Wiring sheet
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C. of the cured product layer is in a range from 5.0×10 6 Pa to 1.0×10 10 Pa.
1 . A wiring sheet comprising:
a sheet structure comprising a plurality of conductive linear bodies arranged at intervals;
a cured product layer supporting the sheet structure; and
a pair of electrodes in direct contact with the conductive linear bodies, wherein
the cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C. of the cured product layer is in a range from 5.0×10 6 Pa to 1.0×10 10 Pa.
2 . The wiring sheet according to claim 1 , wherein
the conductive linear bodies comprise a metal wire.
3 . The wiring sheet according to claim 2 , wherein
the metal wire is formed from a single species of metal.
4 . The wiring sheet according to claim 1 , wherein
the electrodes are metallic foil having a thickness of 40 μm or less or a metal wire.
5 . The wiring sheet according to claim 1 , wherein
a thickness of the cured product layer is smaller than a diameter of the conductive linear bodies.
6 . The wiring sheet according to claim 1 , wherein
the cured product layer contains no filler.
7 . The wiring sheet according to claim 1 , further comprising a base material on a side of the cured product layer on which the electrodes are not provided.
8 . The wiring sheet according to claim 1 , wherein each of the plurality of conductive linear bodies is linear-shaped in a plan view of the wiring sheet.
9 . The wiring sheet according to claim 1 , wherein each of the plurality of conductive linear bodies is linear-shaped in a plan view of the wiring sheet when the wiring sheet is formed.
10 . The wiring sheet according to claim 1 , wherein the storage modulus at 23 degrees C. of the cured product layer is in a range from 1.0×10 7 Pa to 1.0×10 9 Pa.
11 . The wiring sheet according to claim 1 , wherein a diameter of each of the conductive linear bodies is in a range from 5 μm to 75 μm.