Camera module and electronic device

1 . A camera module, comprising:

an imaging lens assembly;

an image sensor disposed on an image surface of the imaging lens assembly; and

an optical plate disposed between the imaging lens assembly and an image surface of the image sensor, comprising:

a substrate having an object-side surface and an image-side surface, the object-side surface facing towards an object side, the image-side surface facing towards an image side, and the object-side surface being parallel with the image-side surface; and

at least one anti-reflection layer disposed on the image-side surface of the substrate, the at least one anti-reflection layer comprising a nanocrystal structure layer and an optical-connecting layer, wherein the nanocrystal structure layer comprises a metal oxide crystal, the optical-connecting layer connects the substrate and the nanocrystal structure layer, the nanocrystal structure layer is physically contacted with the optical-connecting layer, the optical-connecting layer is partially covered by the nanocrystal structure layer, and the nanocrystal structure layer is arranged irregularly;

wherein a material refractive index of the nanocrystal structure layer is Nc, a material refractive index of the optical-connecting layer is Nf, a height of the nanocrystal structure layer is Hc, a thickness of the optical-connecting layer is Hf, a total height of the anti-reflection layer is H, and the following conditions are satisfied:

Nf<Nc;

Hf+Hc=H ; and

Hf<Hc.

2 . The camera module of claim 1 , wherein a number of the at least one anti-reflection layer is two which are disposed on the object-side surface and the image-side surface of the substrate, respectively.

3 . The camera module of claim 1 , wherein the optical plate is a polarizer.

4 . The camera module of claim 1 , wherein an image-side optical surface of the imaging lens assembly is an optical aspheric surface, and the optical aspheric surface has at least one inflection point.

5 . The camera module of claim 1 , wherein the thickness of the optical-connecting layer is Hf, and the following condition is satisfied:

20 nm< Hf< 120 nm.

6 . The camera module of claim 5 , wherein the thickness of the optical-connecting layer is Hf, and the following condition is satisfied:

40 nm< Hf< 90 nm.

7 . The camera module of claim 1 , wherein the material refractive index of the nanocrystal structure layer is Nc, a material refractive index of the substrate is Ns, and the following condition is satisfied:

Ns<Nc.

8 . The camera module of claim 1 , wherein the height of the nanocrystal structure layer is Hc, and the following condition is satisfied:

120 nm< Hc< 350 nm.

9 . The camera module of claim 8 , wherein the height of the nanocrystal structure layer is Hc, and the following condition is satisfied:

150 nm< Hc< 300 nm.

10 . The camera module of claim 1 , wherein the substrate of the optical plate is a glass substrate.

11 . An electronic device, comprising:

the camera module of claim 1 .

12 . A camera module, comprising:

an imaging lens assembly;

an image sensor disposed on an image surface of the imaging lens assembly; and

an optical plate disposed between the imaging lens assembly and an image surface of the image sensor, comprising:

a substrate having an object-side surface and an image-side surface, the object-side surface facing towards an object side, the image-side surface facing towards an image side, the object-side surface being parallel with the image-side surface; and

at least one anti-reflection layer disposed on the object-side surface of the substrate, the at least one anti-reflection layer comprising a nanocrystal structure layer and an optical-connecting layer, wherein the nanocrystal structure layer comprises a metal oxide crystal, the optical-connecting layer connects the substrate and the nanocrystal structure layer, the nanocrystal structure layer is physically contacted with the optical-connecting layer, the optical-connecting layer is partially covered by the nanocrystal structure layer, and the nanocrystal structure layer is arranged irregularly;

wherein, a material refractive index of the nanocrystal structure layer is Nc, a material refractive index of the optical-connecting layer is Nf, a height of the nanocrystal structure layer is Hc, a thickness of the optical-connecting layer is Hf, a total height of the anti-reflection layer is H, and the following conditions are satisfied:

Nf<Nc;

Hf+Hc=H ; and

Hf<Hc.

13 . The camera module of claim 12 , wherein the optical plate is an infrared filter.

14 . The camera module of claim 12 , wherein the thickness of the optical-connecting layer is Hf, and the following condition is satisfied:

20 nm< Hf< 120 nm.

15 . The camera module of claim 14 , wherein the thickness of the optical-connecting layer is Hf, and the following condition is satisfied:

40 nm< Hf< 90 nm.

16 . The camera module of claim 12 , wherein the height of the nanocrystal structure layer is Hc, and the following condition is satisfied:

120 nm< Hc< 350 nm.

17 . The camera module of claim 16 , wherein the height of the nanocrystal structure layer is Hc, and the following condition is satisfied:

150 nm< Hc< 300 nm.

18 . The camera module of claim 12 , wherein an image-side optical surface of the imaging lens assembly is an optical aspheric surface, and the optical aspheric surface has at least one inflection point.