Adhesive composition, thermosetting adhesive sheet, and printed wiring board
An adhesive composition has a low dielectric constant, a low dielectric loss tangent, and an excellent folding endurance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 30%.
1 . An adhesive composition, comprising: with respect to the total of 100 parts by mass of the adhesive composition,
75 to 90 parts by mass of a styrene elastomer,
3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and
totally more than 0 parts by mass and no more than 10 parts by mass of both a liquid epoxy resin and an epoxy resin curing agent,
wherein the styrene ratio of the styrene elastomer is less than 30%, and
wherein the glass transition temperature after curing is-40 to 40° C.
2 . The adhesive composition according to claim 1 , wherein the styrene ratio of the styrene elastomer is 5 to 25%.
3 . The adhesive composition according to claim 2 , wherein the styrene elastomer has a weight average molecular weight of 100,000 or more.
4 . The adhesive composition according to claim 2 , wherein the content of the modified polyphenyleneether resin is 5 to 20 parts by mass.
5 . The adhesive composition according to claim 2 , wherein the modified polyphenyleneether resin has at least one of an epoxy group and an ethylenically unsaturated bond at an end.
6 . The adhesive composition according to claim 1 , wherein the styrene elastomer has a weight average molecular weight of 100,000 or more.
7 . The adhesive composition according to claim 6 , wherein the content of the modified polyphenyleneether resin is 5 to 20 parts by mass.
8 . The adhesive composition according to claim 6 , wherein the modified polyphenyleneether resin has at least one of an epoxy group and an ethylenically unsaturated bond at an end.
9 . The adhesive composition according to claim 1 , wherein the content of the modified polyphenyleneether resin is 5 to 20 parts by mass.
10 . The adhesive composition according to claim 1 , wherein the modified polyphenyleneether resin has at least one of an epoxy group and an ethylenically unsaturated bond at an end.
11 . The adhesive composition according to claim 1 , wherein the adhesive composition comprises 0.01 mass % or less of peroxide.
12 . The adhesive composition according to claim 1 , wherein the epoxy resin curing agent is a latent epoxy resin curing agent.
13 . A thermosetting adhesive sheet comprising a base material and a thermosetting adhesive layer formed on the base material and composed of the adhesive composition according to claim 1 formed on the base material.
14 . A printed wiring board comprising: a wiring resin substrate having a base material and a wiring pattern; and a cover lay laminated on the wiring pattern of the resin substrate via a cured product of the adhesive composition according to claim 1 .
15 . The printed wiring board according to claim 14 , wherein the base material is a liquid crystal polymer film.