IP Library Granted Patent US 12677097
Granted Patent B2
US 12677097 · App. 18/783,993 · Granted Jul 7, 2026

Transducer including piezoelectric element and method of producing same

Inventors: Ryo Ito (Fukushima, JP); Heishiro Fudo (Miyagi, JP)
Assignee: ALPS ALPINE CO., LTD.
H04R7/04H04R7/16H04R17/00H04R31/003
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Quick Facts
Patent No.
US 12677097
App. No.
18/783,993
Filed
Jul 25, 2024
Granted
Jul 7, 2026
Kind
B2
Art Unit
2694
USPC
381/190
Abstract

A transducer includes a flexible substrate, a piezoelectric element formed on a surface of the flexible substrate, and a support member, in which holes are formed, having a higher rigidity than the flexible substrate. The surface of the flexible substrate has an element region in which the piezoelectric element is continuous in a planar direction of the piezoelectric element. The support member is stacked to the flexible substrate in a manner such that the holes face the element region. The flexible substrate is freely movable in each of the holes, and a region of the flexible substrate corresponding to a region other than the holes of the support member is fixed to the support member.

Claims (24)

1 . A transducer, comprising:

a flexible substrate;

a piezoelectric element formed on a surface of the flexible substrate, the surface of the flexible substrate having an element region in which the piezoelectric element is continuous in a planar direction of the piezoelectric element; and

a support member, in which holes are formed, having a higher rigidity than the flexible substrate, the support member being stacked to the flexible substrate in a manner such that the holes face the element region,

wherein

the flexible substrate is freely movable in each of the holes, and a region of the flexible substrate corresponding to a region other than the holes of the support member is fixed to the support member.

2 . The transducer according to claim 1 ,

wherein inner diameters of the holes facing the element region are identical.

3 . The transducer according to claim 1 , further comprising another support member to include two support members,

wherein the two support members are stacked to both surfaces of the flexible substrate, respectively, in a state in which a center of each of the holes of one of the two support members matches with a center of each of the holes of the other support member, and a region of each of the two support members where the holes are not formed is fixed to the corresponding surface of the flexible substrate.

4 . The transducer according to claim 1 ,

wherein the support member stacked to the element region is curved.

5 . A method of producing a transducer, the method comprising:

forming an element region, in which a piezoelectric element is continuous in a planar direction, on a surface of a flexible substrate;

forming a support member, in which holes are formed, using a material having a rigidity higher than the flexible substrate; and

stacking the flexible substrate to the support member in a manner such that the holes face the element region, allowing the flexible substrate to freely move in the holes, and fixing a region of the flexible substrate, which corresponds to a region other than the holes of the support member, to the support member, to produce the transducer including the flexible substrate, and the piezoelectric element formed on the surface of the flexible substrate.

6 . The method according to claim 5 ,

wherein the forming of the element region includes stacking a lower electrode layer, a piezoelectric material layer, and an upper electrode layer on the surface of the flexible substrate in order of the lower electrode layer, the piezoelectric material layer, and the upper electrode layer.

7 . The method according to claim 5 ,

wherein the forming of the element region includes

disposing a lower electrode layer to a lower surface of a piezoelectric material layer including a polymer piezoelectric material, and disposing an upper electrode layer to an upper surface of the piezoelectric material layer to form the piezoelectric element, and

fixing the piezoelectric element to the surface of the flexible substrate.

8 . The method according to claim 5 , further comprising

curving the support member before or after the stacking the flexible substrate to the support member.