a lens disposed on the base, and the lens has an optical axis. The base includes a bottom wall and an extension member extending from the bottom wall. A limiting surface of the extension member overlaps the non-photosensitive region in a direction along the optical axis. The second adhesive layer has a positioning block and a limiting block. The positioning block is adhesively fixed to the bottom wall and the circuit board, and the limiting block is adhesively fixed to the limiting surface and the non-photosensitive region.
1 . A camera device comprising:
a circuit board having an assembling hole, a first surface, and a second surface opposite to the first surface, wherein the assembling hole penetrates the first surface and the second surface, and the assembling hole has an inner annular surface;
a photosensitive element in the assembling hole, wherein the photosensitive element has a front surface, a back surface, and an outer peripheral portion, the outer peripheral portion is connected between the front surface and the back surface, the front surface has a photosensitive region and a non-photosensitive region, and the non-photosensitive region is around the photosensitive region;
a first adhesive layer adhesively fixed to the outer peripheral portion of the photosensitive element and the inner annular surface of the assembling hole;
a lens assembly disposed on the first surface, wherein the lens assembly comprises a base and a lens, the lens is disposed on the base, the position of the lens corresponds to the position of the photosensitive element, and the lens has an optical axis; the base comprises a bottom wall and an extension member, the bottom wall has a bottom surface, the extension member extends from the bottom wall and has a limiting surface; the bottom surface overlaps the first surface in a direction along the optical axis, and the limiting surface overlaps the non-photosensitive region of the photosensitive element in the direction along the optical axis; and
a second adhesive layer between the base and the circuit board, wherein the second adhesive layer has a positioning block and a limiting block, the positioning block is adhesively fixed to the bottom surface of the base and the first surface of the circuit board, and the limiting block is adhesively fixed to the limiting surface of the extension member and the non-photosensitive region of the photosensitive element;
wherein the first adhesive layer is different from the second adhesive layer, the second adhesive layer is a light curing adhesive layer, and the first adhesive layer is a non-light curing adhesive layer.
2 . The camera device according to claim 1 , wherein the limiting block of the second adhesive layer is further adhesively fixed to the inner annular surface of the assembling hole and the first adhesive layer.
3 . The camera device according to claim 1 , wherein the base has an axle hole, the lens is in the axle hole, the base comprises a plurality of the extension members, the extension members are spaced apart from each other to surround the axle hole, the second adhesive layer comprises a plurality of the limiting blocks, and each of the limiting blocks is adhesively fixed to the limiting surface of a corresponding one of the extension members and the non-photosensitive region.
4 . The camera device according to claim 1 , wherein the non-photosensitive region is further divided into an adhering region and a non-adhering region, the non-adhering region is between the photosensitive region and the adhering region, and the limiting block of the second adhesive layer is adhesively fixed to the adhering region.
5 . The camera device according to claim 1 , wherein the bottom surface and the limiting surface of the base are at a same plane.
6 . The camera device according to claim 1 , wherein a thickness of the photosensitive element is less than a thickness of the circuit board, the photosensitive element is adjacent to the second surface, and the extension member further extends into the assembling hole, so that the limiting surface is in the assembling hole.
7 . The camera device according to claim 6 , wherein a first spacing is between the extension member and the inner annular surface of the assembling hole, a second spacing is between the limiting surface of the extension member and the non-photosensitive region, and the limiting block of the second adhesive layer is adhesively fixed within the first spacing and the second spacing.
8 . The camera device according to claim 7 , wherein a third spacing is between the bottom surface of the base and the first surface of the circuit board, and the positioning block of the second adhesive layer is adhesively fixed within the third spacing.
9 . The camera device according to claim 8 , wherein at least two among the first spacing, the second spacing, and the third spacing are different from each other.
10 . The camera device according to claim 9 , wherein the third spacing is greater than the first spacing and is greater than the second spacing.
11 . The camera device according to claim 9 , wherein the first spacing is less than the second spacing.