IP Library › Granted Patent US 12677375
Granted Patent B2
US 12677375 · App. 17/550,746 · Granted Jul 7, 2026

Stepped package and recessed circuit board

Inventors: Martin M. Chang (Beaverton, OR); Tin Poay Chuah (Bayan Baru, MY); Eng Huat Goh (Ayer Itam, MY); Chu Aun Lim (Hillsboro, OR); Min Suet Lim (Gelugor, MY)
Assignee: Intel Corporation
H05K1/183H05K1/0298H05K1/113H05K1/141H05K3/303H05K2201/09036H05K2201/09072H05K2201/10007H05K2201/10628H05K2201/10719H05K2201/10734H05K2203/041
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Quick Facts
Patent No.
US 12677375
App. No.
17/550,746
Granted
Jul 7, 2026
Kind
B2
Abstract

An apparatus comprising a package comprising a first side to interface with at least one chip; and a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises a non-stepped portion comprising a first plurality of conductive contacts; and a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts.

Claims (29)

1 . An apparatus comprising:

a package comprising:

a first side to interface with at least one chip; and

a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises:

a non-stepped portion comprising a first plurality of conductive contacts; and

a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts;

wherein the package is to interface with a circuit board, wherein the circuit board comprises a non-recessed portion to interface with the non-stepped portion of the second side of the package; and a recessed portion to interface with the stepped portion of the second side of the package, wherein the circuit board comprises an electronic component on the non-recessed portion, wherein the electronic component is coupled to a plated through hole via, wherein the plated through hole via is to electrically conductively couple to a solder ball on the stepped portion of the package.

2 . The apparatus of claim 1 , wherein the non-stepped portion comprises a first plurality of solder balls coupled to the first plurality of conductive contacts, wherein the stepped portion comprises a second plurality of solder balls coupled to the second plurality of conductive contacts.

3 . The apparatus of claim 2 , wherein the second plurality of solder balls have a height that is larger than a height of the first plurality of solder balls.

4 . The apparatus of claim 1 , the second side further comprising a second stepped portion that protrudes from the stepped portion, the second stepped portion comprising a third plurality of conductive contacts.

5 . The apparatus of claim 4 , wherein the second stepped portion is to interface with a second package through an aperture of the circuit board.

6 . The apparatus of claim 1 , wherein the first plurality of conductive contacts and the second plurality of conductive contacts are arranged in a grid array.

7 . The apparatus of claim 1 , wherein the package comprises a chip coupled to the first side of the package.

8 . The apparatus of claim 1 , wherein the non-stepped portion surrounds the stepped portion.

9 . The apparatus of claim 1 , further comprising the circuit board, the circuit board comprising:

a non-recessed portion to interface with the non-stepped portion of the second side of the package; and

a recessed portion to interface with the stepped portion of the second side of the package.

10 . The apparatus of claim 9 , wherein the circuit board comprises an aperture within the recessed portion, wherein the apparatus comprises a second package coupled to the package through the aperture.

11 . The apparatus of claim 10 , wherein the second package comprises a side with a non-stepped portion and a stepped portion, wherein the stepped portion of the second package is coupled to the package through the aperture.

12 . The apparatus of claim 1 , wherein the package comprises a chip comprising a processor.

13 . The apparatus of claim 12 , further comprising a battery communicatively coupled to the processor, a display communicatively coupled to the processor, or a network interface communicatively coupled to the processor.

14 . The apparatus of claim 1 , wherein the electronic component comprises a voltage regulator, wherein a power signal of the voltage regulator is to electrically conductively couple to the at least one chip through an interconnect of a conductive layer of the circuit board and a solder ball on the stepped portion of the package.

15 . An apparatus comprising: a circuit board to interface with a package, the package comprising: a first side to interface with at least one chip; and a second side to interface with the circuit board, the second side opposite to the first side, wherein the second side comprises: a non-stepped portion comprising a first plurality of conductive contacts; and a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts; wherein the circuit board comprises a non-recessed portion to interface with the non-stepped portion of the second side of the package; and a recessed portion to interface with the stepped portion of the second side of the package, wherein the circuit board comprises an electronic component on the non-recessed portion, wherein the electronic component is coupled to a plated through hole via, wherein the plated through hole via is to electrically conductively couple to a solder ball on the stepped portion of the package.

16 . A method comprising forming a package, wherein the package comprises:

a first side to interface with at least one chip; and

a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises:

a non-stepped portion comprising a first plurality of conductive contacts; and

a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts;

wherein the package is to interface with a circuit board, wherein the circuit board comprises a non-recessed portion to interface with the non-stepped portion of the second side of the package; and a recessed portion to interface with the stepped portion of the second side of the package, wherein the circuit board comprises an electronic component on the non-recessed portion, wherein the electronic component is coupled to a plated through hole via, wherein the plated through hole via is to electrically conductively couple to a solder ball on the stepped portion of the package.