IP Library Granted Patent US 12677075
Granted Patent B2
US 12677075 · App. 18/514,819 · Granted Jul 7, 2026

Solid-state imaging apparatus, imaging apparatus, and distance-measuring imaging apparatus

Inventors: Makoto Ikuma (Hyogo, JP); Yutaka Abe (Osaka, JP)
Assignee: Nuvoton Technology Corporation Japan
H04N25/77G01S17/894H04N25/60H04N25/616H04N25/65H04N25/78H04N25/79H04N25/7795H10F39/809
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12677075
App. No.
18/514,819
Granted
Jul 7, 2026
Kind
B2
Abstract

A solid-state imaging apparatus includes a pixel circuit that outputs a pixel signal and a negative feedback circuit. The negative feedback circuit includes a sample and hold circuit (hereinafter “SH circuit”) that samples and holds the pixel signal, and a feedback amplifier that negatively feeds back, to the SH circuit, a feedback signal according to a difference between the pixel signal from the pixel circuit and an output signal from the SH circuit.

Claims (75)

1 . A solid-state imaging apparatus comprising:

a pixel circuit that outputs a pixel signal, the pixel signal comprising both reset and signal components, the reset component being due to a reset of a charge storage of the pixel circuit and the signal component being due to imaging of a photodiode of the pixel circuit; and

a negative feedback circuit, wherein

the negative feedback circuit includes:

a sample and hold circuit (hereinafter “SH circuit”) that samples and holds the pixel signal; and

a feedback amplifier that negatively feeds back, to the SH circuit, a feedback signal according to a difference between the pixel signal from the pixel circuit and an output signal from the SH circuit,

the SH circuit includes:

a SH subcircuit that samples and holds the pixel signal; and

an amplification transistor that amplifies and outputs, to the feedback amplifier, an output signal of the SH subcircuit,

the SH subcircuit includes:

a first sample and hold switching element for sampling the feedback signal; and

a first capacitive element connected to the first sample and hold switching element,

the pixel signal from the pixel circuit is input into a positive input terminal of the feedback amplifier,

the feedback signal from the feedback amplifier is input into the first sample and hold switching element,

the output signal from the amplification transistor is input into a negative input terminal of the feedback amplifier,

the feedback amplifier, the SH subcircuit, and the amplification transistor form a feedback loop, and

the negative feedback circuit further includes:

a second capacitive element connected to, among two terminals of the first sample and hold switching element, a terminal into which the feedback signal is input; and

a third capacitive element connected in parallel to the first sample and hold switching element.

2 . The solid-state imaging apparatus according to claim 1 , wherein

the SH subcircuit includes a first readout selection switching element that connects the first capacitive element and the amplification transistor.

3 . The solid-state imaging apparatus according to claim 1 , wherein

the pixel circuit outputs a plurality of pixel signals each of which is the pixel signal, and

the SH circuit includes a plurality of SH subcircuits corresponding to the plurality of pixel signals, each of the plurality of SH subcircuits being the SH subcircuit.

4 . The solid-state imaging apparatus according to claim 3 , wherein

the plurality of pixel signals include a first pixel signal, a second pixel signal, and a third pixel signal with mutually different exposure sensitivities, and

the plurality of SH subcircuits include a first SH subcircuit, a second SH subcircuit, and a third SH subcircuit.

5 . The solid-state imaging apparatus according to claim 3 , wherein

by connecting first capacitive elements in two or more SH subcircuits among the plurality of SH subcircuits in parallel, corresponding pixel signals among the plurality of pixel signals are mixed.

6 . The solid-state imaging apparatus according to claim 3 , wherein

the negative feedback circuit includes a switching circuit that switches between implementing and not implementing negative feedback in a sample and hold operation, and

among the plurality of pixel signals, negative feedback is implemented for at least one pixel signal and not implemented for other pixel signals.

7 . The solid-state imaging apparatus according to claim 3 , wherein

the feedback amplifier includes a gain switching function, and

in the negative feedback circuit, a gain of the feedback amplifier is set per pixel signal among the plurality of pixel signals.

8 . The solid-state imaging apparatus according to claim 3 , wherein

a capacitance value of the first capacitive element varies among the plurality of SH subcircuits according to a corresponding pixel signal among the plurality of pixel signals.

9 . The solid-state imaging apparatus according to claim 1 , wherein

the pixel circuit comprises a plurality of pixel circuits and the SH circuit comprises a plurality of SH circuits, and

the feedback amplifier is shared by two or more SH circuits among the plurality of SH circuits.

10 . The solid-state imaging apparatus according to claim 9 , wherein

the plurality of pixel circuits are arranged in a matrix,

the plurality of SH circuits are arranged in a matrix,

the plurality of pixel circuits and the plurality of SH circuits are arranged in a one-to-one stacked arrangement, and

in plan view, the feedback amplifier is interposed between the plurality of SH circuits.

11 . The solid-state imaging apparatus according to claim 1 , wherein

the SH subcircuit further includes:

a second sample and hold switching element for sampling the feedback signal; and

a fourth capacitive element connected to the second sample and hold switching element,

the first capacitive element holds the reset component, and

the fourth capacitive element holds the signal component.

12 . The solid-state imaging apparatus according to claim 11 , wherein

the SH subcircuit further includes:

a first readout selection switching element that connects the first capacitive element and the amplification transistor, and

a second readout selection switching element that connects the fourth capacitive element and the amplification transistor.

13 . The solid-state imaging apparatus according to claim 1 , wherein

the first sample and hold switching element transitions from on to off according to a control signal including a sloped voltage waveform.

14 . The solid-state imaging apparatus according to claim 13 , wherein

the negative feedback circuit includes:

a measurement unit configured to measure a noise level of the first capacitive element in the SH circuit; and

a determination unit configured to determine an incline of the sloped voltage waveform that decreases the noise level measured.

15 . The solid-state imaging apparatus according to claim 1 , wherein

the negative feedback circuit includes, in the feedback loop, a third sample and hold switching element inserted between an output terminal of the feedback amplifier and an input terminal of the first sample and hold switching element, and

the third sample and hold switching element transitions from on to off according to a control signal including a sloped voltage waveform.

16 . The solid-state imaging apparatus according to claim 1 , wherein

the pixel circuit includes an output transistor that outputs the pixel signal, and

a size of the amplification transistor is greater than a size of the output transistor.

17 . An imaging apparatus comprising:

the solid-state imaging apparatus according to claim 1 that captures an image of a subject;

an imaging optical system that guides incident light from the subject to the solid-state imaging apparatus; and

a signal processor that processes an output signal from the solid-state imaging apparatus.

18 . A distance-measuring imaging apparatus comprising:

the solid-state imaging apparatus according to claim 1 that captures reflected light from a target irradiated with pulsed light;

an imaging optical system that guides the reflected light from the target to the solid-state imaging apparatus; and

a signal processor that processes an output signal from the solid-state imaging apparatus.