Methods for promoting selective copper foil adhesion in a printed circuit board
A method of fabricating a printed circuit board (PCB) including selectively etching copper foil at mapped areas corresponding to predefined radio-frequency (RF) signal performance of a device, for instance an active electrically scanned array (AESA). In embodiments, first and second RF performance areas of a device are mapped, the copper foil is etched at surface portions corresponding to the first RF performance areas to increase surface roughness, and the copper foil is bonded to a substate such that etched portions are aligned with the first RF performance areas of the PCB. In embodiments, the signal performance in the first RF performance areas is greater than the signal performance in the second RF performance areas.
1 . A method of manufacturing a printed circuit board (PCB), the method comprising:
providing a substrate;
providing a copper foil having a surface configured to be bonded to the substrate;
mapping, on the substrate, at least one first radio-frequency (RF) performance area of the PCB, and at least one second RF performance area of the PCB different from the at least one first RF performance area of the PCB;
mapping, on the surface of the copper foil, the at least one first RF performance area of the PCB and the at least one second RF performance area of the PCB;
etching, by an etching process, the surface of the copper foil corresponding to the mapped at least one first RF performance area of the PCB, wherein, after subjecting the surface of the copper foil to the etching process, the etched surface corresponding to the first RF performance area has a greater surface roughness than the surface of the copper foil corresponding to the second RF performance area;
positioning the copper foil relative to the substrate such that the etched surface is aligned with the mapped at least one first RF performance area of the substrate; and
bonding the surface of the copper foil to the substrate.
2 . The method according to claim 1 , wherein:
the at least one second RF performance area of the PCB comprises a plurality of separate areas; and
the first RF performance area of the PCB comprises a continuous area positioned in surrounding relation to the plurality of separate areas.
3 . The method according to claim 1 , wherein:
the at least one second RF performance area of the PCB comprises a plurality of separate areas;
the first RF performance area of the PCB comprises a plurality of separate areas; and
at least one of the first RF performance areas surrounds at least one of the second RF performance areas.
4 . The method according to claim 1 , wherein signal performance in the at least one second RF performance area of the PCB is greater than signal performance in the at least one first RF performance area of the PCB.
5 . The method according to claim 1 , wherein the etching process comprises at least one of an etchant and an oxide treatment process.
6 . The method according to claim 1 , wherein the etching process comprises laser texturing.
7 . The method according to claim 1 , wherein the method further comprises, prior to etching the surface of the copper foil by the etching process, releasably bonding an opposing surface of the copper foil to a copper carrier using a release layer.
8 . The method according to claim 1 , wherein the surface of the copper foil is adhesively bonded to the substrate.
9 . A method for selectively etching a surface of a copper foil configured to be bonded to a substrate of a printed circuit board (PCB), the method comprising:
providing a copper foil having a surface;
providing a configuration for a PCB having at least one first area corresponding to a first radio-frequency (RF) performance, and at least one second area corresponding to a second RF performance different from the first RF performance, wherein signal performance of the second RF performance is greater than signal performance of the first RF performance;
mapping, on the surface of the copper foil, the at least one area corresponding to the first RF performance; and
etching, by an etching process, the mapped surface of the copper foil corresponding to the first RF performance.
10 . The method according to claim 9 , wherein the surface of the copper foil corresponding to the at least one second RF performance is not etched by the etching process.
11 . The method according to claim 10 , wherein, after the etching process is complete, surface roughness of the surface of the copper foil is greater in the at least one area corresponding to the first RF performance than in the at least one area corresponding to the second RF performance.
12 . The method according to claim 9 , wherein the etching process comprises at least one of an etchant and an oxide treatment process.
13 . The method according to claim 9 , wherein the etching process comprises laser texturing.
14 . The method according to claim 9 , wherein the method further comprises, prior to etching the surface of the copper foil by the etching process, releasably bonding an opposing surface of the copper foil to a copper carrier using a release layer.
15 . The method according to claim 9 , wherein the at least one area corresponding to the first RF performance substantially surrounds the at least one area corresponding to the second RF performance.